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公开(公告)号：US20200266798A1
公开(公告)日：2020-08-20
申请号：US16794099
申请日：2020-02-18
Applicant: Chirp Microsystems, Inc.
Inventor： Stefon Shelton , Andre Guedes , Richard Przybyla , Meng-Hsiung Kiang , David Horsley
Abstract: A transducer includes first and second piezoelectric layers made of corresponding different first and second piezoelectric materials and three or more electrodes, implemented in two or more conductive electrode layers. The first piezoelectric layer is sandwiched between a first pair of electrodes and the second piezoelectric layer is sandwiched between a second pair of electrodes. The first and second pairs of electrodes contain no more than one electrode that is common to both pairs.
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公开(公告)号：US20170236506A1
公开(公告)日：2017-08-17
申请号：US15583861
申请日：2017-05-01
Applicant: Chirp Microsystems, Inc.
Inventor： Richard Przybyla , Andre Guedes , Stefon Shelton , Meng-Hsiung Kiang , David Horsley
CPC classification number: G10K11/002 , G01S7/521 , G01S15/10 , G10K11/346 , H04R3/04 , H04R17/00 , H04R29/002 , H04R29/005 , H04R2201/003 , H04R2217/03
Abstract: A system and method use an array of ultrasonic transducers to emit and receive sound in a phased array fashion by using acoustic waveguides to achieve a desired acoustic radiation and reception pattern. A chip package attached to an acoustic transducer array includes acoustic waveguides coupled to acoustic ports. Each waveguide is coupled between a corresponding acoustic transducer and a corresponding acoustic port. A spacing of a pair of acoustic ports is different than a spacing of a corresponding pair of acoustic transducers.
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公开(公告)号：US20170194934A1
公开(公告)日：2017-07-06
申请号：US15342719
申请日：2016-11-03
Applicant: Chirp Microsystems, Inc.
Inventor： Stefon Shelton , Andre Guedes , Richard Przybyla , Meng-Hsiung Kiang , David Horsley
Abstract: A transducer includes first and second piezoelectric layers made of corresponding different first and second piezoelectric materials and three or more electrodes, implemented in two or more conductive electrode layers. The first piezoelectric layer is sandwiched between a first pair of electrodes and the second piezoelectric layer is sandwiched between a second pair of electrodes. The first and second pairs of electrodes contain no more than one electrode that is common to both pairs.
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公开(公告)号：US11005025B1
公开(公告)日：2021-05-11
申请号：US15625421
申请日：2017-06-16
Applicant: Chirp Microsystems, Inc.
Inventor： David Horsley , Andre Guedes , Stefon Shelton , Richard Przybyla , Meng-Hsiung Kiang
IPC: H01L41/04 , H01L41/047 , H01L41/053 , H01L41/18 , H01L41/31 , H01L41/253 , H01L41/29 , B06B1/06
Abstract: A piezoelectric micromachined ultrasonic transducer (pMUT) device may include a piezoelectric membrane transducer designed to have lower sensitivity to residual stress and reduced sensitivity to geometric variations arising from the backside etching process used to release the membrane. These designs allow some of its key feature to be adjusted to achieve desired characteristics, such as pressure sensitivity, natural frequency, stress sensitivity, and bandwidth.
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公开(公告)号：US20200270122A1
公开(公告)日：2020-08-27
申请号：US16872712
申请日：2020-05-12
Applicant: Chirp Microsystems, Inc.
Inventor： Stefon Shelton , Fabian Goericke
Abstract: A micromechanical system (MEMS) device package comprising a substrate and a first enclosure including a first cavity, coupled to the substrate. Wherein a transverse dimension of the first cavity relative to the substrate is configured to reduce undesirable acoustic modes within the first cavity and the first cavity comprises an acoustic port. A MEMS device is located inside the first cavity and an Application Specific Integrated Circuit (ASIC) is communicatively coupled to the MEMS device and located outside the first cavity.
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Patent Agency Ranking
公开(公告)号：US20180268796A1
公开(公告)日：2018-09-20
申请号：US15987824
申请日：2018-05-23
Applicant: Chirp Microsystems, Inc.
