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公开(公告)号：US10833209B2
公开(公告)日：2020-11-10
申请号：US16330878
申请日：2017-09-05
Applicant: DOWA Electronics Materials Co., Ltd.
Inventor： Kenichi Harigae , Hiroshi Kamiga , Noriaki Nogami
IPC: H01L21/00 , H01L31/0224 , H01B1/22 , B22F1/00 , B22F1/02 , B22F9/24 , H01L31/0216
Abstract: A conductive paste including: a conductive powder containing silver; an indium powder; a silver-tellurium-coated glass powder; a solvent; and an organic binder, wherein the silver-tellurium-coated glass powder is a silver-tellurium-coated glass powder including a tellurium-based glass powder containing tellurium in an amount of 20% by mass or more, and a coating layer on a surface of the tellurium-based glass powder, the coating layer containing silver and tellurium as a main component.
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公开(公告)号：US10272490B2
公开(公告)日：2019-04-30
申请号：US15514879
申请日：2015-09-25
Applicant: DOWA Electronics Materials Co., Ltd.
Inventor： Naoki Tahara , Noriaki Nogami , Hiroshi Kamiga
IPC: H01B1/02 , B22F1/00 , B22F9/24 , C09D5/24 , C09D11/52 , C09D101/28 , H01B1/22 , C09D11/30 , C09D7/40
Abstract: A silver powder, wherein the silver powder satisfies D50-IPA>D50-W, where in measurement of a volume-based particle size distribution of the silver powder by a laser diffraction particle size distribution analysis, D50-IPA (μm) is a cumulative 50% point of particle diameter of the silver powder when isopropyl alcohol (IPA) is used as a measurement solvent for dispersing the silver powder, and D50-W (μm) is a cumulative 50% point of particle diameter of the silver powder when water is used as a measurement solvent for dispersing the silver powder, and wherein a phosphorus content in the silver powder is 0.01% by mass or more but 0.3% by mass or less.
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公开(公告)号：US10170213B2
公开(公告)日：2019-01-01
申请号：US15859909
申请日：2018-01-02
Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.
Inventor： Yoshiyuki Michiaki , Hiroshi Kamiga
IPC: H01B1/22 , H01L31/0224 , C09D5/24 , C09D101/28 , B22F1/00 , C08K9/04 , B22F9/24
Abstract: There is provided a silver powder, which is able to obtain a conductive paste having a high thixotropic ratio and a high Casson yield value and which is able to form a conductive pattern having a low resistance, and a method for producing the same. An aliphatic amine such as hexadecylamine is added to a silver powder, the surface of which is coated with a fatty acid such as stearic acid, to be stirred and mixed to form the aliphatic amine on the outermost surface of the silver powder while allowing the fatty acid to react with the aliphatic amine to form an aliphatic amide such as hexadecanamide between the fatty acid and the aliphatic amine.
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公开(公告)号：US20190189810A1
公开(公告)日：2019-06-20
申请号：US16330878
申请日：2017-09-05
Applicant: DOWA Electronics Materials Co., Ltd.
Inventor： Kenichi Harigae , Hiroshi Kamiga , Noriaki Nogami
IPC: H01L31/0224 , B22F1/00 , H01B1/22
Abstract: A conductive paste including: a conductive powder containing silver; an indium powder; a silver-tellurium-coated glass powder; a solvent; and an organic binder, wherein the silver-tellurium-coated glass powder is a silver-tellurium-coated glass powder including a tellurium-based glass powder containing tellurium in an amount of 20% by mass or more, and a coating layer on a surface of the tellurium-based glass powder, the coating layer containing silver and tellurium as a main component.
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公开(公告)号：US20190080815A1
公开(公告)日：2019-03-14
申请号：US15762766
申请日：2017-03-15
Applicant: DOWA Electronics Materials Co., Ltd.
Inventor： Hiroshi Kamiga , Taro Nakanoya , Noriaki Nogami , Kenichi Harigae
IPC: H01B1/22 , C03C17/06 , C03C3/12 , H01L31/0224
CPC classification number: H01B1/22 , C03C3/122 , C03C3/321 , C03C8/02 , C03C8/16 , C03C8/18 , C03C17/06 , C03C17/10 , C03C2217/256 , C03C2217/268 , C03C2217/27 , H01L31/022425 , H01L31/1804 , Y02E10/50 , Y02P70/521
Abstract: Provided is a silver-tellurium-coated glass powder including: a tellurium-based glass powder containing tellurium in an amount of 20% by mass or more; and a coating layer on a surface of the tellurium-based glass powder, the coating layer containing silver and tellurium as a main component. Preferable aspects include an aspect where the coating layer containing silver and tellurium as a main component further contains a component that is other than silver and tellurium and contained in the tellurium-based glass powder, and an aspect where the component that is lo other than silver and tellurium and contained in the tellurium-based glass powder contains one or more kinds selected from zinc, lead, bismuth, silicon, lithium, and aluminum.
