公开(公告)号：US09853628B1

公开(公告)日：2017-12-26

申请号：US15281916

申请日：2016-09-30

Applicant: DAPA INC.

Inventor： Ting-Yi Chen

IPC: H03B5/32 ,  H03H9/19 ,  H01L41/053 ,  H01L41/047 ,  H01L41/107 ,  H01L41/18

CPC classification number: H03H9/19 ,  H01L41/047 ,  H01L41/0533 ,  H01L41/107 ,  H01L41/18 ,  H03B5/32 ,  H03H9/0552 ,  H03H9/1021 ,  H03H9/205

Abstract: A structure of an integrated crystal oscillator package has a first quartz crystal resonator, a second quartz crystal resonator, and application-specific integrated circuit chip (ASIC) combined in a package. The ASIC has a switch control for receiving audio formats of 44.1 kHz and 48 kHz with different hi-fidelity (hi-fi). The first quartz crystal resonator has a first clock rate corresponding to the 44.1 kHz frequency and the second quartz crystal resonator has a second clock rate corresponding to the 48 kHz frequency to be switched by the present invention in operation.

公开(公告)号：US10203398B2

公开(公告)日：2019-02-12

申请号：US15882074

申请日：2018-01-29

Applicant: DAPA INC.

Inventor： Ting-Yi Chen

IPC: G01S7/481 ,  G01S17/08 ,  G01J1/02 ,  H01L25/16 ,  H01L31/167 ,  H01L31/02 ,  G01J1/42 ,  G01S17/02 ,  H01L31/0203 ,  H01L31/0232 ,  H01L23/00

Abstract: A complex optical proximity sensor includes a substrate, a light emitter coupled to the substrate, an application-specific integrated circuit chip coupled to the substrate, a proximity sensor embedded in the application-specific integrated circuit chip, a barrier disposed between the application-specific integrated circuit chip and the light emitter, and an ambient light detection chip manufactured in advance and then coupled to the application-specific integrated circuit chip thereon with a pre-determined height. The elements are disposed within a limited area of an aperture and, with a manufacturing method of the complex optical proximity sensor, the detection angle of the ambient light is thereby maximized and the detection angle of the proximity sensor is thereby minimized.