公开(公告)号：US09686854B2

公开(公告)日：2017-06-20

申请号：US14427458

申请日：2013-09-24

Applicant: DENSO CORPORATION

Inventor： Yuuki Sanada ,  Norihisa Imaizumi ,  Shinya Uchibori ,  Masaji Imada ,  Toshihiro Nakamura ,  Eiji Yabuta ,  Masayuki Takenaka

IPC: H05K1/00 ,  H05K1/02 ,  H05K1/18 ,  H01L23/13 ,  H05K7/20 ,  H01L23/367 ,  H01L23/373

CPC classification number: H05K1/0204 ,  H01L23/13 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/3735 ,  H01L2224/32225 ,  H01L2924/13055 ,  H01L2924/19105 ,  H05K1/0206 ,  H05K1/0209 ,  H05K1/181 ,  H05K1/182 ,  H05K7/205 ,  H05K7/20854 ,  H05K2201/09781 ,  H05K2201/10166 ,  H01L2924/00

Abstract: In an electronic device, a heat generating element is connected directly to an electrically-conductive joining material that is the start point of the heat dissipation path on the one surface of the substrate, and the other surface of the substrate is provided by an other surface side insulating layer. An electrically-conductive other surface side electrode connected to an external heat dissipation member is disposed on the surface of the other surface side insulating layer right under the heat generating element. On the other surface side of the substrate, an other surface side inner layer wire that is the end point of the heat dissipation path extends to the other surface side insulating layer and is insulated electrically from the other surface side electrode through the other surface side insulating layer.

公开(公告)号：US09980407B2

公开(公告)日：2018-05-22

申请号：US15507364

申请日：2015-09-17

Applicant: DENSO CORPORATION

Inventor： Takashi Yoshimizu ,  Yuuki Sanada

IPC: H05K7/20 ,  H05K7/14 ,  H01L23/498 ,  H01L23/31 ,  H01L23/053 ,  H05K1/18 ,  H01L23/10 ,  H01G2/06 ,  H01G2/10 ,  H05K1/11 ,  H01L23/367 ,  H01G2/08 ,  H05K1/02 ,  H01L23/473

CPC classification number: H05K7/1427 ,  H01G2/065 ,  H01G2/08 ,  H01G2/103 ,  H01L23/053 ,  H01L23/10 ,  H01L23/12 ,  H01L23/28 ,  H01L23/3121 ,  H01L23/3675 ,  H01L23/49827 ,  H01L23/49844 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/115 ,  H05K1/117 ,  H05K1/181 ,  H05K3/284 ,  H05K2201/09609 ,  H05K2201/10015 ,  H05K2201/10166 ,  H05K2201/10303 ,  H05K2201/10371 ,  H05K2201/1056 ,  H05K2201/1059 ,  H05K2203/1327 ,  H01L2924/00

Abstract: An electronic device includes a circuit board with an insulating substrate, a wiring at the substrate, an electronic component mounted at the substrate and electrically connected to the wiring, at least one through hole through the substrate from one surface to an opposite surface of the one surface of the substrate, and a conductive member arranged at a surface of the through hole and electrically connected to the wiring; and further includes: a sealing resin; and a cap including an annular connection with a part connected to the substrate and a recess recessed from the annular connection. Furthermore, in the cap, at least a part of the connection is connected to the substrate, the cap being sealed integrally with the electronic component by the sealing resin while arranging a space communicating with the through hole; and a terminal is inserted into the through hole and electrically connected to the wiring.

公开(公告)号：US09941182B2

公开(公告)日：2018-04-10

申请号：US14894637

申请日：2014-06-03

Applicant: DENSO CORPORATION

Inventor： Norihisa Imaizumi ,  Yuuki Sanada ,  Masayuki Takenaka ,  Shinya Uchibori ,  Kengo Oka ,  Tasuke Fukuda ,  Keitarou Nakama

IPC: H01L29/49 ,  H01L23/31 ,  H01L25/00 ,  H01L21/56 ,  H01L23/00 ,  H01L23/498

CPC classification number: H01L23/3121 ,  H01L21/561 ,  H01L23/49838 ,  H01L24/97 ,  H01L25/00 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/00

Abstract: In a substrate, at least one lateral surface between one surface and another surface is a cut surface that is cut together with mold resin. The mold resin, which is cut together with the substrate, is provided with a surface that is flush with the cut surface. A portion of the mold resin constituting the surface flush with the cut surface has a surface that is joined to the surface flush with the cut surface and parallel to the one surface of the substrate; this portion is thinner than a portion that seals electronic parts. Consequently, the mold resin is cut with a dicing blade brought into contact with a surface parallel to the one surface of the substrate.