Inventor： Stefon Shelton , Andre Guedes , David Horsley
Abstract: A package design for a micromachined ultrasound transducer (MUT) utilizing curved geometry to control the presence and frequency of acoustic resonant modes is described. The approach consists of reducing in number and curving the reflecting surfaces present in the package cavity to adjust the acoustic resonant frequencies to locations outside the band of interest. The design includes a cavity characterized by a curved geometry and a MUT mounted to a side of a substrate facing the cavity with a sound emitting portion of the MUT facing an opening in the substrate. The substrate is disposed over an opening of the cavity with the substrate oriented such that the MUT located within the cavity.
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公开(公告)号：US11292030B2
公开(公告)日：2022-04-05
申请号：US16219387
申请日：2018-12-13
Applicant: Chirp Microsystems, Inc.
Inventor： David Horsley , Andre Guedes , Stefon Shelton , Richard Przybyla
IPC: B06B1/06 , H01L41/053 , H01L41/187 , G10K9/122
Abstract: A piezoelectric micromachined ultrasound transducer (PMUT) is disclosed. The device consists of a flexible membrane that is connected to a rigid substrate via flexures. The flexures are defined by slots etched through the perimeter of the membrane. These features release the stress present on the structural layers of the membrane, making it less sensitive to residual stress. The flexures are designed to act as torsion springs so that the membrane's vibration mode shape is highly curved in the piezoelectric actuation area, thereby increasing the electromechanical coupling.
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公开(公告)号：US10751755B1
公开(公告)日：2020-08-25
申请号：US15466040
申请日：2017-03-22
Applicant: Chirp Microsystems, Inc.
Inventor： David A. Horsley , Andre Guedes , Meng-Hsiung Kiang , Richard Przybyla , Stefon Shelton
IPC: H01L41/09 , B06B1/06 , H01L41/113 , B06B1/02
Abstract: An apparatus comprises an ultrasonic transducer having a first and second electrode and switches which configured to selectively connect the first and second electrodes to a transmit voltage source or to a receive amplifier. The switches are configured to selectively connect a first input of the amplifier to the first electrode of the transducer and to selectively connect a second input of the amplifier to the second electrode of the transducer. The switches are also configured to selectively connect the voltage source to the first and second electrodes of the transducer. The transducer may include a piezoelectric layer attached to and sandwiched between the first electrode and the second electrode, and a flexible membrane attached to the first electrode. The piezoelectric layer may be patterned to form an annular ring at the outer diameter of the flexible membrane.
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公开(公告)号：US10573289B2
公开(公告)日：2020-02-25
申请号：US15583861
申请日：2017-05-01
Applicant: Chirp Microsystems, Inc.
Inventor： Richard Przybyla , Andre Guedes , Stefon Shelton , Meng-Hsiung Kiang , David Horsley
Abstract: A system and method use an array of ultrasonic transducers to emit and receive sound in a phased array fashion by using acoustic waveguides to achieve a desired acoustic radiation and reception pattern. A chip package attached to an acoustic transducer array includes acoustic waveguides coupled to acoustic ports. Each waveguide is coupled between a corresponding acoustic transducer and a corresponding acoustic port. A spacing of a pair of acoustic ports is different than a spacing of a corresponding pair of acoustic transducers.
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公开(公告)号：US10566949B2
公开(公告)日：2020-02-18
申请号：US15342719
申请日：2016-11-03
Applicant: Chirp Microsystems, Inc.
Inventor： Stefon Shelton , Andre Guedes , Richard Przybyla , Meng-Hsiung Kiang , David Horsley
Abstract: A transducer includes first and second piezoelectric layers made of corresponding different first and second piezoelectric materials and three or more electrodes, implemented in two or more conductive electrode layers. The first piezoelectric layer is sandwiched between a first pair of electrodes and the second piezoelectric layer is sandwiched between a second pair of electrodes. The first and second pairs of electrodes contain no more than one electrode that is common to both pairs.
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