公开(公告)号：US20240073269A1

公开(公告)日：2024-02-29

申请号：US17895539

申请日：2022-08-25

Applicant: Cisco Technology, Inc.

Inventor： Abhay Sudhakar Kulkarni ,  Kai Wang ,  Li Li

IPC: H04L65/613 ,  G06F3/0482 ,  H04L65/1089 ,  H04L65/1096

CPC classification number: H04L65/613 ,  G06F3/0482 ,  H04L65/1089 ,  H04L65/1096

Abstract: Techniques are provided herein for generating Non-Fungible Tokens (NFTs) as souvenirs of multimedia communication sessions. In one example embodiment, during a multimedia communication session with a plurality of participants, an indication to generate an NFT from content of the multimedia communication session is obtained from a first participant of the plurality of participants. Content data is captured from the multimedia communication session as the multimedia communication session is occurring. The NFT is generated from the content data. The NFT is a souvenir of the multimedia communication session.

公开(公告)号：US11242234B2

公开(公告)日：2022-02-08

申请号：US17015693

申请日：2020-09-09

Applicant: Cisco Technology, Inc.

Inventor： Li Li ,  Matthew Los ,  Joyce Peternel ,  Stephan Gostonyi ,  Fred Warning ,  Mittu Pannala

IPC: H01R13/62 ,  B66F19/00 ,  G06F1/18 ,  H01R13/633

Abstract: Presented herein are removable pull tabs that are configured to be detachably coupled to pluggable modules in a manner that facilitates removal of the pull tabs from the module without disassembling the modules. In particular, a removable pull tab may comprise a handle, first and second substantially parallel attachment arms extending from the handle, and a reinforcement line embedded in the handle and first and second attachment arms. The first and second attachment arms comprise first and second attachment mechanisms, respectively, disposed at a distal end of the respective attachment arm. The first and second attachment mechanisms are configured to detachably couple to first and second apertures, respectively, of a pluggable module.

公开(公告)号：US20210210902A1

公开(公告)日：2021-07-08

申请号：US17015693

申请日：2020-09-09

Applicant: Cisco Technology, Inc.

Inventor： Li Li ,  Matthew Los ,  Joyce Peternel ,  Stephan Gostonyi ,  Fred Warning ,  Mittu Pannala

IPC: H01R13/633

Abstract: Presented herein are removable pull tabs that are configured to be detachably coupled to pluggable modules in a manner that facilitates removal of the pull tabs from the module without disassembling the modules. In particular, a removable pull tab may comprise a handle, first and second substantially parallel attachment arms extending from the handle, and a reinforcement line embedded in the handle and first and second attachment arms. The first and second attachment arms comprise first and second attachment mechanisms, respectively, disposed at a distal end of the respective attachment arm. The first and second attachment mechanisms are configured to detachably couple to first and second apertures, respectively, of a pluggable module.

公开(公告)号：US09414497B2

公开(公告)日：2016-08-09

申请号：US14815184

申请日：2015-07-31

Applicant: Cisco Technology, Inc.

Inventor： Jovica Savic ,  Zhiping Yang ,  Jie Xue ,  Li Li

IPC: H01L29/06 ,  H05K1/18 ,  H01L23/498 ,  H05K1/11 ,  H01L23/24 ,  H01L23/31

CPC classification number: H05K1/183 ,  H01L23/24 ,  H01L23/3107 ,  H01L23/49838 ,  H01L2224/16225 ,  H01L2924/0002 ,  H05K1/115 ,  H05K1/181 ,  H05K2201/095 ,  H05K2201/10492 ,  H05K2201/10507 ,  H01L2924/00

Abstract: An apparatus includes a cavity formed in a support structure, the support structure being operable to support a semiconductor device. A circuit element is disposed in the cavity in the support structure, and the cavity in the support structure is filled with an electrically non-conductive filling material so as to at least partially surround the circuit element with the non-conductive filling material. The semiconductor device is electrically connected to the circuit element. In an example embodiment, the circuit element is operable to substantially block direct current that is output by the semiconductor device or another semiconductor device.

Abstract translation: 一种装置包括形成在支撑结构中的空腔，所述支撑结构可操作以支撑半导体器件。 电路元件设置在支撑结构中的空腔中，并且支撑结构中的空腔填充有不导电的填充材料，以便至少部分地围绕电路元件与非导电填充材料。 半导体器件电连接到电路元件。 在示例性实施例中，电路元件可操作以基本上阻挡由半导体器件或另一半导体器件输出的直流电流。

公开(公告)号：US11742451B2

公开(公告)日：2023-08-29

申请号：US17103792

申请日：2020-11-24

Applicant: Cisco Technology, Inc.

Inventor： Xunyuan Zhang ,  Li Li ,  Prakash B. Gothoskar ,  Soha Namnabat

IPC: H01L31/18 ,  H01L31/0368 ,  H01L31/105 ,  H01L31/036

CPC classification number: H01L31/1812 ,  H01L31/036 ,  H01L31/03682 ,  H01L31/105 ,  H01L31/1808 ,  H01L31/1892

Abstract: The embodiments of the present disclosure describe a stressed Ge PD and fabrications techniques for making the same. In one embodiment, a stressor material is deposited underneath an already formed Ge PD. To do so, wafer bonding can be used to bond the wafer containing the Ge PD to a second, handler wafer. Doing so provides support to remove the substrate of the wafer so that a stressor material (e.g., silicon nitride, diamond-like carbon, or silicon-germanium) can be disposed underneath the Ge PD. The stress material induces a stress or strain in the crystal lattice of the Ge which changes its bandgap and improves its responsivity.

