公开(公告)号：US11217421B2

公开(公告)日：2022-01-04

申请号：US16879151

申请日：2020-05-20

Applicant: EBARA CORPORATION

Inventor： Takehide Hayashi ,  Ryo Tajima ,  Tatsuya Kohama ,  Kenji Watanabe ,  Tsutomu Karimata

IPC: H01J37/147 ,  H01J37/244 ,  H01J37/32 ,  H01J37/14

Abstract: An adjustment method for adjusting a path of an electron beam passing through an electron beam device including at least one unit having at least one lens and at least one aligner electrode, and a detector configured to detect the electron beam, the method including: a step of measuring, by a coordinate measuring machine, an assembly tolerance for each of a plurality of the units constituting the electron beam device; a step of determining a shift amount of the electron beam at a position of the at least one of the lenses; a step of determining an electrode condition for each of a plurality of the aligner electrodes included in the units in a manner such that a shift amount of the electron beam is to be the determined shift amount; and a step of setting each of the aligner electrodes to the corresponding determined electrode condition.

公开(公告)号：US10002740B2

公开(公告)日：2018-06-19

申请号：US15667040

申请日：2017-08-02

Applicant: EBARA CORPORATION

Inventor： Masahiro Hatakeyama ,  Ryo Tajima ,  Kenichi Suematsu ,  Kenji Watanabe ,  Yasushi Toma ,  Kenji Terao ,  Takeshi Murakami

IPC: H01J37/05 ,  H01J37/147 ,  H01J37/141 ,  H01J37/26 ,  H01J37/244

CPC classification number: H01J37/05 ,  H01J37/12 ,  H01J37/141 ,  H01J37/147 ,  H01J37/244 ,  H01J37/26 ,  H01J37/29 ,  H01J2237/0268 ,  H01J2237/16 ,  H01J2237/24475 ,  H01J2237/2448 ,  H01J2237/2817

Abstract: An electron beam inspection device includes: a primary electron optical system that irradiates the surface of a sample with an electron beam; and a secondary electron optical system that gathers secondary electrons emitted from the sample and forms an image on the sensor surface of a detector. An electron image of the surface of the sample is obtained from a signal detected by the detector, and the sample is inspected. A cylindrical member that is formed with conductors stacked as an inner layer and an outer layer, and an insulator stacked as an intermediate layer is provided inside a lens tube into which the secondary electron optical system is incorporated. An electron orbital path is formed inside the cylindrical member, and the members constituting the secondary electron optical system are arranged outside the cylindrical member.

公开(公告)号：US20160307726A1

公开(公告)日：2016-10-20

申请号：US15195665

申请日：2016-06-28

Applicant: EBARA CORPORATION

Inventor： Masahiro Hatakeyama ,  Shoji Yoshikawa ,  Takeshi Murakami ,  Kenji Watanabe ,  Yoshihiko Naito ,  Yasushi Toma ,  Tsutomu Karimata ,  Takehide Hayashi ,  Kiwamu Tsukamoto ,  Tatsuya Kohama ,  Noboru Kobayashi

IPC: H01J37/09 ,  G01N23/225 ,  H01J37/28 ,  H01J37/22 ,  H01J37/10

CPC classification number: H01J37/073 ,  G01N23/22 ,  G01N23/223 ,  G01N23/2251 ,  G01N2223/611 ,  H01J1/34 ,  H01J37/09 ,  H01J37/10 ,  H01J37/20 ,  H01J37/222 ,  H01J37/244 ,  H01J37/265 ,  H01J37/28 ,  H01J37/29 ,  H01J2237/0048 ,  H01J2237/022 ,  H01J2237/032 ,  H01J2237/038 ,  H01J2237/045 ,  H01J2237/0458 ,  H01J2237/0473 ,  H01J2237/0492 ,  H01J2237/061 ,  H01J2237/06333 ,  H01J2237/166 ,  H01J2237/186 ,  H01J2237/2002 ,  H01J2237/2007 ,  H01J2237/2008 ,  H01J2237/2448 ,  H01J2237/2482 ,  H01J2237/2485 ,  H01J2237/2817 ,  H01J2237/2855 ,  H01J2237/2857

