-
公开(公告)号:US20180248477A1
公开(公告)日:2018-08-30
申请号:US15958415
申请日:2018-04-20
Applicant: Chirp Microsystems, Inc.
Inventor: Mitchell Kline , Richard Przybyla , David Horsley
CPC classification number: H02M3/07 , B06B1/0207 , H02M1/08 , H02M1/36 , H02M7/483 , H02M2001/0048 , H02M2001/007 , Y02B70/1491
Abstract: An ultrasound transducer may be driven by a driver circuit having one or more charge pumps and a multi-level inverter. The one or more charge pumps are configured to drive the ultrasound transducer only during output transitions of the inverter.
-
公开(公告)号:US20170194934A1
公开(公告)日:2017-07-06
申请号:US15342719
申请日:2016-11-03
Applicant: Chirp Microsystems, Inc.
Inventor: Stefon Shelton , Andre Guedes , Richard Przybyla , Meng-Hsiung Kiang , David Horsley
Abstract: A transducer includes first and second piezoelectric layers made of corresponding different first and second piezoelectric materials and three or more electrodes, implemented in two or more conductive electrode layers. The first piezoelectric layer is sandwiched between a first pair of electrodes and the second piezoelectric layer is sandwiched between a second pair of electrodes. The first and second pairs of electrodes contain no more than one electrode that is common to both pairs.
-
公开(公告)号:US20200266798A1
公开(公告)日:2020-08-20
申请号:US16794099
申请日:2020-02-18
Applicant: Chirp Microsystems, Inc.
Inventor: Stefon Shelton , Andre Guedes , Richard Przybyla , Meng-Hsiung Kiang , David Horsley
Abstract: A transducer includes first and second piezoelectric layers made of corresponding different first and second piezoelectric materials and three or more electrodes, implemented in two or more conductive electrode layers. The first piezoelectric layer is sandwiched between a first pair of electrodes and the second piezoelectric layer is sandwiched between a second pair of electrodes. The first and second pairs of electrodes contain no more than one electrode that is common to both pairs.
-
公开(公告)号:US10700792B2
公开(公告)日:2020-06-30
申请号:US15920300
申请日:2018-03-13
Applicant: Chirp Microsystems, Inc.
Inventor: Richard Przybyla , Mitchell Kline , David Horsley
IPC: H04L29/00 , H04B11/00 , B06B1/02 , G01S7/523 , G06F8/65 , H04L9/08 , H04L9/30 , H04L29/08 , H04W12/02 , H04L27/34 , H04W88/02
Abstract: An ultrasonic transceiver system includes a transmitter block, a receiver block, a state machine, a computer unit. The transmitter block contains circuitry configured to drive an ultrasound transducer. The receiver block contains circuitry configured to receive signals from the ultrasound transducer and convert the signals into digital data. The state machine is coupled to the transmitter and receiver blocks and contains circuitry configured to act as a controller for those blocks. The computing unit is coupled to the transmitter block, the receiver block, and the state machine and is configured to drive the transmitter block and process data received from the receiver block by executing instructions of a program. The program memory is coupled to the computing unit and is configured to store the program. The computing unit is configured to be reprogrammed with one or more additional programs stored in the program memory.
-
公开(公告)号:US20170236506A1
公开(公告)日:2017-08-17
申请号:US15583861
申请日:2017-05-01
Applicant: Chirp Microsystems, Inc.
Inventor: Richard Przybyla , Andre Guedes , Stefon Shelton , Meng-Hsiung Kiang , David Horsley
CPC classification number: G10K11/002 , G01S7/521 , G01S15/10 , G10K11/346 , H04R3/04 , H04R17/00 , H04R29/002 , H04R29/005 , H04R2201/003 , H04R2217/03
Abstract: A system and method use an array of ultrasonic transducers to emit and receive sound in a phased array fashion by using acoustic waveguides to achieve a desired acoustic radiation and reception pattern. A chip package attached to an acoustic transducer array includes acoustic waveguides coupled to acoustic ports. Each waveguide is coupled between a corresponding acoustic transducer and a corresponding acoustic port. A spacing of a pair of acoustic ports is different than a spacing of a corresponding pair of acoustic transducers.
