Abstract:
A process is disclosed for the delayed sintering of metal nanoparticles in a self-assembled transparent conductive coating by incorporating a sintering additive into the water phase of the emulsion used to form the coating. The sintering additive reduces the standard reduction potential of the metal ion of the metal forming the nanoparticles by an amount greater than 0.1V but less than the full reduction potential of the metal ion. Emulsion compositions used in the process are also disclosed.
Abstract:
Among other things, two networks, one on top of the other, are formed on a substrate based on coating materials containing emulsions or foams. The two networks can be formed of the same material, e.g., a conductive material such as silver, or can be formed of different materials. The coating materials forming the different networks can have different concentration of network materials.
Abstract:
A process for preparing an electrically conductive, adhesive tape that includes: (a) providing an article comprising a substrate and a network of electrically conductive metal traces defining cells that are transparent to visible light on the substrate; (b) embedding the network of electrically conductive traces in a polymer matrix having a surface on which a pressure sensitive adhesive is deposited; and (c) removing the substrate to form the electrically conductive, adhesive tape.
Abstract:
Among other things, two networks, one on top of the other, are formed on a substrate based on coating materials containing emulsions or foams. The two networks can be formed of the same material, e.g., a conductive material such as silver, or can be formed of different materials. The coating materials forming the different networks can have different concentration of network materials.