Abstract: An inspection device for inspecting a surface of an inspection object using a beam includes a beam generator capable of generating one of either charge particles or an electromagnetic wave as a beam, a primary optical system capable of guiding and irradiating the beam to the inspection object supported within a working chamber, a secondary optical system capable of including a first movable numerical aperture and a first detector which detects secondary charge particles generated from the inspection object, the secondary charge particles passing through the first movable numerical aperture, an image processing system capable of forming an image based on the secondary charge particles detected by the first detector; and a second detector arranged between the first movable numerical aperture and the first detector and which detects a location and shape at a cross over location of the secondary charge particles generated from the inspection object.

Abstract translation: 用于使用光束检查检查对象的表面的检查装置包括能够产生电荷粒子或电磁波之一作为光束的光束发生器，能够将所述光束引导并照射到被检查对象的主光学系统 在工作室内，能够包括第一可移动数值孔径的二次光学系统和检测从检查对象产生的二次电荷粒子的第一检测器，通过第一可移动数值孔径的二次电荷粒子，能够 基于由所述第一检测器检测到的次级电荷粒子形成图像; 以及第二检测器，其布置在第一可移动数值孔径和第一检测器之间，并且检测在从检查对象生成的次级充电颗粒的交叉位置处的位置和形状。

公开(公告)号：US09406480B2

公开(公告)日：2016-08-02

申请号：US14596447

申请日：2015-01-14

Applicant: EBARA CORPORATION

Inventor： Nobuharu Noji ,  Tohru Satake ,  Hirosi Sobukawa ,  Toshifumi Kimba ,  Masahiro Hatakeyama ,  Shoji Yoshikawa ,  Takeshi Murakami ,  Kenji Watanabe ,  Tsutomu Karimata ,  Kenichi Suematsu ,  Yutaka Tabe ,  Ryo Tajima ,  Keiichi Tohyama

IPC: H01J37/28 ,  G01N23/22 ,  G01N23/225 ,  H01J37/20 ,  H01J37/05 ,  H01L21/683

CPC classification number: H01J37/20 ,  G01N23/2204 ,  G01N23/225 ,  H01J37/05 ,  H01J37/28 ,  H01J2237/202 ,  H01J2237/2441 ,  H01J2237/2446 ,  H01J2237/2801 ,  H01J2237/2817 ,  H01L21/6833 ,  H01L2223/54466

Abstract: A substrate is irradiated by primary electrons and secondary electrons generated from the substrate are detected by a detector. A reference die is placed on the stage to obtain a pattern matching template image including feature coordinates of the reference die. A pattern matching is performed with an arbitrary die in a row or column including the reference die using the template image to obtain feature coordinates of the arbitrary die. An angle of misalignment is calculated between the direction of the row or column including the reference die and one of the directions of movement of the substrate on the basis of the feature coordinates of the arbitrary die and those of the reference die. The stage is rotated to correct the angle of misalignment to conform the direction of the row or column including the reference die with the one of the directions of movement of the substrate.

公开(公告)号：US08946631B2

公开(公告)日：2015-02-03

申请号：US14156140

申请日：2014-01-15

Applicant: Ebara Corporation

Inventor： Nobuharu Noji ,  Tohru Satake ,  Hirosi Sobukawa ,  Toshifumi Kimba ,  Masahiro Hatakeyama ,  Shoji Yoshikawa ,  Takeshi Murakami ,  Kenji Watanabe ,  Tsutomu Karimata ,  Kenichi Suematsu ,  Yutaka Tabe ,  Ryo Tajima ,  Keiichi Tohyama

IPC: G01N23/225 ,  H01J37/28 ,  H01L21/683

CPC classification number: H01J37/20 ,  G01N23/2204 ,  G01N23/225 ,  H01J37/05 ,  H01J37/28 ,  H01J2237/202 ,  H01J2237/2441 ,  H01J2237/2446 ,  H01J2237/2801 ,  H01J2237/2817 ,  H01L21/6833 ,  H01L2223/54466

