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公开(公告)号：US11076491B2
公开(公告)日：2021-07-27
申请号：US16654503
申请日：2019-10-16
Applicant: Compass Technology Company Limited
Inventor： Kelvin Po Leung Pun , Chee Wah Cheung , Jason Rotanson
Abstract: An integrated electro-optical circuit board comprises a first flexible substrate having a top side and a bottom side, at least one first optical circuit on the bottom side of the first flexible substrate connected to the top surface through a filled via, at least one first metal trace on the top side of the first flexible substrate, an optical adhesive layer connecting the bottom side of the first flexible substrate to a top side of a second flexible substrate, and at least one second metal trace on a bottom side of the second flexible substrate connected by a filled via through the second flexible substrate, the optical adhesive layer, and the first flexible substrate to the at least one first metal trace.
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公开(公告)号：US20210120680A1
公开(公告)日：2021-04-22
申请号：US16654503
申请日：2019-10-16
Applicant: Compass Technology Company Limited
Inventor： Kelvin Po Leung Pun , Chee Wah Cheung , Jason Rotanson
Abstract: An integrated electro-optical circuit board comprises a first flexible substrate having a top side and a bottom side, at least one first optical circuit on the bottom side of the first flexible substrate connected to the top surface through a filled via, at least one first metal trace on the top side of the first flexible substrate, an optical adhesive layer connecting the bottom side of the first flexible substrate to a top side of a second flexible substrate, and at least one second metal trace on a bottom side of the second flexible substrate connected by a filled via through the second flexible substrate, the optical adhesive layer, and the first flexible substrate to the at least one first metal trace.
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公开(公告)号：US12249704B2
公开(公告)日：2025-03-11
申请号：US17168377
申请日：2021-02-05
Applicant: Compass Technology Company Limited
Inventor： Kelvin Po Leung Pun , Chee-Wah Cheung , Jason Rotanson , Wing Lung Hon , Yam Chong , Wai Yin Wong , Shengbo Lu , Chenmin Liu
Abstract: An encapsulation is provided on a flexible printed circuit board, comprising a top and a bottom electrically insulating base film, a top electrically conductive metal layer over the top electrically insulating base film, and a bottom electrically conductive metal layer under the bottom electrically insulating base film. A printable lithium ion battery is fabricated in a cavity completely through the top and bottom base films wherein a top of the battery contacts the top electrically conductive metal layer and wherein a bottom of the battery contacts the bottom electrically conductive metal layer. An adhesive film is fabricated around the battery to seals it to the top and bottom electrically insulating base film and to seals the top electrically conductive metal layer to the bottom electrically conductive metal layer.
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公开(公告)号：US20210315108A1
公开(公告)日：2021-10-07
申请号：US17352562
申请日：2021-06-21
Applicant: Compass Technology Company Limited
Inventor： Kelvin Po Leung Pun , Chee Wah Cheung , Jason Rotanson
Abstract: An integrated electro-optical circuit board comprises a first flexible substrate having a top side and a bottom side, at least one first optical circuit on the bottom side of the first flexible substrate connected to the top surface through a filled via, at least one first metal trace on the top side of the first flexible substrate, an optical adhesive layer connecting the bottom side of the first flexible substrate to a top side of a second flexible substrate, and at least one second metal trace on a bottom side of the second flexible substrate connected by a filled via through the second flexible substrate, the optical adhesive layer, and the first flexible substrate to the at least one first metal trace.
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公开(公告)号：US20240178124A1
公开(公告)日：2024-05-30
申请号：US18071819
申请日：2022-11-30
Applicant: Compass Technology Company Limited
Inventor： Kelvin Po Leung Pun , Chee Wah Cheung , Jason Rotanson
IPC: H01L23/498 , H01L21/56 , H01L23/00 , H01L23/31
CPC classification number: H01L23/4985 , H01L21/56 , H01L23/3121 , H01L24/32 , H01L24/83 , H01L24/08 , H01L2224/08225 , H01L2224/32225 , H01L2224/838
Abstract: A flexible substrate embedded die package is described comprising a multi-layer flexible substrate comprising a dielectric substrate, a top metal layer and a bottom metal layer connected with micro-via interconnection through said dielectric substrate, a semiconductor die attached by an adhesive to the flexible substrate and a dielectric bonding film surrounding the semiconductor die and sealing the semiconductor die to the flexible substrate.
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Patent Agency Ranking
公开(公告)号：US11553598B2
公开(公告)日：2023-01-10
申请号：US17352562
申请日：2021-06-21
Applicant: Compass Technology Company Limited
Inventor： Kelvin Po Leung Pun , Chee Wah Cheung , Jason Rotanson
Abstract: An integrated electro-optical circuit board comprises a first flexible substrate having a top side and a bottom side, at least one first optical circuit on the bottom side of the first flexible substrate connected to the top surface through a filled via, at least one first metal trace on the top side of the first flexible substrate, an optical adhesive layer connecting the bottom side of the first flexible substrate to a top side of a second flexible substrate, and at least one second metal trace on a bottom side of the second flexible substrate connected by a filled via through the second flexible substrate, the optical adhesive layer, and the first flexible substrate to the at least one first metal trace.
