公开(公告)号：US20210090932A1

公开(公告)日：2021-03-25

申请号：US16675559

申请日：2019-11-06

Applicant: Daegu Gyeongbuk Institute of Science and Technology

Inventor： Kyung In Jang ,  Ho Hyun Keum ,  Jong Cheol Rah ,  Seung Kyoung Heo

IPC: H01L21/683 ,  B32B37/00 ,  C09J5/00 ,  C09J7/38

Abstract: A method of manufacturing an electronic device is provided. The method includes forming a stack structure by placing a to-be-peeled layer on a substrate, applying thermal shock to the stack structure, detaching the to-be-peeled layer from the substrate, and transferring the detached to-be-peeled layer to a target substrate.

公开(公告)号：US20210137456A1

公开(公告)日：2021-05-13

申请号：US16793775

申请日：2020-02-18

Applicant: Daegu Gyeongbuk Institute of Science and Technology

Inventor： Kyung In JANG ,  Jong Cheol Rah ,  Han Hee Jung

IPC: A61B5/00

Abstract: Provided is an implantable biosensor including an intermediate layer; a first electrode layer provided on one surface of the intermediate layer and including a first electrode configured to react with a bio material and an auxiliary electrode electrically connected to the first electrode; and a second electrode layer provided on another surface of the intermediate layer to face the first electrode layer and including a second electrode operating as a reference electrode.

公开(公告)号：US11925478B2

公开(公告)日：2024-03-12

申请号：US16793775

申请日：2020-02-18

Applicant: Daegu Gyeongbuk Institute of Science and Technology

Inventor： Kyung In Jang ,  Jong Cheol Rah ,  Han Hee Jung

IPC: A61B5/00 ,  B82Y30/00

CPC classification number: A61B5/686 ,  A61B2562/0295 ,  A61B2562/18 ,  B82Y30/00

Abstract: Provided is an implantable biosensor including an intermediate layer; a first electrode layer provided on one surface of the intermediate layer and including a first electrode configured to react with a bio material and an auxiliary electrode electrically connected to the first electrode; and a second electrode layer provided on another surface of the intermediate layer to face the first electrode layer and including a second electrode operating as a reference electrode.

公开(公告)号：US11367647B2

公开(公告)日：2022-06-21

申请号：US16675559

申请日：2019-11-06

Applicant: Daegu Gyeongbuk Institute of Science and Technology

Inventor： Kyung In Jang ,  Ho Hyun Keum ,  Jong Cheol Rah ,  Seung Kyoung Heo

IPC: B32B43/00 ,  H01L21/683 ,  C09J7/38 ,  B32B37/00 ,  C09J5/00 ,  B32B38/10

Abstract: A method of manufacturing an electronic device is provided. The method includes forming a stack structure by placing a to-be-peeled layer on a substrate, applying thermal shock to the stack structure, detaching the to-be-peeled layer from the substrate, and transferring the detached to-be-peeled layer to a target substrate.