公开(公告)号：US12020976B2

公开(公告)日：2024-06-25

申请号：US17212842

申请日：2021-03-25

Applicant: EBARA CORPORATION

Inventor： Haiyang Xu ,  Koji Maeda ,  Mitsuhiko Inaba

IPC: H01L21/687 ,  B08B3/08 ,  B24B41/06 ,  H01L21/00 ,  H01L21/30 ,  H01L21/67 ,  H01L21/683

CPC classification number: H01L21/68742 ,  B08B3/08 ,  B24B41/06 ,  H01L21/00 ,  H01L21/30 ,  H01L21/67051 ,  H01L21/6838 ,  H01L21/68735

Abstract: To detach a substrate from a table without damaging the substrate. According to Embodiment 1, provided is a substrate processing apparatus including a table to hold a substrate, a plurality of lift pins that are arranged at periphery of the table and configured to arrange or separate the substrate on or from the table and to be movable in a direction perpendicular to a surface of the table, a drive mechanism that includes a motor to move the lift pins in the direction perpendicular to the surface of the table, and a control device that is configured to control the drive mechanism. The control device is configured to be capable of moving the lift pins at a first speed and at a second speed different from the first speed.

公开(公告)号：US10573509B2

公开(公告)日：2020-02-25

申请号：US15631149

申请日：2017-06-23

Applicant: Ebara Corporation

Inventor： Koji Maeda ,  Hiroshi Shimomoto ,  Kuniaki Yamaguchi ,  Hiroshi Aono ,  Tetsuya Yashima ,  Hidetatsu Isokawa ,  Kenji Shinkai ,  Mitsuhiko Inaba ,  Koichi Hashimoto ,  Junji Kunisawa ,  Mitsuru Miyazaki ,  Fujihiko Toyomasu

IPC: H01L21/02

Abstract: The cleaning apparatus includes multiple kinds of cleaning modules each configured to perform a cleaning processing of a substrate, a first accommodating section configured to accommodate the multiple kinds of cleaning modules therein, and a fluid supply section configured to supply a fluid to the cleaning modules accommodated in the first accommodating section through a pipe. Each of the multiple kinds of cleaning modules includes a pipe connection portion having a common connection position to be connected with the pipe.

公开(公告)号：US20140190633A1

公开(公告)日：2014-07-10

申请号：US14043379

申请日：2013-10-01

Applicant: EBARA CORPORATION

Inventor： Koji Maeda ,  Hiroshi Shimomoto ,  Hisajiro Nakano ,  Masayoshi Imai ,  Yoichi Shiokawa

IPC: H01L21/67

CPC classification number: H01L21/67092 ,  B24B37/04 ,  B24B37/34 ,  H01L21/67051 ,  H01L21/67219

Abstract: A substrate cleaning apparatus capable of efficiently cleaning a substrate, such as a wafer, is provided. The substrate cleaning apparatus includes: a substrate holder for holding and rotating a substrate; a chemical liquid nozzle for supplying a chemical liquid onto the substrate; a two-fluid nozzle for supplying a two-fluid jet onto the substrate; and a moving mechanism for moving the chemical liquid nozzle and the two-fluid nozzle together from a center to a periphery of the substrate. The chemical liquid nozzle and the two-fluid nozzle are adjacent to each other with a predetermined distance therebetween, and the chemical liquid nozzle is located forward of the two-fluid nozzle with respect to a movement direction of the chemical liquid nozzle and the two-fluid nozzle.

Abstract translation: 提供能够有效地清洗诸如晶片的基板的基板清洗装置。 基板清洗装置包括：用于保持和旋转基板的基板保持件; 用于将化学液体供给到所述基板上的化学液体喷嘴; 用于将二流体射流供应到衬底上的双流体喷嘴; 以及用于将药液喷嘴和双流体喷嘴从基板的中心移动到周边的移动机构。 化学液体喷嘴和双流体喷嘴彼此相邻地间隔预定距离，并且化学液体喷嘴相对于化学液体喷嘴的移动方向位于双流体喷嘴的前方， 流体喷嘴。