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Patent Agency Ranking
公开(公告)号：US20170259333A1
公开(公告)日：2017-09-14
申请号：US15500152
申请日：2015-07-27
Applicant: DOWA Electronics Materials Co., Ltd.
Inventor： Taro Nakanoya , Hiroshi Kamiga
CPC classification number: B22F1/0062 , B22F1/0014 , B22F9/24 , B22F2009/245 , B22F2301/255 , B22F2304/10 , B22F2998/10 , C01P2004/51 , C01P2006/12 , C09C1/62 , C09C3/06 , C09C3/08 , C09C3/10 , H01B1/22 , H01B5/002 , B22F3/10
Abstract: A silver powder, including: an organic substance on a surface of the silver powder, the organic substance containing at least one carboxyl group and at least one hydroxyl group in one molecule of the organic substance, wherein a ratio of (Casson yield value/BET specific surface area) is 500 or less, where the Casson yield value is a Casson yield value of a conductive paste and the BET specific surface area is a BET specific surface area of the silver powder, where the conductive paste has a composition in which the silver powder is 86% by mass, a glass fit is 1% by mass, ethyl cellulose is 0.6% by mass, texanol is 10.5% by mass, and zinc oxide is 1.9% by mass, and the conductive paste is prepared by kneading the composition with a planetary centrifugal stirrer and bubble remover and dispersing with a triple roll mill.
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公开(公告)号：US10807161B2
公开(公告)日：2020-10-20
申请号：US16298595
申请日：2019-03-11
Applicant: DOWA Electronics Materials Co., Ltd.
Inventor： Naoki Tahara , Noriaki Nogami , Hiroshi Kamiga
IPC: B22F1/00 , C09D11/30 , C09D7/40 , C08K9/04 , B22F9/24 , C09D5/24 , C09D11/52 , C09D101/28 , H01B1/22 , C08K3/08
Abstract: A silver powder, wherein the silver powder satisfies D50-IPA>D50-W, where in measurement of a volume-based particle size distribution of the silver powder by a laser diffraction particle size distribution analysis, D50-IPA (μm) is a cumulative 50% point of particle diameter of the silver powder when isopropyl alcohol (IPA) is used as a measurement solvent for dispersing the silver powder, and D50-W (μm) is a cumulative 50% point of particle diameter of the silver powder when water is used as a measurement solvent for dispersing the silver powder, and wherein a phosphorus content in the silver powder is 0.01% by mass or more but 0.3% by mass or less.
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公开(公告)号：US10460851B2
公开(公告)日：2019-10-29
申请号：US15762766
申请日：2017-03-15
Applicant: DOWA Electronics Materials Co., Ltd.
Inventor： Hiroshi Kamiga , Taro Nakanoya , Noriaki Nogami , Kenichi Harigae
IPC: H01B1/22 , C03C17/06 , C03C3/12 , H01L31/0224 , C03C3/32 , C03C8/02 , C03C8/16 , C03C8/18 , C03C17/10 , H01L31/18
Abstract: Provided is a silver-tellurium-coated glass powder including: a tellurium-based glass powder containing tellurium in an amount of 20% by mass or more; and a coating layer on a surface of the tellurium-based glass powder, the coating layer containing silver and tellurium as a main component. Preferable aspects include an aspect where the coating layer containing silver and tellurium as a main component further contains a component that is other than silver and tellurium and contained in the tellurium-based glass powder, and an aspect where the component that is lo other than silver and tellurium and contained in the tellurium-based glass powder contains one or more kinds selected from zinc, lead, bismuth, silicon, lithium, and aluminum.
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公开(公告)号：US10381124B2
公开(公告)日：2019-08-13
申请号：US15754467
申请日：2016-08-22
Applicant: DOWA Electronics Materials Co., Ltd.
Inventor： Naoki Tahara , Hiroshi Kamiga
Abstract: To provide a silver powder including alkenylsuccinic anhydride and/or alkenylsuccinic acid on a surface of the silver powder.
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公开(公告)号：US10252331B2
公开(公告)日：2019-04-09
申请号：US15500152
申请日：2015-07-27
Applicant: DOWA Electronics Materials Co., Ltd.
Inventor： Taro Nakanoya , Hiroshi Kamiga
Abstract: A silver powder, including: an organic substance on a surface of the silver powder, the organic substance containing at least one carboxyl group and at least one hydroxyl group in one molecule of the organic substance, wherein a ratio of (Casson yield value/BET specific surface area) is 500 or less, where the Casson yield value is a Casson yield value of a conductive paste and the BET specific surface area is a BET specific surface area of the silver powder, where the conductive paste has a composition in which the silver powder is 86% by mass, a glass fit is 1% by mass, ethyl cellulose is 0.6% by mass, texanol is 10.5% by mass, and zinc oxide is 1.9% by mass, and the conductive paste is prepared by kneading the composition with a planetary centrifugal stirrer and bubble remover and dispersing with a triple roll mill.
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