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公开(公告)号：US10917973B1
公开(公告)日：2021-02-09
申请号：US16801779
申请日：2020-02-26
Applicant: Compass Technology Company Limited
Inventor： Kelvin Po Leung Pun , Chee Wah Cheung , Jason Rotanson , Wing Lung Hon , Yam Chong , Wai Yin Wong , Shengbo Lu , Chenmin Liu
IPC: H05K1/18 , H05K1/09 , H05K3/28 , H01M10/0525 , H01M4/139
Abstract: A flexible printed circuit board with a lithium ion battery printed thereon is achieved. The flexible printed circuit board comprises a top and a bottom electrically insulating base film, a top electrically conductive metal layer over the top electrically insulating base film, and a bottom electrically conductive metal layer under the bottom electrically insulating base film. A printable lithium ion battery sits in a cavity completely through the top and bottom base films wherein a top of the battery contacts the top electrically conductive metal layer and wherein a bottom of the battery contacts the bottom electrically conductive metal layer. An adhesive film around the battery seals it to the top and bottom electrically insulating base film and seals the top electrically conductive metal layer to the bottom electrically conductive metal layer.
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8.发明申请公开(公告)号：US20230122858A1
公开(公告)日：2023-04-20
申请号：US17501297
申请日：2021-10-14
Applicant: Compass Technology Company Limited
Inventor： Kelvin Po Leung Pun , Chee Wah Cheung , Jason Rotanson , Yuen Yung Chan , Wing Lung Hon , Yam Chong , Wai Yin Wong , Shengbo Lu , Chenmin Liu
IPC: H01M50/109 , H05K1/02 , H01M10/0525 , H01M50/186 , H01M10/0585 , H01M50/191 , H01M50/197 , H01M50/119 , H01M50/124 , H01M50/121 , H01M50/193 , H01M4/62 , H01M4/66 , H01M4/587
Abstract: A flexible printed circuit board with a multi-layer all solid-state lithium ion battery printed thereon is described. A flexible printed circuit board comprises at least one electrically insulating liquid crystal polymer or polyimide layer and at least one electrically conductive metal layer. The multi-layer all solid-state lithium ion battery comprises at least one anode, at least one cathode, and at least one UV curable solid electrolyte therebetween. The battery is encapsulated between the flexible printed circuit board and a layer of laminated aluminum foil on top of the multi-layer all solid-state lithium ion battery and adhered directly to the flexible printed circuit board.
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公开(公告)号：US20220181165A1
公开(公告)日：2022-06-09
申请号：US17115085
申请日：2020-12-08
Applicant: Compass Technology Company Limited
Inventor： Kelvin Po Leung Pun , Jason Rotanson , Chee Wah Cheung
IPC: H01L21/48 , H01L23/66 , H01L23/00 , H01L23/498 , H01L23/14 , C23C18/20 , C25D5/56 , C23F17/00 , C25D7/12 , H01Q1/22
Abstract: A method to produce a flexible substrate is described. A base film material of cyclo-olefin polymer (COP) is provided. A surface of the COP base film is irradiated with UV light to form a functional group on the COP surface. Thereafter, the surface is treated with an alkaline degreaser. Thereafter, a Ni—P seed layer is electrolessly plated on the surface. A photoresist pattern is formed on the Ni—P seed layer. Copper traces are plated within the photoresist pattern. The photoresist pattern is removed and the Ni—P seed layer not covered by the copper traces is etched away to complete the flexible substrate. Alternatively, a biocompatible flexible substrate is formed using a Ni—P seed layer with a biocompatible surface finishing instead of copper.
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公开(公告)号：US20210267063A1
公开(公告)日：2021-08-26
申请号：US17168377
申请日：2021-02-05
Applicant: Compass Technology Company Limited
Inventor： Kelvin Po Leung Pun , Chee-Wah Cheung , Jason Rotanson , Wing Lung Hon , Yam Chong , Wai Yin Wong , Shengbo Lu , Chenmin Liu
IPC: H05K1/18 , H05K1/09 , H05K3/28 , H01M10/0525 , H01M4/139
Abstract: A flexible printed circuit board with a lithium ion battery printed thereon is achieved. The flexible printed circuit board comprises a top and a bottom electrically insulating base film, a top electrically conductive metal layer over the top electrically insulating base film, and a bottom electrically conductive metal layer under the bottom electrically insulating base film. A printable lithium ion battery sits in a cavity completely through the top and bottom base films wherein a top of the battery contacts the top electrically conductive metal layer and wherein a bottom of the battery contacts the bottom electrically conductive metal layer. An adhesive film around the battery seals it to the top and bottom electrically insulating base film and seals the top electrically conductive metal layer to the bottom electrically conductive metal layer.
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