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    Needle alignment for wearable biosensors
    2.
    发明授权
    Needle alignment for wearable biosensors 有权

    公开(公告)号：US11234623B2

    公开(公告)日：2022-02-01

    申请号：US15896164

    申请日：2018-02-14

    Applicant: DexCom, Inc.

    Inventor： Sean Frick

    IPC: A61B5/00 ,  A61B5/1486 ,  A61B5/145

    Abstract: Various examples are described for needle alignment for wearable biosensors. One example device includes a housing comprising an upper portion and a lower portion, the housing defining a cavity between the upper portion and the lower portion and configured to be worn on a wearer's skin, wherein: the upper portion defines a first opening extending through the upper portion to the cavity, and the lower portion defines a second opening extending through the lower portion to the cavity, the cavity establishing a substantially unobstructed pathway including the first opening and the second opening to enable an insertion needle to be inserted through the housing; and a needle guide extending into and along a portion of the pathway and aligned with a sensor wire to enable alignment between the insertion needle and the sensor wire.

    NEEDLE ALIGNMENT FOR WEARABLE BIOSENSORS
    3.
    发明申请
    NEEDLE ALIGNMENT FOR WEARABLE BIOSENSORS 有权

    公开(公告)号：US20220110559A1

    公开(公告)日：2022-04-14

    申请号：US17559936

    申请日：2021-12-22

    Applicant: DexCom, Inc.

    Inventor： Sean Frick

    IPC: A61B5/1486 ,  A61B5/00 ,  A61B5/145

    Abstract: Various examples are described for needle alignment for wearable biosensors. One example device includes a housing comprising an upper portion and a lower portion, the housing defining a cavity between the upper portion and the lower portion and configured to be worn on a wearer's skin, wherein: the upper portion defines a first opening extending through the upper portion to the cavity, and the lower portion defines a second opening extending through the lower portion to the cavity, the cavity establishing a substantially unobstructed pathway including the first opening and the second opening to enable an insertion needle to be inserted through the housing; and a needle guide extending into and along a portion of the pathway and aligned with a sensor wire to enable alignment between the insertion needle and the sensor wire.

    SENSOR INTERPOSER EMPLOYING CASTELLATED THROUGH-VIAS
    5.
    发明申请
    SENSOR INTERPOSER EMPLOYING CASTELLATED THROUGH-VIAS 审中-公开

    公开(公告)号：US20200245459A1

    公开(公告)日：2020-07-30

    申请号：US16850986

    申请日：2020-04-16

    Applicant: DexCom, Inc.

    Inventor： Sean Frick ,  Louis Jung ,  David Lari

    IPC: H05K1/11 ,  A61B5/04 ,  A61B5/00 ,  H01L21/768 ,  H01L23/48 ,  H05K1/02 ,  H05K3/40

    Abstract: An example sensor interposer employing castellated through-vias formed in a PCB includes a planar substrate defining a plurality of castellated through-vias; a first electrical contact formed on the planar substrate and electrically coupled to a first castellated through-via; a second electrical contact formed on the planar substrate and electrically coupled to a second castellated through-via, the second castellated through-via electrically isolated from the first castellated through-via; and a guard trace formed on the planar substrate, the guard trace having a first portion formed on a first surface of the planar substrate and electrically coupling a third castellated through-via to a fourth castellated through-via, the guard trace having a second portion formed on a second surface of the planar substrate and electrically coupling the third castellated through-via to the fourth castellated through-via, the guard trace formed between the first and second electrical contacts to provide electrical isolation between the first and second electrical contacts.

    Sensor interposer employing castellated through-vias
    6.
    发明授权
    Sensor interposer employing castellated through-vias 有权

    公开(公告)号：US12250768B2

    公开(公告)日：2025-03-11

    申请号：US18381074

    申请日：2023-10-17

    Applicant: DexCom, Inc.

    Inventor： Sean Frick ,  Louis Jung ,  David Lari

    IPC: H05K1/02 ,  A61B5/00 ,  H01L21/768 ,  H01L23/48 ,  H01L23/66 ,  H03B5/32 ,  H05K1/11 ,  H05K3/40 ,  A61B5/145 ,  A61B5/1468 ,  G01N27/327 ,  H05K1/14

    Abstract: An example sensor interposer employing castellated through-vias formed in a PCB includes a planar substrate defining a plurality of castellated through-vias; a first electrical contact formed on the planar substrate and electrically coupled to a first castellated through-via; a second electrical contact formed on the planar substrate and electrically coupled to a second castellated through-via, the second castellated through-via electrically isolated from the first castellated through-via; and a guard trace formed on the planar substrate, the guard trace having a first portion formed on a first surface of the planar substrate and electrically coupling a third castellated through-via to a fourth castellated through-via, the guard trace having a second portion formed on a second surface of the planar substrate and electrically coupling the third castellated through-via to the fourth castellated through-via, the guard trace formed between the first and second electrical contacts to provide electrical isolation between the first and second electrical contacts.

