公开(公告)号：US10957736B2

公开(公告)日：2021-03-23

申请号：US15918839

申请日：2018-03-12

Applicant: Cree, Inc.

Inventor： Aaron J. Francis ,  Jasper Sicat Cabalu ,  Colin Kelly Blakely

IPC: H01L27/15 ,  H01L33/62 ,  H01L33/08 ,  H01L33/54

Abstract: Light emitting diode (LED) components include a submount, at least one or more LED chip wirebonded on a first surface of the submount to electrical traces at the edges of the submount, and a molded encapsulant which is devoid of a curved lens or hemispherical lens and can have outer or lateral walls co-planar with exterior walls of the submount. An LED component can have a viewing angle that is greater than 125°. A method of providing an LED component includes providing a substantially flat submount, attaching one or more LED chip over a first surface of the submount, dispensing an encapsulant over the first surface of the submount over the LED chips, applying a press over the encapsulant to apply a heat and/or pressure to the encapsulant, and molding the encapsulant over the first surface of the submount.

公开(公告)号：US10950769B2

公开(公告)日：2021-03-16

申请号：US15432146

申请日：2017-02-14

Applicant: Cree, Inc.

Inventor： Michael John Bergmann ,  Colin Kelly Blakely ,  Arthur Fong-Yuen Pun ,  Jesse Colin Reiherzer

IPC: H01L33/62 ,  B23K1/00 ,  H01L33/64 ,  B23K35/26 ,  B23K35/30 ,  C22C13/00 ,  C22C19/03 ,  H01L25/075 ,  H01L33/36 ,  H01L33/48 ,  H01L33/38 ,  H01L33/20

Abstract: A Light Emitting Diode (LED) component includes a lead frame and an LED that is electrically connected to the lead frame without wire bonds, using a solder layer. The lead frame includes a metal anode pad, a metal cathode pad and a plastic cup. The LED die includes LED die anode and cathode contacts with a solder layer on them. The metal anode pad, metal cathode pad, plastic cup and/or the solder layer are configured to facilitate the direct die attach of the LED die to the lead frame without wire bonds. Related fabrication methods are also described.

公开(公告)号：US20210057390A1

公开(公告)日：2021-02-25

申请号：US17092939

申请日：2020-11-09

Applicant: Cree, Inc.

Inventor： Troy Gould ,  Colin Kelly Blakely ,  Jesse Colin Reiherzer ,  Joseph G. Clark

IPC: H01L25/075 ,  H01L33/50 ,  H01L33/54 ,  H01L33/58 ,  H01L33/62 ,  H01L33/60

Abstract: Light emitting diode (LED) devices and methods. An example apparatus can include a substrate, one or more LEDs, light-transmissive encapsulation material, and a reflective material covering a portion of the encapsulation material to form a defined opening. The opening allows light emitted from an LED to pass through in a prescribed manner. In some embodiments, the apparatus can be subsequently treated to modify the surface having the opening. In other embodiments, the reflective material can be disposed on a lateral surface of the encapsulation material to reflect light in a desired direction.

公开(公告)号：US10431568B2

公开(公告)日：2019-10-01

申请号：US15264547

申请日：2016-09-13

Applicant: Cree, Inc.

Inventor： Troy Gould ,  Colin Kelly Blakely ,  Kyle Damborsky ,  Jesse Colin Reiherzer

IPC: H01L25/075 ,  H01L33/50 ,  H01L33/56 ,  H01L33/54 ,  H01L23/00 ,  H01L33/48 ,  H01L33/60

Abstract: Light emitting diode (LED) devices, components and systems are provided. LED devices include a submount with a plurality of LEDs disposed thereon. The LEDs mounted on a submount can be spaced apart at predetermined dimensions to control the gaps between each of the plurality of LEDs. By controlling the gaps between LEDs the optical output from the LED device can be optimized, including improving emission and/or color uniformity, minimizing or eliminating deadspots in the light emission, and/or minimizing or eliminating an optical cross. A phosphor layer can be disposed on the plurality of LEDs and between the LEDs in the gaps therebetween.

公开(公告)号：US20190057954A1

公开(公告)日：2019-02-21

申请号：US15681205

申请日：2017-08-18

Applicant: Cree, Inc.

Inventor： Colin Kelly Blakely ,  Jasper Sicat Cabalu ,  Kyle Damborsky

IPC: H01L25/075 ,  H01L33/48 ,  H01L33/50 ,  H01L33/54 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L27/02

Abstract: A light emitter device includes a submount with a top surface and a bottom surface, electrically conductive traces on the top surface of the submount, light emitting diodes (LEDs) arranged on the top surface of the submount in light emitter zones, with the LEDs being electrically connected to respective traces of the traces, a retention material disposed over the top surface of the submount in a form of walls which physically separate the light emitter zones, and encapsulants that are dispensed in respective light emitter zones of the light emitter zones. The LEDs are individually addressable to independently control an output of light from each of the LEDs to produce a specified light output.

