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公开(公告)号：US20170089796A1
公开(公告)日：2017-03-30
申请号：US15379018
申请日：2016-12-14
Applicant: Epcos AG
Inventor： Jan Ihle , Andreas Peschka , Bert Hundertmark , Benjamin Bohl , Bernhard Ostrick
IPC: G01L19/14 , C04B35/626 , G01L19/04 , C04B35/185 , G01L19/06 , G01L19/00
CPC classification number: G01L19/141 , C04B35/185 , C04B35/626 , C04B35/64 , C04B2235/3463 , C04B2235/6022 , C04B2235/656 , G01L19/0038 , G01L19/0084 , G01L19/04 , G01L19/0627 , G01L19/0681 , G01L19/143 , H01L2224/48091 , H01L2924/00014
Abstract: A pressure sensor system having a pressure sensor chip is specified. The pressure sensor chip is mounted on a mounting receptacle of a ceramic housing body having a pressure feed guided to the pressure sensor chip. The housing body is three-dimensionally shaped and monolithically formed and is formed by a ceramic material having a coefficient of thermal expansion which deviates by less than 30% from the coefficient of thermal expansion of the pressure sensor chip in a temperature range of greater than or equal to −40° C. and less than or equal to 150° C.
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公开(公告)号：US09909946B2
公开(公告)日：2018-03-06
申请号：US15379018
申请日：2016-12-14
Applicant: EPCOS AG
Inventor： Jan Ihle , Andreas Peschka , Bert Hundertmark , Benjamin Bohl , Bernhard Ostrick
IPC: G01L19/14 , G01L19/06 , G01L19/00 , G01L19/04 , C04B35/185 , C04B35/626
CPC classification number: G01L19/141 , C04B35/185 , C04B35/626 , C04B35/64 , C04B2235/3463 , C04B2235/6022 , C04B2235/656 , G01L19/0038 , G01L19/0084 , G01L19/04 , G01L19/0627 , G01L19/0681 , G01L19/143 , H01L2224/48091 , H01L2924/00014
Abstract: A pressure sensor system having a pressure sensor chip is specified. The pressure sensor chip is mounted on a mounting receptacle of a ceramic housing body having a pressure feed guided to the pressure sensor chip. The housing body is three-dimensionally shaped and monolithically formed and is formed by a ceramic material having a coefficient of thermal expansion which deviates by less than 30% from the coefficient of thermal expansion of the pressure sensor chip in a temperature range of greater than or equal to −40° C. and less than or equal to 150° C.
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3.发明申请Micromechanical Measuring Element and Method for Producing a Micromechanical Measuring Element 有权微机械测量元件和微机械测量元件的制造方法公开(公告)号：US20150027224A1
公开(公告)日：2015-01-29
申请号：US14383857
申请日：2013-03-08
Applicant: EPCOS AG
Inventor： Michael Schiffer , Andreas Peschka , Jörg Zapf , Karl Weidner , Harry Hedler
CPC classification number: G01L19/14 , B23K1/0008 , B23K1/0016 , B81B7/007 , B81B2207/092 , B81B2207/096 , G01D11/245 , G01L19/147 , G01L19/148 , G01P1/023 , H01L2224/16225 , H01L2924/10155 , H01L2924/15151
Abstract: A micromechanical measuring element includes a carrier and a sensitive element connected to the carrier by a first solder connection and a second solder connection. The sensitive element is contacted electrically by the first solder connection. The sensitive element, the carrier and the second solder connection form a first chamber. The first chamber has a first opening.
Abstract translation: 微机械测量元件包括载体和通过第一焊接连接和第二焊接连接到载体的敏感元件。 敏感元件通过第一焊接接触电接触。 敏感元件，载体和第二焊接连接形成第一室。 第一个房间有第一个开放。
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4.发明授权Micromechanical measuring element and method for producing a micromechanical measuring element 有权微机电测量元件及微机电测量元件的制造方法公开(公告)号：US09506831B2
公开(公告)日：2016-11-29
申请号：US14383857
申请日：2013-03-08
Applicant: EPCOS AG
Inventor： Michael Schiffer , Andreas Peschka , Jörg Zapf , Karl Weidner , Harry Hedler
CPC classification number: G01L19/14 , B23K1/0008 , B23K1/0016 , B81B7/007 , B81B2207/092 , B81B2207/096 , G01D11/245 , G01L19/147 , G01L19/148 , G01P1/023 , H01L2224/16225 , H01L2924/10155 , H01L2924/15151
Abstract: A micromechanical measuring element includes a carrier and a sensitive element connected to the carrier by a first solder connection and a second solder connection. The sensitive element is contacted electrically by the first solder connection. The sensitive element, the carrier and the second solder connection form a first chamber. The first chamber has a first opening.
Abstract translation: 微机械测量元件包括载体和通过第一焊接连接和第二焊接连接到载体的敏感元件。 敏感元件通过第一焊接接触电接触。 敏感元件，载体和第二焊接连接形成第一室。 第一个房间有第一个开放。
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