公开(公告)号：US20150096787A1

公开(公告)日：2015-04-09

申请号：US14048069

申请日：2013-10-08

Applicant: Cisco Technology, Inc.

Inventor： Shih Fung Perng ,  Weidong Xie ,  Nguyet-Anh Nguyen

IPC: H05K1/02

CPC classification number: H05K1/0213 ,  H01L2924/15311 ,  H01L2924/3511 ,  H05K3/301 ,  H05K3/303 ,  H05K3/3436 ,  H05K2201/2036 ,  Y02P70/613

Abstract: An apparatus may be provided. The apparatus may comprise a substrate and a circuit board. A ball grid array structure may be disposed between the substrate and the circuit board. In addition, a stand-off structure may be disposed between the substrate and the circuit board. The stand-off structure may be adjacent to the ball grid array structure.

Abstract translation: 可以提供一种装置。 该装置可以包括基板和电路板。 球栅阵列结构可以设置在基板和电路板之间。 此外，可以在基板和电路板之间设置间隔结构。 支架结构可以与球栅阵列结构相邻。

公开(公告)号：US09980367B2

公开(公告)日：2018-05-22

申请号：US15014111

申请日：2016-02-03

Applicant: Cisco Technology, Inc.

Inventor： Shih Fung Perng ,  Weidong Xie ,  Nguyet-Anh Nguyen

IPC: H05K1/00 ,  H05K1/02 ,  H05K3/30 ,  H05K3/34

CPC classification number: H05K1/0213 ,  H01L2924/15311 ,  H01L2924/3511 ,  H05K3/301 ,  H05K3/303 ,  H05K3/3436 ,  H05K2201/2036 ,  Y02P70/613

Abstract: An apparatus may be provided. The apparatus may comprise a substrate and a circuit board. A ball grid array structure may be disposed between the substrate and the circuit board. In addition, a stand-off structure may be disposed between the substrate and the circuit board. The stand-off structure may be adjacent to the ball grid array structure.

公开(公告)号：US09282649B2

公开(公告)日：2016-03-08

申请号：US14048069

申请日：2013-10-08

Applicant: Cisco Technology, Inc.

Inventor： Shih Fung Perng ,  Weidong Xie ,  Nguyet-Anh Nguyen

IPC: H05K1/00 ,  H05K3/30 ,  H05K3/34

CPC classification number: H05K1/0213 ,  H01L2924/15311 ,  H01L2924/3511 ,  H05K3/301 ,  H05K3/303 ,  H05K3/3436 ,  H05K2201/2036 ,  Y02P70/613

Abstract: An apparatus may be provided. The apparatus may comprise a substrate and a circuit board. A ball grid array structure may be disposed between the substrate and the circuit board. In addition, a stand-off structure may be disposed between the substrate and the circuit board. The stand-off structure may be adjacent to the ball grid array structure.

Abstract translation: 可以提供一种装置。 该装置可以包括基板和电路板。 球栅阵列结构可以设置在基板和电路板之间。 此外，可以在基板和电路板之间设置间隔结构。 支架结构可以与球栅阵列结构相邻。

公开(公告)号：US20180228017A1

公开(公告)日：2018-08-09

申请号：US15948762

申请日：2018-04-09

Applicant: Cisco Technology, Inc.

Inventor： Shih Fung Perng ,  Weidong Xie ,  Nguyet-Anh Nguyen

IPC: H05K1/02 ,  H05K3/30 ,  H05K3/34

CPC classification number: H05K1/0213 ,  H01L2924/15311 ,  H01L2924/3511 ,  H05K3/301 ,  H05K3/303 ,  H05K3/3436 ,  H05K2201/2036 ,  Y02P70/613

Abstract: An apparatus may be provided. The apparatus may comprise a substrate and a circuit board. A ball grid array structure may be disposed between the substrate and the circuit board. In addition, a stand-off structure may be disposed between the substrate and the circuit board. The stand-off structure may be adjacent to the ball grid array structure.

公开(公告)号：US20160157335A1

公开(公告)日：2016-06-02

申请号：US15014111

申请日：2016-02-03

Applicant: Cisco Technology, Inc.

Inventor： Shih Fung Perng ,  Weidong Xie ,  Nguyet-Anh Nguyen

IPC: H05K1/02 ,  H05K3/30

CPC classification number: H05K1/0213 ,  H01L2924/15311 ,  H01L2924/3511 ,  H05K3/301 ,  H05K3/303 ,  H05K3/3436 ,  H05K2201/2036 ,  Y02P70/613

Abstract: An apparatus may be provided. The apparatus may comprise a substrate and a circuit board. A ball grid array structure may be disposed between the substrate and the circuit board. In addition, a stand-off structure may be disposed between the substrate and the circuit board. The stand-off structure may be adjacent to the ball grid array structure.