公开(公告)号：US10074635B2

公开(公告)日：2018-09-11

申请号：US14802655

申请日：2015-07-17

Applicant: Cree, Inc.

Inventor： Nishant Tiwari ,  Colin Kelly Blakely ,  Jesse Colin Reiherzer ,  Mark Edmond ,  Arthur Fong-Yuen Pun ,  Michael Bergmann

IPC: H01L25/075 ,  H01L33/62 ,  H01L33/52 ,  H01L33/50 ,  H01L33/48 ,  H01L25/00

CPC classification number: H01L25/0753 ,  H01L25/50 ,  H01L33/486 ,  H01L33/507 ,  H01L33/52 ,  H01L33/62 ,  H01L2224/48137 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0066

Abstract: Solid state light emitter devices and methods are provided. A solid state light emitter device can include a submount having an upper surface and a bottom surface. At least first pair and a second pair of electrically conductive contacts can be disposed on the bottom surface of the submount. The first pair of contacts can be electrically independent from the second pair of contacts. The device can further include multiple light emitters provided on the upper surface of the submount. The multiple light emitters can be configured into at least a first light emitter zone that is electrically independent from a second light emitter zone upon electrical communication to a respective pair of contacts.

公开(公告)号：US20190280043A1

公开(公告)日：2019-09-12

申请号：US15918839

申请日：2018-03-12

Applicant: Cree, Inc.

Inventor： Aaron J. Francis ,  Jasper Sicat Cabalu ,  Colin Kelly Blakely

IPC: H01L27/15 ,  H01L33/62

Abstract: Light emitting diode (LED) components include a submount, at least one or more LED chip wirebonded on a first surface of the submount to electrical traces at the edges of the submount, and a molded encapsulant which is devoid of a curved lens or hemispherical lens and can have outer or lateral walls co-planar with exterior walls of the submount. An LED component can have a viewing angle that is greater than 125°. A method of providing an LED component includes providing a substantially flat submount, attaching one or more LED chip over a first surface of the submount, dispensing an encapsulant over the first surface of the submount over the LED chips, applying a press over the encapsulant to apply a heat and/or pressure to the encapsulant, and molding the encapsulant over the first surface of the submount.

公开(公告)号：US10410997B2

公开(公告)日：2019-09-10

申请号：US15593042

申请日：2017-05-11

Applicant: Cree, Inc.

Inventor： Troy Gould ,  Colin Kelly Blakely ,  Jesse Colin Reiherzer ,  Joseph G. Clark

IPC: H01L33/50 ,  H01L25/075 ,  H01L33/54 ,  H01L33/58 ,  H01L33/62 ,  H01L33/60 ,  H01L33/46

Abstract: Light emitting diode (LED) devices and methods. An example apparatus can include a substrate, one or more LEDs, light-transmissive encapsulation material, and a reflective material covering a portion of the encapsulation material to form a defined opening. The opening allows light emitted from an LED to pass through in a prescribed manner. In some embodiments, the apparatus can be subsequently treated to modify the surface having the opening. In other embodiments, the reflective material can be disposed on a lateral surface of the encapsulation material to reflect light in a desired direction.

公开(公告)号：US20190027658A1

公开(公告)日：2019-01-24

申请号：US15654323

申请日：2017-07-19

Applicant: Cree, Inc.

Inventor： Troy Gould ,  Colin Kelly Blakely ,  Jesse Colin Reiherzer ,  Craig William Hardin

IPC: H01L33/54 ,  H01L25/075 ,  H01L23/62

Abstract: Light emitting diode (LED) apparatuses and methods having a high lumen output density. An example apparatus can include a substrate with one or more LEDs enclosed by an encapsulant. The encapsulant comprises beveled edges and/or top surface facets. By providing facets in the encapsulant and minimizing the chip-to-area ratio through efficient via placement, a high lumen density is achieved. Facets and bevels can be created by removing material from the encapsulant with a beveled blade.

公开(公告)号：US20180331078A1

公开(公告)日：2018-11-15

申请号：US15593042

申请日：2017-05-11

Applicant: Cree, Inc.

Inventor： Troy Gould ,  Colin Kelly Blakely ,  Jesse Colin Reiherzer ,  Joseph G. Clark

IPC: H01L25/075 ,  H01L33/50 ,  H01L33/54 ,  H01L33/58 ,  H01L33/62 ,  H01L33/46

CPC classification number: H01L25/075 ,  H01L33/46 ,  H01L33/502 ,  H01L33/54 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L2933/0058

Abstract: Light emitting diode (LED) devices and methods. An example apparatus can include a substrate, one or more LEDs, light-transmissive encapsulation material, and a reflective material covering a portion of the encapsulation material to form a defined opening. The opening allows light emitted from an LED to pass through in a prescribed manner. In some embodiments, the apparatus can be subsequently treated to modify the surface having the opening. In other embodiments, the reflective material can be disposed on a lateral surface of the encapsulation material to reflect light in a desired direction.