Abstract: A substrate is irradiated by primary electrons and secondary electrons generated from the substrate are detected by a detector. A reference die is placed on the stage to obtain a pattern matching template image including feature coordinates of the reference die. A pattern matching is performed with an arbitrary die in a row or column including the reference die using the template image to obtain feature coordinates of the arbitrary die. An angle of misalignment is calculated between the direction of the row or column including the reference die and one of the directions of movement of the substrate on the basis of the feature coordinates of the arbitrary die and those of the reference die. The stage is rotated to correct the angle of misalignment to conform the direction of the row or column including the reference die with the one of the directions of movement of the substrate.

Abstract translation: 用一次电子照射衬底，由检测器检测由衬底产生的二次电子。 将参考管芯放置在平台上以获得包括参考管芯的特征坐标的模式匹配模板图像。 使用模板图像，使用包含基准管芯的行或列中的任意管芯进行图案匹配，以获得任意管芯的特征坐标。 基于任意模具的特征坐标和参考模具的特征坐标，在包括基准模具的行或列的方向与基板的移动方向之间计算出未对准的角度。 旋转台阶以校正未对准的角度，以使包括基准模具的行或列的方向与衬底的运动方向之一相一致。

公开(公告)号：US20140014848A1

公开(公告)日：2014-01-16

申请号：US13946198

申请日：2013-07-19

Applicant: EBARA CORPORATION

Inventor： Masahiro Hatakeyama ,  Shoji Yoshikawa ,  Takeshi Murakami ,  Kenji Watanabe ,  Yoshihiko Naito ,  Yasushi Toma ,  Tsutomu Karimata ,  Takehide Hayashi ,  Kiwamu Tsukamoto ,  Tatsuya Kohama ,  Noboru Kobayashi

IPC: G01N23/22 ,  G01N23/223

CPC classification number: H01J37/073 ,  G01N23/22 ,  G01N23/223 ,  G01N23/2251 ,  G01N2223/611 ,  H01J1/34 ,  H01J37/09 ,  H01J37/10 ,  H01J37/20 ,  H01J37/222 ,  H01J37/244 ,  H01J37/265 ,  H01J37/28 ,  H01J37/29 ,  H01J2237/0048 ,  H01J2237/022 ,  H01J2237/032 ,  H01J2237/038 ,  H01J2237/045 ,  H01J2237/0458 ,  H01J2237/0473 ,  H01J2237/0492 ,  H01J2237/061 ,  H01J2237/06333 ,  H01J2237/166 ,  H01J2237/186 ,  H01J2237/2002 ,  H01J2237/2007 ,  H01J2237/2008 ,  H01J2237/2448 ,  H01J2237/2482 ,  H01J2237/2485 ,  H01J2237/2817 ,  H01J2237/2855 ,  H01J2237/2857

Abstract: An inspection device for inspecting a surface of an inspection object using a beam includes a beam generator capable of generating one of either charge particles or an electromagnetic wave as a beam, a primary optical system capable of guiding and irradiating the beam to the inspection object supported within a working chamber, a secondary optical system capable of including a first movable numerical aperture and a first detector which detects secondary charge particles generated from the inspection object, the secondary charge particles passing through the first movable numerical aperture, an image processing system capable of forming an image based on the secondary charge particles detected by the first detector; and a second detector arranged between the first movable numerical aperture and the first detector and which detects a location and shape at a cross over location of the secondary charge particles generated from the inspection object.

