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公开(公告)号：US20150285664A1
公开(公告)日：2015-10-08
申请号：US14740429
申请日：2015-06-16
Applicant: EPCOS AG
Inventor： Benjamin Bohl , Oliver Bard
CPC classification number: G01D11/245 , G01K1/08
Abstract: A sensor arrangement includes at least one sensor element with electrical connections and arranged in a solid plastic-material body, and at least a first electrically insulating layer which embeds the sensor element arranged between the sensor element and the plastic-material body, wherein the first electrically insulating layer includes a liquid polymer, and the plastic-material body is closed in an end region at least to such extent that the liquid polymer is sealed inside the plastic-material body in an airtight manner.
Abstract translation: 传感器装置包括具有电连接并布置在固体塑料体中的至少一个传感器元件和至少第一电绝缘层，其嵌入设置在传感器元件和塑料材料体之间的传感器元件，其中第一 电绝缘层包括液体聚合物，并且塑料材料体在端部区域中至少封闭，使得液体聚合物以气密的方式密封在塑料材料体内。
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公开(公告)号：US09909946B2
公开(公告)日：2018-03-06
申请号：US15379018
申请日：2016-12-14
Applicant: EPCOS AG
Inventor： Jan Ihle , Andreas Peschka , Bert Hundertmark , Benjamin Bohl , Bernhard Ostrick
IPC: G01L19/14 , G01L19/06 , G01L19/00 , G01L19/04 , C04B35/185 , C04B35/626
CPC classification number: G01L19/141 , C04B35/185 , C04B35/626 , C04B35/64 , C04B2235/3463 , C04B2235/6022 , C04B2235/656 , G01L19/0038 , G01L19/0084 , G01L19/04 , G01L19/0627 , G01L19/0681 , G01L19/143 , H01L2224/48091 , H01L2924/00014
Abstract: A pressure sensor system having a pressure sensor chip is specified. The pressure sensor chip is mounted on a mounting receptacle of a ceramic housing body having a pressure feed guided to the pressure sensor chip. The housing body is three-dimensionally shaped and monolithically formed and is formed by a ceramic material having a coefficient of thermal expansion which deviates by less than 30% from the coefficient of thermal expansion of the pressure sensor chip in a temperature range of greater than or equal to −40° C. and less than or equal to 150° C.
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公开(公告)号：US20170089796A1
公开(公告)日：2017-03-30
申请号：US15379018
申请日：2016-12-14
Applicant: Epcos AG
Inventor： Jan Ihle , Andreas Peschka , Bert Hundertmark , Benjamin Bohl , Bernhard Ostrick
IPC: G01L19/14 , C04B35/626 , G01L19/04 , C04B35/185 , G01L19/06 , G01L19/00
CPC classification number: G01L19/141 , C04B35/185 , C04B35/626 , C04B35/64 , C04B2235/3463 , C04B2235/6022 , C04B2235/656 , G01L19/0038 , G01L19/0084 , G01L19/04 , G01L19/0627 , G01L19/0681 , G01L19/143 , H01L2224/48091 , H01L2924/00014
Abstract: A pressure sensor system having a pressure sensor chip is specified. The pressure sensor chip is mounted on a mounting receptacle of a ceramic housing body having a pressure feed guided to the pressure sensor chip. The housing body is three-dimensionally shaped and monolithically formed and is formed by a ceramic material having a coefficient of thermal expansion which deviates by less than 30% from the coefficient of thermal expansion of the pressure sensor chip in a temperature range of greater than or equal to −40° C. and less than or equal to 150° C.
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