Heating elements for thermally-driven phase transition implantable micropump

    公开(公告)号:US12290660B2

    公开(公告)日:2025-05-06

    申请号:US17274760

    申请日:2019-12-31

    Abstract: An apparatus includes an enclosure containing a hermetically sealed region, the enclosure configured to be implanted on or within a recipient. The apparatus further includes circuitry within the hermetically sealed region and configured to generate signals. The apparatus further includes at least one heating element configured to receive the signals and to generate heat in response to the signals. The apparatus further includes at least one flow control element outside the hermetically sealed region and configured to respond to the heat by controlling a flow of liquid through at least one cannula to controllably administer the liquid internally to the recipient.

    ESTIMATION OF ELECTROPORATION PARAMETER LEVELS

    公开(公告)号:US20230398349A1

    公开(公告)日:2023-12-14

    申请号:US18250340

    申请日:2021-10-15

    Abstract: A method includes receiving information regarding a position and/or an orientation of an implantable device relative to a body portion of a recipient during and/or after implantation of at least a portion of the device on and/or into the body portion. The device includes a plurality of electrodes configured to apply electroporation to first cells of the body portion while not damaging second cells of the body portion. The method includes estimating, in response at least in part to the information, first interactions of the electrodes with respect to the first cells. The method further includes estimating, in response at least in part to the information, second interactions of the electrodes with respect to the second cells. The method further includes generating, in response at least in part to the estimated first interactions and the estimated second interactions, values of electrical parameters configured to be provided to the plurality of electrodes to electroporate to the first cells while not damaging the second cells.

    Implant infection control
    8.
    发明授权

    公开(公告)号:US10537743B2

    公开(公告)日:2020-01-21

    申请号:US15158136

    申请日:2016-05-18

    Abstract: Embodiments presented herein are generally directed to a perioperative implant cover configured to cover at least a portion of an implantable component during portions of the perioperative period (i.e., preoperative, intraoperative, and postoperative phases of surgery) in which the implantable component is susceptible to bacteria contamination. By covering the implantable component during these portions of the perioperative period, the cover reduces the possibility of bacteria contamination and subsequent perioperative colonization.

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