公开(公告)号：US12213286B2

公开(公告)日：2025-01-28

申请号：US17423429

申请日：2020-01-29

Applicant: DENKA COMPANY LIMITED

Inventor： Daisuke Goto ,  Hiroaki Ota

IPC: H05K7/20 ,  C04B35/565 ,  C04B35/622 ,  C04B38/02 ,  C04B41/00 ,  C04B41/51 ,  C04B41/52 ,  C04B41/88 ,  C04B41/90 ,  C22C29/06 ,  C22C32/00 ,  F28F3/00 ,  F28F13/18 ,  F28F21/02 ,  F28F21/08 ,  H01L23/36 ,  H01L23/367 ,  H01L23/373

Abstract: A plate-shaped heat dissipation member includes a metal-silicon carbide composite containing aluminum or magnesium, in which at least one of two main surfaces of the heat dissipation member is curved to be convex in an outward direction of the heat dissipation member, and when a flatness of the one main surface defined by JIS B 0621 is represented by f1 and a flatness of the other main surface different from the one main surface defined by JIS B 0621 is represented by f2, f2 is less than f1 by 10 μm or more.

公开(公告)号：US12069837B2

公开(公告)日：2024-08-20

申请号：US17425541

申请日：2020-01-29

Applicant: DENKA COMPANY LIMITED

Inventor： Daisuke Goto ,  Hiroaki Ota

IPC: H05K7/20 ,  B28B3/02 ,  C04B35/575 ,  C04B41/45 ,  C04B41/51 ,  C04B41/88 ,  C09K5/14 ,  F28F21/04 ,  F28F21/08

CPC classification number: H05K7/2039 ,  B28B3/025 ,  C04B35/575 ,  C04B41/4523 ,  C04B41/5155 ,  C04B41/88 ,  C09K5/14 ,  F28F21/04 ,  F28F21/089 ,  C04B2235/3418 ,  C04B2235/3826 ,  F28F2215/04 ,  F28F2215/10

Abstract: Among two main surfaces of a heat dissipation member, one main surface is curved to be convex in an outward direction and the other convex in an inward direction. When a straight line passing through both endpoints P1 and P2 of the curve is l1, a point at which a distance to l1 on the curve is maximum is Pmax, an intersection point between l1 and a perpendicular drawn from Pmax to l1 is P3, a middle point of a line segment P1P3 is P4, an intersection point between the curve and a straight line that passes through P4 and is perpendicular to l1 is Pmid, a length of the line segment P1P3 is L, a length of a line segment P3Pmax is H, and a length of a line segment P4Pmax is h, (2 h/L)/(H/L) is 1.1 or more.

公开(公告)号：US12084390B2

公开(公告)日：2024-09-10

申请号：US18023226

申请日：2022-02-16

Applicant: DENKA COMPANY LIMITED

Inventor： Daisuke Goto ,  Hiroaki Ota

IPC: C04B35/565 ,  B28B5/02 ,  B28B11/12 ,  C04B35/622 ,  C04B41/51 ,  C04B41/88

CPC classification number: C04B41/5155 ,  B28B5/021 ,  B28B11/12 ,  C04B35/565 ,  C04B35/62236 ,  C04B41/88 ,  C04B2235/3826 ,  C04B2235/402 ,  C04B2235/5224 ,  C04B2235/602 ,  C04B2235/616 ,  C04B2235/96

Abstract: A molded article having a small difference in thermal conductivities between a central section and a section located at an outer peripheral surface side; and a method for producing the same; wherein, a plate-shaped molded article includes an aluminum-silicon carbide composited section in which a metal including aluminum was impregnated into a silicon carbide porous body, wherein a difference in the densities, by Archimedes' principle, of a central section of the aluminum-silicon carbide composited section and of at least a portion of an outer side section located further toward the outside peripheral surface side than the central section is 3% or less.

公开(公告)号：US11983586B2

公开(公告)日：2024-05-14

申请号：US17791971

申请日：2021-03-25

Applicant: DENKA COMPANY LIMITED

Inventor： Daisuke Goto ,  Hiroaki Ota

IPC: G06K19/02 ,  B32B3/30 ,  B32B7/08 ,  B32B7/12 ,  B32B15/01 ,  B32B15/04 ,  B32B18/00 ,  G06K19/06 ,  H01L23/498 ,  H01L23/544 ,  H05K1/02 ,  H05K7/20

CPC classification number: G06K19/02 ,  B32B3/30 ,  B32B15/016 ,  B32B15/043 ,  G06K19/06037 ,  H01L23/544 ,  H05K1/0269 ,  H05K7/205 ,  B32B7/08 ,  B32B7/12 ,  B32B18/00 ,  B32B2255/06 ,  B32B2255/205 ,  B32B2264/108 ,  B32B2307/302 ,  B32B2307/538 ,  B32B2457/08 ,  H01L23/49838 ,  H01L2223/54406 ,  H01L2223/54413 ,  H05K1/0204

Abstract: A ceramic circuit board includes a ceramic base material, a metal layer (first metal layer), and a marker portion. The marker portion is formed on the surface of the first metal layer. The surface of the metal layer (first metal layer) may be plated. When the surface of the metal layer (first metal layer) is plated, the marker portion may be formed on the plating.

公开(公告)号：US11912489B2

公开(公告)日：2024-02-27

申请号：US17292473

申请日：2019-11-06

Applicant: DENKA COMPANY LIMITED

Inventor： Hiroaki Ota ,  Yosuke Ishihara ,  Daisuke Goto

IPC: B65D85/48 ,  B65D81/26 ,  B65D57/00 ,  B65D81/20

CPC classification number: B65D81/268 ,  B65D57/004 ,  B65D81/203

Abstract: A plurality of heat dissipation substrates stacked on each other, intermediate sheets disposed under a lowermost heat dissipation substrate, on an uppermost heat dissipation substrate, and between heat dissipation substrates adjacent to each other, a drying agent disposed over or under the plurality of heat dissipation substrates, and a bag that seals the plurality of heat dissipation substrates, the plurality of intermediate sheets, and the drying agent.

