公开(公告)号：US11973002B2

公开(公告)日：2024-04-30

申请号：US17777549

申请日：2020-11-12

Applicant: Denka Company Limited

Inventor： Atsushi Sakai ,  Masaya Yumiba ,  Kentaro Nakayama ,  Yoshitaka Taniguchi

IPC: H01L23/373 ,  C23C4/073 ,  C23C4/08 ,  C23C4/18 ,  C23C28/00 ,  H01L21/48 ,  H01L23/00

CPC classification number: H01L23/3735 ,  C23C4/073 ,  C23C4/08 ,  C23C4/18 ,  C23C28/321 ,  H01L21/4857 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/29139 ,  H01L2224/32227

Abstract: A composite substrate includes, in this order: a ceramic plate; a metal layer containing at least one selected from the group consisting of aluminum and an aluminum alloy; and a thermal sprayed layer containing at least one selected from the group consisting of copper and a copper alloy, and an intermetallic compound containing copper and aluminum as constituent elements is scattered between the metal layer and the thermal sprayed layer.

公开(公告)号：US11570901B2

公开(公告)日：2023-01-31

申请号：US16488776

申请日：2018-02-22

Applicant: NATIONAL INSTITUTE FOR MATERIALS SCIENCE ,  DENKA COMPANY LIMITED

Inventor： Seiji Kuroda ,  Hiroshi Araki ,  Akira Hasegawa ,  Makoto Watanabe ,  Atsushi Sakai ,  Yoshitaka Taniguchi ,  Suzuya Yamada

IPC: H05K3/14 ,  C22C21/06 ,  H05K1/03

Abstract: A method for manufacturing an aluminum circuit board including a step of spraying a heated metal powder containing aluminum particles and/or aluminum alloy particles to a ceramic base material, and of forming a metal layer on a surface of the ceramic base material. A temperature of at least a part of the metal powder is higher than or equal to a softening temperature of the metal powder and lower than or equal to a melting point of the metal powder at a time point of reaching the surface of the ceramic base material. A velocity of at least a part of the metal powder is greater than or equal to 450 m/s and less than or equal to 1000 m/s at the time point of reaching the surface of the ceramic base material.

公开(公告)号：US11732173B2

公开(公告)日：2023-08-22

申请号：US17588757

申请日：2022-01-31

Applicant: DENKA COMPANY LIMITED

Inventor： Go Takeda ,  Yoshitaka Taniguchi

IPC: C08K5/14 ,  C09K5/14 ,  C01B21/064 ,  C08K3/38 ,  C08K9/02 ,  C08K9/04 ,  C09C3/00 ,  C09C3/04 ,  C09C3/06 ,  C09C3/08

CPC classification number: C09K5/14 ,  C01B21/0645 ,  C01B21/0648 ,  C08K3/38 ,  C08K9/02 ,  C08K9/04 ,  C09C3/006 ,  C09C3/041 ,  C09C3/066 ,  C09C3/08 ,  C01P2002/76 ,  C01P2004/03 ,  C01P2004/50 ,  C01P2004/61 ,  C01P2004/80 ,  C01P2006/32 ,  C08K2003/385 ,  C08K2201/001 ,  C08K2201/004 ,  C08K2201/005

Abstract: A surface-treated aggregated boron nitride powder is prepared by using the boron nitride powder as the raw material, adding an oxidizer to the boron nitride aggregated grains, wet-pulverizing or wet-crushing the grains for surface modification treatment of the particles and allowing reaction of the particles with a metal coupling agent. The surface-treated boron nitride aggregated grains are formed by aggregation of hexagonal h-BN primary particles; (B) have any one or more of Si, Ti, Zr, Ce, Al, Mg, Ge, Ga, and V in an amount of 0.1 atm % or more and 3.0 atm % or less in its composition on the surface of 10 nm; (C) have a crushing strength of 5 MPa or more; and (D) have an average particle diameter of 20 μm or more and 100 μm or less.

公开(公告)号：US11268004B2

公开(公告)日：2022-03-08

申请号：US16339978

申请日：2017-08-31

Applicant: DENKA COMPANY LIMITED

Inventor： Go Takeda ,  Yoshitaka Taniguchi

IPC: C08K3/38 ,  C08K9/02 ,  C09K5/14 ,  C01B21/064 ,  C08K9/04 ,  C09C3/00 ,  C09C3/04 ,  C09C3/06 ,  C09C3/08

Abstract: A boron nitride powder includes boron nitride aggregated grains that are formed by aggregation of scaly hexagonal boron nitride primary particles, the boron nitride powder having the following characteristic properties (A) to (C): (A) the primary particles of the scaly hexagonal boron nitride have an average long side length of 1.5 μm or more and 3.5 μm or less and a standard deviation of 1.2 μm or less; (B) the boron nitride aggregated grains have a grain strength of 8.0 MPa or more at a cumulative breakdown rate of 63.2% and a grain strength of 4.5 MPa or more at a cumulative breakdown rate of 20.0%; and (C) the boron nitride powder has an average particle diameter of 20 μm or more and 100 μm or less. Also provided are a method for producing the same and a thermally conductive resin composition including the same.

公开(公告)号：US12187608B2

公开(公告)日：2025-01-07

申请号：US16755715

申请日：2018-08-17

Applicant: DENKA COMPANY LIMITED

Inventor： Go Takeda ,  Michiharu Nakashima ,  Yoshitaka Taniguchi

IPC: C01B21/064

Abstract: To provide a boron nitride powder having excellent heat conductivity and high particle strength. Provided is a boron nitride powder which comprises bulky boron nitride formed such that scaly primary particles of hexagonal boron nitride are aggregated to form bulky particles, and which has the following characteristics (A) to (C): (A) a particle strength of the bulky particles at a cumulative breakdown rate of 63.2% is 5.0 MPa or more; (B) an average particle size of the boron nitride powder is 2 μm or more and 20 μm or less; and (C) an orientation index of the boron nitride powder as determined from X-ray diffraction is 20 or less.

