中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

10 records (took 0.016 seconds)

    FLEXIBLE ON-CHIP POWER AND CLOCK
    1.
    发明申请
    FLEXIBLE ON-CHIP POWER AND CLOCK 有权

    公开(公告)号：US20210034094A1

    公开(公告)日：2021-02-04

    申请号：US16887056

    申请日：2020-05-29

    Applicant: Drexel University ,  University of South Florida

    Inventor： Baris Taskin ,  Ragh Kuttappa ,  Selcuk Kose

    IPC: G06F1/10 ,  H03K3/012 ,  H01L23/66

    Abstract: Modern integrated circuits have an increasing need for various levels of both supply voltage (V) and operating frequency (f) available at fine spatial and temporal granularity. This work introduces a solution that provides a number and quality of locally distributed V/f domains through FOPAC. Opportunistically sharing design resources and features between multi-phase voltage regulators (MPVRs) and resonant rotary clocks (ReRoCs) enabling i) the scalability to hundreds of domains, ii) fast switching times for both voltage and frequency, leading to temporal flexibility, and iii) locally distributed designs, leading to spatial flexibility.

    Resonant Frequency Divider Design Methodology for Dynamic Frequency Scaling
    2.
    发明申请
    Resonant Frequency Divider Design Methodology for Dynamic Frequency Scaling 有权
    谐振频率分频器设计方法

    公开(公告)号：US20160099708A1

    公开(公告)日：2016-04-07

    申请号：US14876038

    申请日：2015-10-06

    Applicant: Drexel University

    Inventor： Baris Taskin ,  Ying Teng

    IPC: H03K3/03

    CPC classification number: H03K3/0315 ,  H03B5/18 ,  H03B27/00 ,  H03K21/02 ,  H03K21/08 ,  H03K21/10 ,  H03K23/54 ,  H03K27/00

    Abstract: A dynamic rotary traveling wave oscillator circuit includes plurality of multi-output spot-advancing blocks (MOSABs) forming a main-loop and a plurality of multi-input spot-advancing blocks (MISABs) forming a sub-loop. Depending on a desired division ratio, a connection connects blocks on the MOSABs and MISABs to create the desired division ratio.

    Abstract translation: 动态旋转行波振荡器电路包括形成主回路的多个多输出点前进块（MOSAB）和形成子回路的多个多输入点前进块（MISAB）。 根据所需的分频比，连接连接MOSAB和MISAB上的块，以创建所需的分频比。

    TSV-based on-chip antennas, measurement, and evaluation
    5.
    发明授权
    TSV-based on-chip antennas, measurement, and evaluation 有权

    公开(公告)号：US11329362B2

    公开(公告)日：2022-05-10

    申请号：US16719536

    申请日：2019-12-18

    Applicant: Drexel University

    Inventor： Vasil Pano ,  Ibrahim Tekin ,  Baris Taskin ,  Kapil R. Dandekar ,  Yuqiao Liu

    IPC: H01Q1/22 ,  H01Q9/30 ,  H01Q1/48 ,  H01L23/66

    Abstract: On-chip wireless links offer improved network performance due to long distance communication, additional bandwidth, and broadcasting capabilities of antennas. A Through-Silicon Via (TSV)-based antenna design called TSV_A establishes multi-band wireless communication through the silicon substrate medium with only a 3 dB loss over a 30 mm on-chip distance. Simulation results show an improvement in network latency up to ˜13% (average improvement of ˜7%), energy-delay improvements of ˜34% on average, and an improvement in throughput up to ˜34% (average improvement).

    TSV-BASED ON-CHIP ANTENNAS, MEASUREMENT, AND EVALUATION
    6.
    发明申请
    TSV-BASED ON-CHIP ANTENNAS, MEASUREMENT, AND EVALUATION 审中-公开

    公开(公告)号：US20200212538A1

    公开(公告)日：2020-07-02

    申请号：US16719536

    申请日：2019-12-18

    Applicant: Drexel University

    Inventor： Vasil Pano ,  Ibrahim Tekin ,  Baris Taskin ,  Kapil R. Dandekar ,  Yuqiao Liu

    IPC: H01Q1/22 ,  H01Q9/30 ,  H01Q1/48 ,  H01L23/66

    Abstract: On-chip wireless links offer improved network performance due to long distance communication, additional bandwidth, and broadcasting capabilities of antennas. A Through-Silicon Via (TSV)-based antenna design called TSV_A establishes multi-band wireless communication through the silicon substrate medium with only a 3 dB loss over a 30 mm on-chip distance. Simulation results show an improvement in network latency up to ˜13% (average improvement of ˜7%), energy-delay improvements of ˜34% on average, and an improvement in throughput up to ˜34% (average improvement).

    Flexible on-chip power and clock
    7.
    发明授权
    Flexible on-chip power and clock 有权

    公开(公告)号：US11243559B2

    公开(公告)日：2022-02-08

    申请号：US16887056

    申请日：2020-05-29

    Applicant: Drexel University ,  University of South Florida

    Inventor： Baris Taskin ,  Ragh Kuttappa ,  Selcuk Kose

    IPC: G05F1/10 ,  G06F1/10 ,  H03K3/03 ,  H01L23/66 ,  H03K3/012

    Abstract: Modern integrated circuits have an increasing need for various levels of both supply voltage (V) and operating frequency (f) available at fine spatial and temporal granularity. This work introduces a solution that provides a number and quality of locally distributed V/f domains through FOPAC. Opportunistically sharing design resources and features between multi-phase voltage regulators (MPVRs) and resonant rotary clocks (ReRoCs) enabling i) the scalability to hundreds of domains, ii) fast switching times for both voltage and frequency, leading to temporal flexibility, and iii) locally distributed designs, leading to spatial flexibility.

Patent Agency Ranking