Abstract translation: 用于使用光束检查检查对象的表面的检查装置包括能够产生电荷粒子或电磁波之一作为光束的光束发生器，能够将所述光束引导并照射到被检查对象的主光学系统 在工作室内，能够包括第一可移动数值孔径的二次光学系统和检测从检查对象产生的二次电荷粒子的第一检测器，通过第一可移动数值孔径的二次电荷粒子，能够 基于由所述第一检测器检测到的次级电荷粒子形成图像; 以及第二检测器，其布置在第一可移动数值孔径和第一检测器之间，并且检测在从检查对象生成的次级充电颗粒的交叉位置处的位置和形状。

公开(公告)号：US10157722B2

公开(公告)日：2018-12-18

申请号：US15195665

申请日：2016-06-28

Applicant: EBARA CORPORATION

Inventor： Masahiro Hatakeyama ,  Shoji Yoshikawa ,  Takeshi Murakami ,  Kenji Watanabe ,  Yoshihiko Naito ,  Yasushi Toma ,  Tsutomu Karimata ,  Takehide Hayashi ,  Kiwamu Tsukamoto ,  Tatsuya Kohama ,  Noboru Kobayashi

IPC: H01J37/09 ,  H01J37/073 ,  G01N23/2251 ,  H01J37/20 ,  H01J37/26 ,  H01J37/28 ,  H01J37/29 ,  G01N23/22 ,  G01N23/223 ,  H01J37/10 ,  H01J37/22

Abstract: An inspection device for inspecting a surface of an inspection object using a beam includes a beam generator capable of generating one of either charge particles or an electromagnetic wave as a beam, a primary optical system capable of guiding and irradiating the beam to the inspection object supported within a working chamber, a secondary optical system capable of including a first movable numerical aperture and a first detector which detects secondary charge particles generated from the inspection object, the secondary charge particles passing through the first movable numerical aperture, an image processing system capable of forming an image based on the secondary charge particles detected by the first detector; and a second detector arranged between the first movable numerical aperture and the first detector and which detects a location and shape at a cross over location of the secondary charge particles generated from the inspection object.

公开(公告)号：US09105444B2

公开(公告)日：2015-08-11

申请号：US14096361

申请日：2013-12-04

Applicant: Ebara Corporation

Inventor： Kenji Watanabe ,  Masahiro Hatakeyama ,  Yoshihiko Naito ,  Tatsuya Kohama ,  Kenji Terao ,  Takeshi Murakami ,  Takehide Hayashi ,  Kiwamu Tsukamoto ,  Hiroshi Sobukawa ,  Norio Kimura

IPC: H01J37/24 ,  H01J37/02 ,  H01J37/22 ,  H01J37/26 ,  H01J37/29

CPC classification number: H01J37/22 ,  H01J37/265 ,  H01J37/29 ,  H01J2237/004 ,  H01J2237/022 ,  H01J2237/24495 ,  H01J2237/24564 ,  H01J2237/2817

Abstract: An electro-optical inspection apparatus is provided that is capable of preventing adhesion of dust or particles to the sample surface as much as possible. A stage (100) on which a sample (200) is placed is disposed inside a vacuum chamber (112) that can be evacuated to vacuum, and a dust collecting electrode (122) is disposed to surround a periphery of the sample (200). The dust collecting electrode (122) is applied with a voltage having the same polarity as a voltage applied to the sample (200) and an absolute value that is the same or larger than an absolute value of the voltage. Thus, because dust or particles such as particles adhere to the dust collecting electrode (122), adhesion of the dust or particles to the sample surface can be reduced. Instead of using the dust collecting electrode, it is possible to form a recess on a wall of the vacuum chamber containing the stage, or to dispose on the wall a metal plate having a mesh structure to which a predetermined voltage is applied. In addition, adhesion of dust or particles can be further reduced by disposing a gap control plate (124) having a through hole (124a) at the center above the sample (200) and the dust collecting electrode (122).