公开(公告)号：US20140190530A1

公开(公告)日：2014-07-10

申请号：US14043419

申请日：2013-10-01

Applicant: EBARA CORPORATION

Inventor： Koji Maeda ,  Hiroshi Shimomoto ,  Hisajiro Nakano

IPC: A47L15/42

CPC classification number: H01L21/67051

Abstract: A substrate cleaning apparatus capable of preventing a cleaning vessel from being corroded by a chemical liquid while constituting the cleaning vessel with a low-price material is provided. The substrate cleaning apparatus includes: a cleaning vessel for holding a substrate therein; a substrate holder arranged in the cleaning vessel; a chemical liquid nozzle for supplying a chemical liquid onto the substrate held by the substrate holder; and a plurality of cleaning liquid nozzles for supplying a cleaning liquid onto an inner surface of the cleaning vessel. The inner surface of the cleaning vessel has been subjected to a hydrophilization treatment.

Abstract translation: 提供了一种能够以低价格的材料构成清洗容器时能够防止清洗容器被化学液体腐蚀的基板清洗装置。 基板清洗装置包括：用于在其中保持基板的清洗容器; 布置在所述清洁容器中的基板保持器; 用于将化学液体供给到由所述基板保持器保持的所述基板上的化学液体喷嘴; 以及用于将清洁液体供应到清洁容器的内表面上的多个清洗液喷嘴。 清洁容器的内表面已进行亲水化处理。

公开(公告)号：US20140116466A1

公开(公告)日：2014-05-01

申请号：US14061686

申请日：2013-10-23

Applicant: Ebara Corporation

Inventor： Koji Maeda ,  Soichi ISOBE ,  Hiroshi SHIMOMOTO ,  Hideaki TANAKA

IPC: H01L21/02 ,  H01L21/66

CPC classification number: H01L21/02057 ,  H01L21/67046

Abstract: A substrate cleaning apparatus performs scrub cleaning of a surface of a substrate with an elongated cylindrical roll cleaning member. The substrate cleaning apparatus includes a roll holder for supporting the cleaning member and rotate the roll cleaning member, a vertical movement mechanism for vertically moving the roll holder so that the roll cleaning member applies a roll load to the substrate at the time of cleaning the substrate by actuation of an actuator having a regulating device, a load cell for measuring the roll load, and a controller for performing feedback control of the roll load through the regulating device based on the measured value of the load cell. The substrate cleaning apparatus further includes a monitor unit for monitoring whether an operation amount of the regulating device falls outside an allowable range of a preset reference value of an operation amount corresponding to a preset roll load.

Abstract translation: 基板清洁装置用细长的圆筒形辊清洁构件进行基板表面的擦洗清洁。 基板清洗装置包括用于支撑清洁部件并旋转辊清洁部件的辊保持器，用于使辊保持器垂直移动的垂直移动机构，使得辊清洁部件在清洁基板时向基板施加辊荷载 通过具有调节装置的致动器的致动器，用于测量辊荷载的测力传感器，以及控制器，用于根据称重传感器的测量值对通过调节装置的辊载荷进行反馈控制。 基板清洗装置还包括监视单元，用于监视调节装置的操作量是否超出对应于预设滚动载荷的操作量的预设基准值的允许范围。

公开(公告)号：US11869788B2

公开(公告)日：2024-01-09

申请号：US16636960

申请日：2018-08-09

Applicant: EBARA CORPORATION

Inventor： Koji Maeda ,  Mitsuhiko Inaba ,  Haiyang Xu ,  Tetsuya Yashima

IPC: H01L21/67 ,  H01L21/677 ,  B24B37/00 ,  H01L21/304 ,  B08B15/00 ,  B24B37/34

CPC classification number: H01L21/677 ,  B08B15/005 ,  B24B37/00 ,  B24B37/345 ,  H01L21/304

Abstract: A substrate processing apparatus includes a first processing unit and a second processing unit placed in upper and lower two stages. Each processing unit has: a plurality of processing tanks arranged in series; a partition wall defining a conveyance space extending along an arrangement direction outside the plurality of processing tanks; a conveyance mechanism placed in the conveyance space and being configured to convey a substrate between the processing tanks along the arrangement direction; and an air guide duct provided to extend along the arrangement direction in the conveyance space. The air guide duct is connected with a fan filter unit. Each of the processing tanks is connected with an exhaust duct. An opening is formed in each of parts facing the processing tank in the air guide duct. The conveyance spaces of the first and second processing units are separated into upper and lower segments by the partition wall.

