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公开(公告)号:US20190187007A1
公开(公告)日:2019-06-20
申请号:US16331007
申请日:2016-09-08
Inventor: Jae Eun Jang , Minkyung Sim , Kwon Sik Shin , Ji-Woong Choi , Cheil Moon , Hongsoo Choi
CPC classification number: G01K13/00 , B25J9/16 , B25J11/00 , B25J13/08 , B25J19/02 , G01K7/04 , G01L1/16 , G01L5/0038
Abstract: Provided is a pain detecting method including obtaining an electric signal from applied pressure and heat by using a sensor unit including a material exhibiting both the piezoelectric characteristic and the thermoelectric characteristic; separating a pressure signal generated by the pressure and a heat signal generated by the heat from the obtained electric signal; determining whether to generate pain data from each of the pressure signal and the heat signal; and outputting the pain data.
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公开(公告)号:US10684180B2
公开(公告)日:2020-06-16
申请号:US15983878
申请日:2018-05-18
Inventor: Jae Eun Jang , Kyung Hwa Lee , Minkyung Sim , Cheil Moon , Ji-Woong Choi , Hongsoo Choi
Abstract: A pain sensing device includes a sensor array including a plurality of sensors that sense pressure generated due to a contact of an object and output electrical piezoelectric signals; and a signal processor configured to recognize the shape of the object based on the number of sensors that output the piezoelectric signals among the plurality of sensors, and to generate a pain signal according to the recognized shape of the object.
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公开(公告)号:US10935442B2
公开(公告)日:2021-03-02
申请号:US16331007
申请日:2016-09-08
Inventor: Jae Eun Jang , Minkyung Sim , Kwon Sik Shin , Ji-Woong Choi , Cheil Moon , Hongsoo Choi
Abstract: Provided is a pain detecting method including obtaining an electric signal from applied pressure and heat by using a sensor unit including a material exhibiting both the piezoelectric characteristic and the thermoelectric characteristic; separating a pressure signal generated by the pressure and a heat signal generated by the heat from the obtained electric signal; determining whether to generate pain data from each of the pressure signal and the heat signal; and outputting the pain data.
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公开(公告)号:US10001422B2
公开(公告)日:2018-06-19
申请号:US15235395
申请日:2016-08-12
Inventor: Jae Eun Jang , Kyung Hwa Lee , Minkyung Sim , Cheil Moon , Ji-Woong Choi , Hongsoo Choi
CPC classification number: G01L1/16 , A61B5/4824 , A61B2562/0247 , A61B2562/046 , G06N3/008
Abstract: A pain sensing device includes a sensor array including a plurality of sensors that sense pressure generated due to a contact of an object and output electrical piezoelectric signals; and a signal processor configured to recognize the shape of the object based on the number of sensors that output the piezoelectric signals among the plurality of sensors, and to generate a pain signal according to the recognized shape of the object.
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