公开(公告)号：US11903168B2

公开(公告)日：2024-02-13

申请号：US17298169

申请日：2019-11-19

Applicant: DENKA COMPANY LIMITED

Inventor： Yosuke Ishihara ,  Daisuke Goto

IPC: H05K7/20

CPC classification number: H05K7/2039 ,  H05K7/20854

Abstract: A substantially rectangular flat heat dissipation member includes: a composite portion where silicon carbide having voids is impregnated with metal; and a metal portion that is different from the composite portion. Here, a proportion of a volume of the metal portion to a total volume of the heat dissipation member is 2.9% or higher and 12% or lower. In addition, when a length of a diagonal line of the rectangular flat heat dissipation member is represented by L, in a top view where one main surface of the heat dissipation member is a top surface, 40% or higher of a total volume of the metal portion is present in a region D within a distance of L/6 from an apex of any one of four corners of the heat dissipation member. Further, a hole penetrates the metal portion in the region D.

公开(公告)号：US11682604B2

公开(公告)日：2023-06-20

申请号：US16822225

申请日：2020-03-18

Applicant: DENKA COMPANY LIMITED

Inventor： Daisuke Goto ,  Takeshi Miyakawa ,  Yosuke Ishihara

IPC: H01L23/373 ,  H01L23/14 ,  H01L23/12 ,  H01L23/36 ,  C22F1/04 ,  H01L21/48 ,  H01L23/367

CPC classification number: H01L23/3733 ,  C22F1/04 ,  H01L21/4878 ,  H01L23/12 ,  H01L23/14 ,  H01L23/36 ,  H01L23/367 ,  H01L2924/0002 ,  H01L2924/0002 ,  H01L2924/00

Abstract: To provide a method for manufacturing a heat dissipation component having excellent heat dissipation properties, in which there is minimal return of warping after the bonding of a circuit board, and to provide a heat dissipation component manufactured using the method. Provided is a method for manufacturing a warped flat-plate-shaped heat dissipation component containing a composite part that comprises silicon carbide and an aluminum alloy, wherein the method for manufacturing the heat dissipation component is characterized in that the heat dissipation component is sandwiched in a concave-convex mold having a surface temperature of at least 450° C. and having a pair of opposing spherical surfaces measuring 7000-30,000 mm in curvature radius, and pressure is applied for 30 seconds or more at a stress of 10 kPa or more such that the temperature of the heat dissipation component reaches at least 450° C.

公开(公告)号：US10919811B2

公开(公告)日：2021-02-16

申请号：US15748420

申请日：2015-07-31

Applicant: Denka Company Limited

Inventor： Akimasa Yuasa ,  Takeshi Miyakawa ,  Daisuke Goto

IPC: B22F3/26 ,  C04B35/565 ,  C04B41/88 ,  C04B38/00 ,  B22D19/00 ,  C04B41/00 ,  C04B41/51 ,  B22D19/02 ,  C04B35/573 ,  C04B35/63 ,  H01L23/373 ,  H01L21/48 ,  C04B35/645 ,  B22D19/14 ,  C22C1/10 ,  C04B111/00

Abstract: Provided are an aluminum-silicon-carbide composite having high thermal conductivity, low thermal expansion, and low specific gravity and a method for producing the composite. Provided is an aluminum-silicon-carbide composite formed by impregnating a porous silicon carbide molded body with an aluminum alloy. The ratio of silicon carbide in the composite is 60 vol % or more, and the composite contains 60-75 mass % of silicon carbide having a particle diameter of 80 μm or more and 800 μm or less, 20-30 mass % of silicon carbide having a particle diameter of 8 μm or more and less than 80 μm, and 5-10 mass % of silicon carbide having a particle diameter of less than 8 μm.

公开(公告)号：US12219739B2

公开(公告)日：2025-02-04

申请号：US17911890

申请日：2021-03-11

Applicant: DENKA COMPANY LIMITED

Inventor： Daisuke Goto ,  Hiroaki Ota

IPC: H05K7/20

Abstract: An element-mounted board includes a heat-dissipating plate in which aluminum or magnesium-containing metal layers are formed on both front and back surfaces of a flat plate-shaped metal-silicon carbide complex including aluminum or magnesium, and an electronic element including a ceramic plate, which is mounted on one surface side of the heat-dissipating plate, in which a flatness of the other surface of the heat-dissipating plate is 600 μm or less.

公开(公告)号：US10529591B2

公开(公告)日：2020-01-07

申请号：US15535627

申请日：2015-12-10

Applicant: DENKA COMPANY LIMITED

Inventor： Takeshi Miyakawa ,  Daisuke Goto

IPC: C04B41/88 ,  C04B35/565 ,  B28B1/14 ,  B28B11/24 ,  B28B3/00 ,  C04B35/64 ,  H01L21/48 ,  C04B38/06 ,  H01L23/373

Abstract: A silicon carbide composite that is lightweight and has high thermal conductivity as well as a low thermal expansion coefficient close to that of a ceramic substrate, particularly a silicon carbide composite material suitable for heat dissipating components that are required to be particularly free of warping, such as heat sinks. A method for manufacturing a silicon carbide composite obtained by impregnating a porous silicon carbide molded body with a metal having aluminum as a main component, wherein the method for manufacturing a silicon carbide composite material is characterized in that the porous silicon carbide molded article is formed by a wet molding method, and preferably the wet molding method is a wet press method or is a wet casting method.