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    SMART CARDS WITH METAL LAYER(S) AND METHODS OF MANUFACTURE
    1.
    发明申请
    SMART CARDS WITH METAL LAYER(S) AND METHODS OF MANUFACTURE 有权

    公开(公告)号：US20210192312A1

    公开(公告)日：2021-06-24

    申请号：US17006798

    申请日：2020-08-29

    Applicant: Mustafa Lotya ,  David Finn ,  Darren Molloy

    Inventor： Mustafa Lotya ,  David Finn ,  Darren Molloy

    IPC: G06K19/077 ,  H01Q1/22 ,  H01Q21/29 ,  H01Q7/00 ,  H05K1/16

    Abstract: Smartcards with metal layers manufactured according to various techniques disclosed herein. One or more metal layers of a smartcard stackup may be provided with slits overlapping at least a portion of a module antenna in an associated transponder chip module disposed in the smartcard so that the metal layer functions as a coupling frame. One or more metal layers may be pre-laminated with plastic layers to form a metal core or clad subassembly for a smartcard, and outer printed and/or overlay plastic layers may be laminated to the front and/or back of the metal core. Front and back overlays may be provided. Various constructions of and manufacturing techniques (including temperature, time, and pressure regimes for laminating) for smartcards are disclosed herein.

    Smart cards with metal layer(s) and methods of manufacture
    2.
    发明授权
    Smart cards with metal layer(s) and methods of manufacture 有权

    公开(公告)号：US10977542B2

    公开(公告)日：2021-04-13

    申请号：US16729530

    申请日：2019-12-30

    Applicant: Mustafa Lotya ,  Darren Molloy ,  David Finn

    Inventor： Mustafa Lotya ,  Darren Molloy ,  David Finn

    IPC: G06K19/00 ,  G06K19/077 ,  G06K19/07

    Abstract: Metal layers of a smartcard may be provided with slits overlapping at least a portion of a module antenna in an associated transponder chip module disposed in the smartcard so that the metal layer functions as a coupling frame. One or more metal layers may be pre-laminated with plastic layers to form a metal core or clad subassembly for a smartcard, and outer printed and/or overlay plastic layers may be laminated to the front and/or back of the metal core. Front and back overlays may be provided. Pre-laminated metal layers having an array of card sites, with each position having a defined area prepared for the later implanting of a transponder chip module characterized by different sized perforations and gaps around this defined area adjacent to the RFID slit(s), to facilitate the quick removal of the metal in creating a pocket to accept a transponder chip module.

    SMART CARDS WITH METAL LAYER(S) AND METHODS OF MANUFACTURE
    3.
    发明申请
    SMART CARDS WITH METAL LAYER(S) AND METHODS OF MANUFACTURE 有权

    公开(公告)号：US20210056375A1

    公开(公告)日：2021-02-25

    申请号：US17006797

    申请日：2020-08-29

    Applicant: Mustafa Lotya ,  David Finn ,  Darren Molloy

    Inventor： Mustafa Lotya ,  David Finn ,  Darren Molloy

    IPC: G06K19/077 ,  H01Q1/22 ,  H01Q21/29 ,  H01Q7/00 ,  H05K1/16

    Abstract: Smartcards with metal layers manufactured according to various techniques disclosed herein. One or more metal layers of a smartcard stackup may be provided with slits overlapping at least a portion of a module antenna in an associated transponder chip module disposed in the smartcard so that the metal layer functions as a coupling frame. One or more metal layers may be pre-laminated with plastic layers to form a metal core or clad subassembly for a smartcard, and outer printed and/or overlay plastic layers may be laminated to the front and/or back of the metal core. Front and back overlays may be provided. Various constructions of and manufacturing techniques (including temperature, time, and pressure regimes for laminating) for smartcards are disclosed herein.

    SMARTCARD WITH A COUPLING FRAME AND A WIRELESS CONNECTION BETWEEN MODULES
    4.
    发明申请
    SMARTCARD WITH A COUPLING FRAME AND A WIRELESS CONNECTION BETWEEN MODULES 审中-公开

    公开(公告)号：US20200327387A1

    公开(公告)日：2020-10-15

    申请号：US16865354

    申请日：2020-05-03

    Applicant: Mustafa Lotya ,  David Finn

    Inventor： Mustafa Lotya ,  David Finn

    IPC: G06K19/07

    Abstract: A wireless connection is established between at least two electronic modules (M1, M2) disposed separate from one another in a smartcard having a coupling frame so that the two modules may communicate (signals, data) with each other. The two modules may each have module antennas (MA-1, MA-2), and may be disposed in respective two openings (MO-1, MO-2) of a coupling frame (CF). A coupling antenna (CPA) having two coupler coils (CC-1, CC-2) disposed close to the two modules antennas of the two modules. The coupling antenna may have only the two coupler coils (CC-1, CC-2), connected with one another, without the peripheral card antenna (CA) component of a conventional booster antenna (BA). Energy harvesting is disclosed.