    SENSOR INTERPOSER EMPLOYING CASTELLATED THROUGH-VIAS
    8.
    发明公开
    SENSOR INTERPOSER EMPLOYING CASTELLATED THROUGH-VIAS 审中-公开

    公开(公告)号：US20240049388A1

    公开(公告)日：2024-02-08

    申请号：US18381074

    申请日：2023-10-17

    Applicant: DexCom, Inc.

    Inventor： Sean Frick ,  Louis Jung ,  David Lari

    IPC: H05K1/11 ,  A61B5/00 ,  H01L21/768 ,  H01L23/48 ,  H05K1/02 ,  H05K3/40

    CPC classification number: H05K1/112 ,  A61B5/6802 ,  H01L21/768 ,  H01L23/481 ,  H05K1/0262 ,  H05K3/403 ,  H05K2201/10151 ,  H05K2201/09181 ,  H05K2201/10378 ,  H05K2201/09063 ,  A61B5/1468

    Abstract: An example sensor interposer employing castellated through-vias formed in a PCB includes a planar substrate defining a plurality of castellated through-vias; a first electrical contact formed on the planar substrate and electrically coupled to a first castellated through-via; a second electrical contact formed on the planar substrate and electrically coupled to a second castellated through-via, the second castellated through-via electrically isolated from the first castellated through-via; and a guard trace formed on the planar substrate, the guard trace having a first portion formed on a first surface of the planar substrate and electrically coupling a third castellated through-via to a fourth castellated through-via, the guard trace having a second portion formed on a second surface of the planar substrate and electrically coupling the third castellated through-via to the fourth castellated through-via, the guard trace formed between the first and second electrical contacts to provide electrical isolation between the first and second electrical contacts.

    SENSOR INTERPOSER EMPLOYING CASTELLATED THROUGH-VIAS
    9.
    发明申请
    SENSOR INTERPOSER EMPLOYING CASTELLATED THROUGH-VIAS 有权

    公开(公告)号：US20220095454A1

    公开(公告)日：2022-03-24

    申请号：US17542977

    申请日：2021-12-06

    Applicant: DexCom, Inc.

    Inventor： Sean Frick ,  Louis Jung ,  David Lari

    IPC: H05K1/11 ,  A61B5/00 ,  H01L21/768 ,  H01L23/48 ,  H05K1/02 ,  H05K3/40 ,  A61B5/24

    Abstract: An example sensor interposer employing castellated through-vias formed in a PCB includes a planar substrate defining a plurality of castellated through-vias; a first electrical contact formed on the planar substrate and electrically coupled to a first castellated through-via; a second electrical contact formed on the planar substrate and electrically coupled to a second castellated through-via, the second castellated through-via electrically isolated from the first castellated through-via; and a guard trace formed on the planar substrate, the guard trace having a first portion formed on a first surface of the planar substrate and electrically coupling a third castellated through-via to a fourth castellated through-via, the guard trace having a second portion formed on a second surface of the planar substrate and electrically coupling the third castellated through-via to the fourth castellated through-via, the guard trace formed between the first and second electrical contacts to provide electrical isolation between the first and second electrical contacts.

    Sensor interposer employing castellated through-vias
    10.
    发明授权
    Sensor interposer employing castellated through-vias 有权

    公开(公告)号：US10660201B2

    公开(公告)日：2020-05-19

    申请号：US16282587

    申请日：2019-02-22

    Applicant: DexCom, Inc.

    Inventor： Sean Frick ,  Louis Jung ,  David Lari

    IPC: H05K1/02 ,  H05K1/03 ,  H05K1/09 ,  H05K1/11 ,  H05K1/14 ,  H05K1/18 ,  H05K3/00 ,  H05K3/34 ,  H05K3/40 ,  A61B5/04 ,  A61B5/00 ,  H01L21/768 ,  H01L23/48 ,  A61B5/1468 ,  A61B5/145 ,  G01N27/327

    Abstract: An example sensor interposer employing castellated through-vias formed in a PCB includes a planar substrate defining a plurality of castellated through-vias; a first electrical contact formed on the planar substrate and electrically coupled to a first castellated through-via; a second electrical contact formed on the planar substrate and electrically coupled to a second castellated through-via, the second castellated through-via electrically isolated from the first castellated through-via; and a guard trace formed on the planar substrate, the guard trace having a first portion formed on a first surface of the planar substrate and electrically coupling a third castellated through-via to a fourth castellated through-via, the guard trace having a second portion formed on a second surface of the planar substrate and electrically coupling the third castellated through-via to the fourth castellated through-via, the guard trace formed between the first and second electrical contacts to provide electrical isolation between the first and second electrical contacts.

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