公开(公告)号：US11096278B2

公开(公告)日：2021-08-17

申请号：US16636239

申请日：2018-07-30

Applicant: DENKA COMPANY LIMITED

Inventor： Atsushi Sakai ,  Hideki Hirotsuru ,  Kohki Ichikawa ,  Yoshitaka Taniguchi

IPC: H05K1/03 ,  H05K1/05

Abstract: A ceramic circuit board includes a ceramic substrate and metal layers provided to both surfaces of the ceramic substrate and containing Al and/or Cu, wherein a measurement value α1 of a linear thermal expansion coefficient at 25° C. to 150° C. is 5×10−6 to 9×10−6/K, a ratio α1/α2 of the α1 to a theoretical value α2 of the linear thermal expansion coefficient at 25° C. to 150° C. is 0.7 to 0.95, and at least one of the metal layers forms a metal circuit.

公开(公告)号：US10233125B2

公开(公告)日：2019-03-19

申请号：US15127214

申请日：2015-03-18

Applicant: DENKA COMPANY LIMITED

Inventor： Daisuke Goto ,  Hideki Hirotsuru ,  Yoshitaka Taniguchi ,  Goh Iwamoto ,  Kazunori Koyanagi

IPC: C04B35/80 ,  C04B41/88 ,  C04B41/00 ,  C04B41/51 ,  H01L23/373 ,  H01L21/48 ,  C04B111/00

Abstract: To provide an aluminum-silicon carbide composite which is suitable for use as a power-module base plate. An aluminum-silicon carbide composite wherein a peripheral portion having, as a main component thereof, an aluminum-ceramic fiber composite containing ceramic fibers having an average fiber diameter of at most 20 μm and an average aspect ratio of at least 100, is provided on the periphery of a flat plate-shaped aluminum-silicon carbide composite having a plate thickness of 2 to 6 mm formed by impregnating, with a metal containing aluminum, a porous silicon carbide molded body having a silicon carbide content of 50 to 80 vol %, and wherein the proportion of the aluminum-ceramic fiber composite occupied in the peripheral portion is at least 50 area %.

公开(公告)号：US11160172B2

公开(公告)日：2021-10-26

申请号：US16477628

申请日：2018-01-16

Applicant: DENKA COMPANY LIMITED

Inventor： Atsushi Sakai ,  Yoshitaka Taniguchi ,  Suzuya Yamada

IPC: C23C24/04 ,  H05K3/14

Abstract: A method for producing a ceramic circuit board including a ceramic substrate and a metal circuit formed on the ceramic substrate. The disclosed method includes a step of forming the first metal layer in contact with the ceramic substrate by spraying a first metal powder containing at least either of aluminum particles or aluminum alloy particles together with an inert gas onto a surface of a ceramic substrate from a nozzle, in which the first metal powder is heated to from 10° C. to 270° C. and then ejected from the nozzle 10 and a gauge pressure of the inert gas at an inlet of the nozzle 10 is from 1.5 to 5.0 MPa, a step of subjecting the first metal layer to a heat treatment in an inert gas atmosphere, and the like.

公开(公告)号：US11094648B2

公开(公告)日：2021-08-17

申请号：US16636184

申请日：2018-07-30

Applicant: DENKA COMPANY LIMITED

Inventor： Hideki Hirotsuru ,  Yoshitaka Taniguchi ,  Kohki Ichikawa ,  Atsushi Sakai

IPC: H01L23/00 ,  H01L23/15 ,  H01L25/07

Abstract: A power module includes a base plate, a ceramic insulating substrate bonded on the base plate, and a semiconductor element bonded on the ceramic insulating substrate, wherein a surface of the base plate on a side opposite to the ceramic insulating substrate has a warp with a convex shape, and a linear thermal expansion coefficient α1 (×10−6/K) of the base plate and a linear thermal expansion coefficient α2 (×10−6/K) of the ceramic insulating substrate when a temperature decreases in the range of 25° C. to 150° C. satisfy the following Expression (1).  α ⁢ ⁢ 1 - α ⁢ ⁢ 2  ( α ⁢ ⁢ 1 + α ⁢ ⁢ 2 ) ⁢ / ⁢ 2 × 100 ≤ 10 ( 1 )

公开(公告)号：US10752503B2

公开(公告)日：2020-08-25

申请号：US16343574

申请日：2017-08-31

Applicant: DENKA COMPANY LIMITED

Inventor： Go Takeda ,  Yoshitaka Taniguchi ,  Takemi Oguma

IPC: C01B21/064 ,  C08K3/38 ,  C08K9/04 ,  C08L101/00 ,  C08K3/013

Abstract: The present invention provides a spherical boron nitride fine powder and the other superior in filling property into resin. The present invention relates to a spherical boron nitride fine powder having the following characteristics (A) to (C): (A) the spherical boron nitride fine particles have any one or more of Si, Ti, Zr, Ce, Al, Mg, Ge, Ga, and V in an amount of 0.1 atm % or more and 3.0 atm % or less in its composition on the surface of 10 nm; (B) the spherical boron nitride fine powder has an average particle diameter of 0.05 μm or more and 1 μm or less; and (C) the spherical boron nitride fine powder has an average circularity of 0.8 or more.