    SMART CARDS WITH METAL LAYER(S) AND METHODS OF MANUFACTURE
    5.
    发明申请
    SMART CARDS WITH METAL LAYER(S) AND METHODS OF MANUFACTURE 审中-公开

    公开(公告)号：US20200151534A1

    公开(公告)日：2020-05-14

    申请号：US16729530

    申请日：2019-12-30

    Applicant: Mustafa Lotya ,  Darren Molloy ,  David Finn

    Inventor： Mustafa Lotya ,  Darren Molloy ,  David Finn

    IPC: G06K19/077 ,  G06K19/07

    Abstract: Metal layers of a smartcard may be provided with slits overlapping at least a portion of a module antenna in an associated transponder chip module disposed in the smartcard so that the metal layer functions as a coupling frame. One or more metal layers may be pre-laminated with plastic layers to form a metal core or clad subassembly for a smartcard, and outer printed and/or overlay plastic layers may be laminated to the front and/or back of the metal core. Front and back overlays may be provided. Pre-laminated metal layers having an array of card sites, with each position having a defined area prepared for the later implanting of a transponder chip module characterized by different sized perforations and gaps around this defined area adjacent to the RFID slit(s), to facilitate the quick removal of the metal in creating a pocket to accept a transponder chip module.

    SMARTCARDS, RFID DEVICES, WEARABLES AND METHODS
    6.
    发明申请
    SMARTCARDS, RFID DEVICES, WEARABLES AND METHODS 审中-公开

    公开(公告)号：US20180123221A1

    公开(公告)日：2018-05-03

    申请号：US15662305

    申请日：2017-07-28

    Applicant: David Finn ,  Mustafa Lotya ,  Darren Molloy

    Inventor： David Finn ,  Mustafa Lotya ,  Darren Molloy

    IPC: H01Q1/22 ,  H01Q7/00 ,  H01Q1/38 ,  G06K19/077

    CPC classification number: H01Q1/2225 ,  G06K19/07773 ,  H01Q1/38 ,  H01Q7/005

    Abstract: Coupling frames comprising a conductive (metal) surface with a slit (S) or non-conductive stripe (NCS) extending from an outer edge to an inner position thereof, and overlapping a transponder device. A coupling frame with slit for coupling with an inductive or capacitive device (inductor or capacitor) may be used at any ISM frequency band to concentrate surface current around the slit. The coupling frame can be tuned to operate at a frequency of interested by introducing a resistive, inductive or capacitive element. The resonance frequency of the coupling frame can be matched to that of the transponder chip module to achieve optimum performance. Coupling frames with or without a transponder device may be integrated, overlapping, stacked or placed adjacent to one another to enhance system performance. Multiple coupling frames may be electrically isolated from one another by the application of a dielectric coating such Diamond Like Carbon (DLC).

    PASSIVE SMART CARDS, METAL CARDS, PAYMENT OBJECTS AND SMART JEWELRY
    9.
    发明申请
    PASSIVE SMART CARDS, METAL CARDS, PAYMENT OBJECTS AND SMART JEWELRY 有权
    被动智能卡，金属卡，付款对象和智能珠宝

    公开(公告)号：US20160110639A1

    公开(公告)日：2016-04-21

    申请号：US14862119

    申请日：2015-09-22

    Applicant: David Finn ,  Mustafa Lotya ,  Darren Molloy

    Inventor： David Finn ,  Mustafa Lotya ,  Darren Molloy

    IPC: G06K19/077 ,  G06K7/10

    CPC classification number: G06K19/07788 ,  B23K26/21 ,  B23K26/361 ,  B23K26/362 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/50 ,  G06K7/10336 ,  G06K19/07722 ,  G06K19/07747 ,  G06K19/07756 ,  G06K19/07794 ,  H01Q1/2225 ,  H01Q1/38 ,  H01Q7/00

    Abstract: RFID devices comprising (i) a transponder chip module (TCM, 1410) having an RFIC chip (IC) and a module antenna (MA), and (ii) a coupling frame (CF) having an electrical discontinuity comprising a slit (S) or non-conductive stripe (NCS). The coupling frame may be disposed closely adjacent the transponder chip module so that the slit overlaps the module antenna. The RFID device may be a payment object such as a jewelry item having a metal component modified with a slit (S) to function as a coupling frame. The coupling frame may be moved (such as rotated) to position the slit to selectively overlap the module antennas (MA) of one or more transponder chip modules (TCM-1, TCM-2) disposed in the payment object, thereby selectively enhancing (including enabling) contactless communication between a given transponder chip module in the payment object and another RFID device such as an external contactless reader. The coupling frame may be tubular. A card body construction for a metal smart card is disclosed.

    Abstract translation: RFID设备包括（i）具有RFIC芯片（IC）和模块天线（MA）的应答器芯片模块（TCM，1410），以及（ii）具有包括狭缝（S）的电中断的耦合框架（CF） 或非导电条纹（NCS）。 耦合框架可以紧邻发射机应答器芯片模块设置，使得狭缝与模块天线重叠。 RFID装置可以是支付对象，例如具有用狭缝（S）修改的金属部件的饰品项目，用作耦合框架。 联接框架可以被移动（例如旋转）以将狭缝定位成与布置在付款对象中的一个或多个应答器芯片模块（TCM-1，TCM-2）的模块天线（MA）重叠，从而选择性地增强（ 包括启用）支付对象中的给定应答器芯片模块与另一个RFID设备（例如外部非接触式读取器）之间的非接触式通信。 联接框架可以是管状的。 公开了一种用于金属智能卡的卡体结构。

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