公开(公告)号：US11495475B2

公开(公告)日：2022-11-08

申请号：US16780049

申请日：2020-02-03

Applicant: EBARA CORPORATION

Inventor： Koji Maeda ,  Hiroshi Shimomoto ,  Hisajiro Nakano ,  Masayoshi Imai ,  Yoichi Shiokawa

IPC: H01L21/302 ,  H01L21/67 ,  B24B37/34 ,  B24B37/04

Abstract: Various methods of cleaning a substrate are provided. In one aspect, method of cleaning a substrate, comprising: holding and rotating a substrate by a substrate holder; and supplying a chemical liquid to a chemical liquid nozzle and supplying two fluids to a two-fluid nozzle while moving the chemical-liquid nozzle and the two-fluid nozzle radially outwardly from the center to the periphery of the substrate, wherein the distance of the chemical-liquid nozzle from a rotating axis of the substrate holder is longer than the distance of the two-fluid nozzle from the rotating axis of the substrate holder while the chemical-liquid nozzle and the two-fluid nozzle are moved radially outwardly from the rotating axis of the substrate holder.

公开(公告)号：US11173523B2

公开(公告)日：2021-11-16

申请号：US16410378

申请日：2019-05-13

Applicant: EBARA CORPORATION

Inventor： Hidetatsu Isokawa ,  Koji Maeda ,  Xu Haiyang ,  Shun Ehara

IPC: B08B3/02 ,  H01L21/67 ,  B24B37/34 ,  H01L21/687 ,  H01L21/677 ,  B08B3/04

Abstract: A mechanism that conveys a substrate is cleaned in a cleaning unit. A substrate processing apparatus that includes a substrate polishing device and a substrate cleaning unit is disclosed. The substrate cleaning unit includes a cleaning module and a cleaning unit conveyance mechanism. The cleaning unit conveyance mechanism includes a hand and a hand open/close mechanism. The substrate processing apparatus further includes a hand cleaning unit. The hand cleaning unit includes a hand cleaning tank and a cleaning liquid injection mechanism.

公开(公告)号：US10818531B2

公开(公告)日：2020-10-27

申请号：US16204979

申请日：2018-11-29

Applicant: EBARA CORPORATION

Inventor： Kuniaki Yamaguchi ,  Haiyang Xu ,  Koji Maeda ,  Mitsuhiko Inaba

IPC: H01L21/677 ,  H01L21/68 ,  H01L21/687 ,  B65G47/90 ,  H01L21/67 ,  B25J9/16

Abstract: A substrate transport system includes a hand, a main positioning member permanently mounted on a base, where the main positioning member is engageable with the hand at a position offset by a first distance in the first axis direction and offset by a second distance in the second axis direction from a substrate transfer position, and a control unit that stores a position coordinate in the first axis direction and a position coordinate in the second axis direction of the hand in a state where the hand is positioned by being engaged with the main positioning member.

公开(公告)号：US20170372893A1

公开(公告)日：2017-12-28

申请号：US15631149

申请日：2017-06-23

Applicant: Ebara Corporation

Inventor： Koji Maeda ,  Hiroshi Shimomoto ,  Kuniaki Yamaguchi ,  Hiroshi Aono ,  Tetsuya Yashima ,  Hidetatsu Isokawa ,  Kenji Shinkai ,  Mitsuhiko Inaba ,  Koichi Hashimoto ,  Junji Kunisawa ,  Mitsuru Miyazaki ,  Fujihiko Toyomasu

IPC: H01L21/02

Abstract: The cleaning apparatus includes multiple kinds of cleaning modules each configured to perform a cleaning processing of a substrate, a first accommodating section configured to accommodate the multiple kinds of cleaning modules therein, and a fluid supply section configured to supply a fluid to the cleaning modules accommodated in the first accommodating section through a pipe. Each of the multiple kinds of cleaning modules includes a pipe connection portion having a common connection position to be connected with the pipe.