公开(公告)号：US20220055879A1

公开(公告)日：2022-02-24

申请号：US17520284

申请日：2021-11-05

Applicant: Cisco Technology, Inc.

Inventor： Li Li ,  Matthew Los ,  Joyce Peternel ,  Stephan Gostonyi ,  Fred Warning ,  Mittu Pannala

IPC: B66F19/00 ,  H01R13/62 ,  G06F1/18 ,  H01R13/633

Abstract: Presented herein are removable pull tabs that are configured to be detachably coupled to pluggable modules in a manner that facilitates removal of the pull tabs from the module without disassembling the modules. In particular, a removable pull tab may comprise a handle, first and second substantially parallel attachment arms extending from the handle, and a reinforcement line embedded in the handle and first and second attachment arms. The first and second attachment arms comprise first and second attachment mechanisms, respectively, disposed at a distal end of the respective attachment arm. The first and second attachment mechanisms are configured to detachably couple to first and second apertures, respectively, of a pluggable module.

公开(公告)号：US11964855B2

公开(公告)日：2024-04-23

申请号：US17520284

申请日：2021-11-05

Applicant: Cisco Technology, Inc.

Inventor： Li Li ,  Matthew Los ,  Joyce Peternel ,  Stephan Gostonyi ,  Fred Warning ,  Mittu Pannala

IPC: H01R13/62 ,  B66F19/00 ,  G06F1/18 ,  H01R13/633

CPC classification number: B66F19/00 ,  G06F1/187 ,  H01R13/62 ,  H01R13/6335

Abstract: Presented herein are removable pull tabs that are configured to be detachably coupled to pluggable modules in a manner that facilitates removal of the pull tabs from the module without disassembling the modules. In particular, a removable pull tab may comprise a handle, first and second substantially parallel attachment arms extending from the handle, and a reinforcement line embedded in the handle and first and second attachment arms. The first and second attachment arms comprise first and second attachment mechanisms, respectively, disposed at a distal end of the respective attachment arm. The first and second attachment mechanisms are configured to detachably couple to first and second apertures, respectively, of a pluggable module.

公开(公告)号：US20160064320A1

公开(公告)日：2016-03-03

申请号：US14470670

申请日：2014-08-27

Applicant: Cisco Technology, Inc.

Inventor： Li Li ,  Mohan R. Nagar ,  Jovica Savic

IPC: H01L23/498 ,  H01L23/00 ,  H01L25/065

CPC classification number: H01L23/49838 ,  H01L23/49833 ,  H01L23/49894 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L25/0655 ,  H01L2224/16227 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2924/01014 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/2064 ,  H01L2924/20641

Abstract: An integrated circuit chip stack and a method for forming the same in which bond pads of an interposer are directly bonded to bond pads of a package substrate using only pre-solder. The interposer can have a bond pad pitch of less than 150 micrometers. The interposer can be an organic interposer. The pro-solder can be melted to make contact with the bond pads of the package substrate and the interposer. After solidifying, the pre-solder can form an electrical connection between a bond pad of the interposer and a bond pad of the package substrate.

Abstract translation: 集成电路芯片堆叠及其形成方法，其中内插器的接合焊盘仅使用预焊接直接接合到封装衬底的焊盘。 插入器可以具有小于150微米的焊盘间距。 插入器可以是有机插入器。 原焊料可以熔化以与封装基板和插入件的接合焊盘接触。 在固化之后，预焊料可以在插入件的接合焊盘和封装衬底的焊盘之间形成电连接。

公开(公告)号：US20150342053A1

公开(公告)日：2015-11-26

申请号：US14815184

申请日：2015-07-31

Applicant: Cisco Technology, Inc.

Inventor： Jovica Savic ,  Zhiping Yang ,  Jie Xue ,  Li Li

IPC: H05K1/18 ,  H05K1/11 ,  H01L23/498

CPC classification number: H05K1/183 ,  H01L23/24 ,  H01L23/3107 ,  H01L23/49838 ,  H01L2224/16225 ,  H01L2924/0002 ,  H05K1/115 ,  H05K1/181 ,  H05K2201/095 ,  H05K2201/10492 ,  H05K2201/10507 ,  H01L2924/00

Abstract: An apparatus includes a cavity formed in a support structure, the support structure being operable to support a semiconductor device. A circuit element is disposed in the cavity in the support structure, and the cavity in the support structure is filled with an electrically non-conductive filling material so as to at least partially surround the circuit element with the non-conductive filling material. The semiconductor device is electrically connected to the circuit element. In an example embodiment, the circuit element is operable to substantially block direct current that is output by the semiconductor device or another semiconductor device.

Abstract translation: 一种装置包括形成在支撑结构中的空腔，所述支撑结构可操作以支撑半导体器件。 电路元件设置在支撑结构中的空腔中，并且支撑结构中的空腔填充有不导电的填充材料，以便至少部分地围绕电路元件与非导电填充材料。 半导体器件电连接到电路元件。 在示例性实施例中，电路元件可操作以基本上阻挡由半导体器件或另一半导体器件输出的直流电流。