公开(公告)号：US10176979B2

公开(公告)日：2019-01-08

申请号：US14378842

申请日：2013-02-15

Applicant: ENTEGRIS, INC.

Inventor： Jun Liu ,  Jeffrey A. Barnes ,  Emanuel I. Cooper ,  Laisheng Sun ,  Elizabeth Thomas ,  Jason Chang

IPC: H01L21/02 ,  C11D1/72 ,  C11D3/20 ,  C11D1/66 ,  C11D1/22 ,  C11D1/38 ,  B08B3/08 ,  C11D11/00 ,  C11D3/39 ,  C11D7/06 ,  C11D3/04 ,  C11D3/34

Abstract: An amine-free composition and process for cleaning post-chemical mechanical polishing (CMP) residue and contaminants from a microelectronic device having said residue and contaminants thereon. The amine-free composition preferably includes at least one oxidizing agent, at least one complexing agent, at least one basic compound, and water and has a pH in the range from about 2.5 to about 11.5. The composition achieves highly efficacious cleaning of the post-CMP residue and contaminant material from the surface of the microelectronic device without compromising the low-k dielectric material or the copper interconnect material.