-
公开(公告)号:US20200328821A1
公开(公告)日:2020-10-15
申请号:US16908240
申请日:2020-06-22
Applicant: Chirp Microsystems, Inc.
Inventor: Richard Przybyla , Mitchell Kline , David Horsley
Abstract: An ultrasonic transceiver system includes a transmitter block, a receiver block, a state machine, a computer unit. The transmitter block contains circuitry configured to drive an ultrasound transducer. The receiver block contains circuitry configured to receive signals from the ultrasound transducer and convert the signals into digital data. The state machine is coupled to the transmitter and receiver blocks and contains circuitry configured to act as a controller for those blocks. The computing unit is coupled to the transmitter block, the receiver block, and the state machine and is configured to drive the transmitter block and process data received from the receiver block by executing instructions of a program. The program memory is coupled to the computing unit and is configured to store the program. The computing unit is configured to be reprogrammed with one or more additional programs stored in the program memory.
-
公开(公告)号:US20180268796A1
公开(公告)日:2018-09-20
申请号:US15987824
申请日:2018-05-23
Applicant: Chirp Microsystems, Inc.
Inventor: Stefon Shelton , Andre Guedes , David Horsley
Abstract: A package design for a micromachined ultrasound transducer (MUT) utilizing curved geometry to control the presence and frequency of acoustic resonant modes is described. The approach consists of reducing in number and curving the reflecting surfaces present in the package cavity to adjust the acoustic resonant frequencies to locations outside the band of interest. The design includes a cavity characterized by a curved geometry and a MUT mounted to a side of a substrate facing the cavity with a sound emitting portion of the MUT facing an opening in the substrate. The substrate is disposed over an opening of the cavity with the substrate oriented such that the MUT located within the cavity.
-
公开(公告)号:US11005025B1
公开(公告)日:2021-05-11
申请号:US15625421
申请日:2017-06-16
Applicant: Chirp Microsystems, Inc.
Inventor: David Horsley , Andre Guedes , Stefon Shelton , Richard Przybyla , Meng-Hsiung Kiang
IPC: H01L41/04 , H01L41/047 , H01L41/053 , H01L41/18 , H01L41/31 , H01L41/253 , H01L41/29 , B06B1/06
Abstract: A piezoelectric micromachined ultrasonic transducer (pMUT) device may include a piezoelectric membrane transducer designed to have lower sensitivity to residual stress and reduced sensitivity to geometric variations arising from the backside etching process used to release the membrane. These designs allow some of its key feature to be adjusted to achieve desired characteristics, such as pressure sensitivity, natural frequency, stress sensitivity, and bandwidth.
-
公开(公告)号:US10944320B2
公开(公告)日:2021-03-09
申请号:US15958415
申请日:2018-04-20
Applicant: Chirp Microsystems, Inc.
Inventor: Mitchell Kline , Richard Przybyla , David Horsley
Abstract: An ultrasound transducer may be driven by a driver circuit having one or more charge pumps and a multi-level inverter. The one or more charge pumps are configured to drive the ultrasound transducer only during output transitions of the inverter.
-
公开(公告)号:US10712444B1
公开(公告)日:2020-07-14
申请号:US16165890
申请日:2018-10-19
Applicant: Chirp Microsystems, Inc.
Inventor: Mitchell Kline , David Horsley , Richard J. Przybyla
Abstract: An ultrasonic input includes two or more ultrasonic transceiver units having transducers separated from each other by a predetermined spacing and a processor coupled to the transceiver units. In some implementations one unit transmits while two receive and in other implementations one unit transmits and receives while the other just receives. The transmitter sends an ultrasonic pulse and first and second receivers receive echoes of the ultrasonic pulse from an object. The processor and/or transceiver units use first and second receive signals to determine first and second time-of-flight (ToF) measurements corresponding to times between transmitting an ultrasonic pulse and receiving an echo of the ultrasonic pulse.
-
-
-
-
-
-
-
-
-