Abstract:
A driver impedance control apparatus and system for determining the impedance of at least one driver are provided. The driver impedance control apparatus includes a first reference impedance, a second reference impedance, a dummy pull-up array, a dummy pull-down array, a pull-up array control unit and a pull-down array control unit. The pull-up array control unit controls the pull-up impedance of the driver by detecting a voltage from a first voltage divide point between the first reference impedance and the dummy pull-up array. The pull-down array control unit controls the pull-down impedance of the driver by detecting a voltage from a second voltage divide point between the second reference impedance and the dummy pull-down array.
Abstract:
A power-rail ESD (electrostatic discharge) protection circuit with a dual trigger design is proposed, which is coupled between a first power line and a second power line connected to an IC device for protecting the IC device against ESD on the first power line and the second power line. The proposed power-rail ESD protection circuit comprises a control circuit and at least one MOS device. The control circuit is coupled between the first power line and the second power line, and which is capable of, in the event of ESD in the first power line and the second power line, being triggered by the ESD to output a substrate-triggering voltage and a gate-driving voltage to the MOS device, causing the MOS device to bypass the ESD current from the first power line and the second power line. The circuit configuration of the proposed power-rail ESD protection circuit can help reduce the junction breakdown voltage in a MOS device and increase in ESD robustness.
Abstract:
An electrostatic discharge (ESD) protection circuit for protecting input and output buffers. The ESD protection circuit is driven by a first voltage source and a second voltage source and coupled to a bonding pad. The ESD protection circuit has a first resistor, a first PMOS transistor, a first NMOS transistor, a first diode series, a second PMOS transistor, a second resistor, a third PMOS transistor, a second NMOS transistor, a second diode series and a third NMOS transistor. The electrical devices combine to form different types of ESD protection circuits, each capable of protecting the input buffer or output buffer against the damaging effects of an electrostatic discharge.
Abstract:
A buffer device includes a first driving circuit coupled between a signal terminal of the buffer device and a first reference potential, a current-limiting component including a first terminal coupled to the signal terminal, and a second driving circuit coupled between a second terminal of the current-limiting component and a second reference potential, wherein the current-limiting component limits an amount of ESD current flowing through the second driving circuit, and makes an amount of ESD current flowing through the first driving circuit be larger than the amount of ESD current flowing through the second driving circuit.
Abstract:
A driver impedance control apparatus and system for determining the impedance of at least one driver are provided. The driver impedance control apparatus includes a first reference impedance, a second reference impedance, a dummy pull-up array, a dummy pull-down array, a pull-up array control unit and a pull-down array control unit. The pull-up array control unit controls the pull-up impedance of the driver by detecting a voltage from a first voltage divide point between the first reference impedance and the dummy pull-up array. The pull-down array control unit controls the pull-down impedance of the driver by detecting a voltage from a second voltage divide point between the second reference impedance and the dummy pull-down array.
Abstract:
A power supply clamp circuit for preventing damage to an integrated circuit due to electrostatic discharge. The power supply clamp circuit includes a voltage generator electrically connected to a first node for generating a voltage; a first PMOS transistor having a source electrically connected to the first voltage source, a gate electrically connected to the first node, and a drain electrically connected to a second node; a first NMOS transistor having a drain electrically connected to the second node, a gate electrically connected to the first node, and a source connected to ground; a second NMOS transistor having a drain electrically connected to the first voltage source, a gate electrically connected to the second node, and a source connected to ground; and a second PMOS transistor having a source electrically connected to the second node, a gate and a drain commonly electrically connected to the first node.
Abstract:
A bond pad structure of an integrated circuit includes a conductive pad disposed on a first dielectric layer, a first conductive block formed in a second dielectric layer below the first dielectric layer and electrically connected to the conductive pad through a first via plug formed in the first dielectric layer, and an electrically floating first conductive plate situated under the conductive pad.
Abstract:
A poly fuse trimming circuit. The poly fuse trimming circuit comprises a poly fuse and a silicon controlled rectifier (SCR) device. The poly fuse is coupled between a first fixed potential and an output node. The SCR device is controlled by a trimming signal and has an anode coupled to the output node and a cathode coupled to a second fixed potential.
Abstract:
An ESD protection circuit, arranged between a first and second potential terminals, has a RC branch, a voltage adjuster circuit, and an ESD discharge transistor. The RC branch includes a resistor and a capacitor series connected from the first to the second potential terminal. The voltage adjuster circuit has a plurality of inputs connected to the RC branch, and the first and second potential terminals, and an output connected to a gate of the ESD discharge transistor to adjust the gate voltage thereof for obtaining a uniform turn on and optimal ESD robustness. The voltage adjuster circuit mainly includes a plurality of transistors that enable to effectively adjust the gate voltage with respect to high level of ESD stress.
Abstract:
An ESD protection circuit for Mixed-Voltage I/O by using stacked NMOS transistors with substrate triggering technique is disclosed. The ESD protection circuit contains a set of stacked NMOS transistors with a first NMOS transistor and a second NMOS transistor, a parasitic lateral bipolar transistor, a substrate current generating circuit, and a parasitic substrate resistor. The drain of the first NMOS transistor connects to an I/O pad. The gate of the first NMOS transistor connects to a first working voltage. The source of the first NMOS transistor connects to the drain of the second NMOS transistor. The gate of the second NMOS transistor connects to an internal circuit. The source of the second NMOS transistor connects to a second working voltage. The collector of the parasitic lateral bipolar transistor connects to the drain of the first NMOS transistor and its emitter connects to the source of the second NMOS transistor. A first terminal of the substrate current generating circuit connects to the I/O pad, a second terminal connects to the second working voltage, and a third terminal connects to the substrate of the lateral bipolar transistor, so that a triggering current is sent out of the third terminal when the voltage at the I/O pad is over a predetermined value. One end of the parasitic substrate resistor connects to the base of the bipolar transistor and the other end connects to the second working voltage, using the triggering current to generate a bias for the bipolar transistor. During ESD-stress condition, such ESD protection circuit can be quickly triggered on to discharge ESD current. During IC normal circuit operating condition, such ESD protection circuit is kept off.