Abstract translation: 提供一种电光检查装置，其能够尽可能地防止灰尘或颗粒附着到样品表面。 将其上放置有样品（200）的载物台（100）设置在能够抽真空的真空室（112）的内部，并且设置集尘电极（122）以包围样品（200）的周围， 。 集尘电极（122）施加与施加到样品（200）的电压相同极性的电压和与电压的绝对值相同或更大的绝对值。 因此，由于灰尘或颗粒例如颗粒附着在集尘电极122上，所以可以降低灰尘或颗粒对样品表面的粘附。 代替使用集尘电极，可以在包含载物台的真空室的壁上形成凹部，或者在壁上配置具有施加了预定电压的网状结构的金属板。 此外，通过在样品（200）上方的中心和集尘电极（122）设置具有通孔（124a）的间隙控制板（124），可以进一步减少灰尘或颗粒的附着。

公开(公告)号：US20140034831A1

公开(公告)日：2014-02-06

申请号：US13732897

申请日：2013-01-02

Applicant: Ebara Corporation ,  Kabushiki Kaisha Toshiba

Inventor： Mamoru Nakasuji ,  Nobuharu Noji ,  Tohru Satake ,  Masahiro Hatakeyama ,  Toshifumi Kimba ,  Hirosi Sobukawa ,  Shoji Yoshikawa ,  Takeshi Murakami ,  Kenji Watanabe ,  Tsutomu Karimata ,  Shin Oowada ,  Mutsumi Saito ,  Yuichiro Yamazaki ,  Takamitsu Nagai ,  Ichirota Nagahama

IPC: G01N23/225 ,  G01N23/227

CPC classification number: H01J29/70 ,  G01N23/225 ,  G01N23/2251 ,  G01N23/227 ,  H01J37/06 ,  H01J37/073 ,  H01J37/141 ,  H01J37/185 ,  H01J37/20 ,  H01J37/222 ,  H01J37/244 ,  H01J37/266 ,  H01J37/28 ,  H01J2237/082 ,  H01J2237/202 ,  H01J2237/20228 ,  H01J2237/204 ,  H01J2237/22 ,  H01J2237/24564 ,  H01J2237/2806 ,  H01J2237/2816 ,  H01J2237/2817 ,  H01L21/6719 ,  H01L21/67213

Abstract: An inspection apparatus by an electron beam comprises: an electron-optical device 70 having an electron-optical system for irradiating the object with a primary electron beam from an electron beam source, and a detector for detecting the secondary electron image projected by the electron-optical system; a stage system 50 for holding and moving the object relative to the electron-optical system; a mini-environment chamber 20 for supplying a clean gas to the object to prevent dust from contacting to the object; a working chamber 31 for accommodating the stage device, the working chamber being controllable so as to have a vacuum atmosphere; at least two loading chambers 41, 42 disposed between the mini-environment chamber and the working chamber, adapted to be independently controllable so as to have a vacuum atmosphere; and a loader 60 for transferring the object to the stage system through the loading chambers.

Abstract translation: 电子束检查装置包括：电子光学装置70，具有用于从电子束源向一个电子束照射物体的电子 - 光学系统;以及用于检测由电子束投射的二次电子图像的检测器， 光学系统; 用于相对于电子 - 光学系统保持和移动物体的平台系统50; 微型环境室20，用于向物体供应清洁气体，以防止灰尘与物体接触; 用于容纳平台装置的工作室31，工作室可控制为具有真空气氛; 设置在迷你环境室和工作室之间的至少两个装载室41,42适于独立控制以具有真空气氛; 以及用于通过装载室将物体传送到舞台系统的装载器60。

公开(公告)号：US11515118B2

公开(公告)日：2022-11-29

申请号：US16794948

申请日：2020-02-19

Applicant: EBARA CORPORATION

Inventor： Kenji Watanabe ,  Shinichi Okada ,  Ryo Tajima ,  Tsutomu Karimata

IPC: H01J37/147 ,  H01J37/244

Abstract: Provided is an electron beam irradiation apparatus including: an aligner configured to perform an alignment of an electron beam by deflecting the electron beam; a deflector having a plurality of electrodes and configured to deflect the electron beam after passing through the aligner; and an adjuster configured to adjust deflection caused by the aligner, wherein the adjuster is configured to perform, on each of the plurality of electrodes, detecting an image of the electron beam by applying a test voltage to one of the plurality of electrodes and applying a reference voltage to the other electrodes, determine a position shift of the electron beam based on each position of the image of the electron beam corresponding to each electrode, and adjust deflection of the aligner so as to cancel the position shift of the electron beam.