Electronic device characterization systems and methods

    公开(公告)号:US11940478B2

    公开(公告)日:2024-03-26

    申请号:US17544916

    申请日:2021-12-07

    CPC classification number: G01R31/003 G01R1/0458

    Abstract: Electronic device characterization platforms, systems, devices, and methods for use in testing instruments, devices, and sensors that is portable, modular, multiplexed, and automated are disclosed. The system includes a substrate, a chip adapter, such as a chip socket, and an optional housing. Chip samples to be tested can be disposed in the chip adapter and various environmental modules designed to supply different environmental conditions to the chip sample can be disposed over the chip adapter, enabling testing of the chip samples to be performed in the different environment conditions. The system can further include various connectors that allow for add-on modules to be included as part of the system. Methods of characterizing electronic devices and sensors are also disclosed.

    Non-Invasive Thickness Measurement Using Capacitance Measurement

    公开(公告)号:US20170307349A1

    公开(公告)日:2017-10-26

    申请号:US15133727

    申请日:2016-04-20

    CPC classification number: G01B7/08 G01M17/02

    Abstract: Methods of measuring thickness of a material using cross-capacitance. The method generally includes applying a time-varying signal to a first pad and monitoring a response of a capacitor formed by the first pad, a spaced apart second pad, and the material. The pads may be permanently affixed to the material, in spaced relation to each other. Based on the response, a capacitance of the capacitor is determined. The material may be homogenous or heterogeneous, and has dielectric properties. Because the material acts as a dielectric, the capacitance of the capacitor changes as the thickness of the material changes. Thus, the thickness of the material may be determined based on the determined capacitance. The method may be advantageously employed to measure the thickness of a vehicle tire or other material. Related apparatuses are also disclosed.

    Non-invasive thickness measurement using resonant frequency shift

    公开(公告)号:US09797703B2

    公开(公告)日:2017-10-24

    申请号:US15062377

    申请日:2016-03-07

    CPC classification number: G01B7/06 B60C19/00

    Abstract: A method of measuring thickness of a material generally includes transmitting an oscillating signal from a first pad, through the material, to a second pad, and measuring the signal reflected back to the first pad. The material may be homogenous or heterogeneous, and has dielectric properties. The signal has its frequency varied over time so that the frequency response of the system (the first pad, the material, and the second pad) may be analyzed. The resonant frequency of the system is determined. The thickness of the material is determined based on the resonant frequency shift caused by a change in thickness of the material. The present invention may be advantageously employed to measure the thickness of a vehicle tire or other material. Related apparatuses are also disclosed.

    ELECTRONIC DEVICE CHARACTERIZATION SYSTEMS AND METHODS

    公开(公告)号:US20220178983A1

    公开(公告)日:2022-06-09

    申请号:US17544916

    申请日:2021-12-07

    Abstract: Electronic device characterization platforms, systems, devices, and methods for use in testing instruments, devices, and sensors that is portable, modular, multiplexed, and automated are disclosed. The system includes a substrate, a chip adapter, such as a chip socket, and an optional housing. Chip samples to be tested can be disposed in the chip adapter and various environmental modules designed to supply different environmental conditions to the chip sample can be disposed over the chip adapter, enabling testing of the chip samples to be performed in the different environment conditions. The system can further include various connectors that allow for add-on modules to be included as part of the system. Methods of characterizing electronic devices and sensors are also disclosed.

    Non-Invasive Thickness Measurement Using Resonant Frequency Shift

    公开(公告)号:US20170254634A1

    公开(公告)日:2017-09-07

    申请号:US15062377

    申请日:2016-03-07

    CPC classification number: G01B7/06 B60C19/00

    Abstract: A method of measuring thickness of a material generally includes transmitting an oscillating signal from a first pad, through the material, to a second pad, and measuring the signal reflected back to the first pad. The material may be homogenous or heterogeneous, and has dielectric properties. The signal has its frequency varied over time so that the frequency response of the system (the first pad, the material, and the second pad) may be analyzed. The resonant frequency of the system is determined. The thickness of the material is determined based on the resonant frequency shift caused by a change in thickness of the material. The present invention may be advantageously employed to measure the thickness of a vehicle tire or other material. Related apparatuses are also disclosed.

    Non-invasive thickness measurement using capacitance measurement

    公开(公告)号:US10209054B2

    公开(公告)日:2019-02-19

    申请号:US15133727

    申请日:2016-04-20

    Abstract: Methods of measuring thickness of a material using cross-capacitance. The method generally includes applying a time-varying signal to a first pad and monitoring a response of a capacitor formed by the first pad, a spaced apart second pad, and the material. The pads may be permanently affixed to the material, in spaced relation to each other. Based on the response, a capacitance of the capacitor is determined. The material may be homogenous or heterogeneous, and has dielectric properties. Because the material acts as a dielectric, the capacitance of the capacitor changes as the thickness of the material changes. Thus, the thickness of the material may be determined based on the determined capacitance. The method may be advantageously employed to measure the thickness of a vehicle tire or other material. Related apparatuses are also disclosed.

    Stretchable Electrically Conductive Layer Formation By Aerosol Jet Printing On Flexible Substrate

    公开(公告)号:US20170347460A1

    公开(公告)日:2017-11-30

    申请号:US15230588

    申请日:2016-08-08

    Abstract: Methods of forming an electrically conductive layer on a flexible substrate, such as a stretchable electrode, by aerosol jet printing on the flexible substrate while the substrate is strained. In general, a stretchable substrate is initially deformed so that a first surface thereof is under tension. While the substrate is in the strained state, an ink is aerosol jet printed onto the first surface. The ink includes carbon nanotubes, and advantageously other materials such as reduced graphene oxide. Further, while the substrate is still in the strained state, the ink is cured after its application to the substrate. Thereafter, the strain is decreased so that the stretchable substrate contracts, self-organizing into a configuration wherein the substrate's first surface, with the cured ink thereon, has a wrinkled profile. The flexible substrate can then be mechanically expanded and contracted, advantageously repeatedly, with the ink layer maintaining electrical conductivity.

    PROTHROMBIN TIME SENSOR
    8.
    发明申请

    公开(公告)号:US20220326215A1

    公开(公告)日:2022-10-13

    申请号:US17716163

    申请日:2022-04-08

    Abstract: A fully-printed sensor chip for measuring prothrombin time of a blood sample. The sensor chip includes a pair of electrodes and a pair of contact pads, each electrically coupled to a different one of the electrodes, printed on the surface of the substrate using conductive ink materials. When a blood sample is placed on the sample chip in contact with both electrodes, an impedance of the blood sample is determined based on a measured impedance between the two contact pads. As the blood sample clots, the impedance value changes and the prothrombin time for the blood sample is determined based on a measurement time of a maximum impedance value. A resistive bridge printed on the substrate surface between the contact pads increases a baseline measurement for the sensor chip to a value within a range that is measurable by lower-cost measurement equipment.

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