公开(公告)号：US20170089796A1

公开(公告)日：2017-03-30

申请号：US15379018

申请日：2016-12-14

Applicant: Epcos AG

Inventor： Jan Ihle ,  Andreas Peschka ,  Bert Hundertmark ,  Benjamin Bohl ,  Bernhard Ostrick

IPC: G01L19/14 ,  C04B35/626 ,  G01L19/04 ,  C04B35/185 ,  G01L19/06 ,  G01L19/00

CPC classification number: G01L19/141 ,  C04B35/185 ,  C04B35/626 ,  C04B35/64 ,  C04B2235/3463 ,  C04B2235/6022 ,  C04B2235/656 ,  G01L19/0038 ,  G01L19/0084 ,  G01L19/04 ,  G01L19/0627 ,  G01L19/0681 ,  G01L19/143 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A pressure sensor system having a pressure sensor chip is specified. The pressure sensor chip is mounted on a mounting receptacle of a ceramic housing body having a pressure feed guided to the pressure sensor chip. The housing body is three-dimensionally shaped and monolithically formed and is formed by a ceramic material having a coefficient of thermal expansion which deviates by less than 30% from the coefficient of thermal expansion of the pressure sensor chip in a temperature range of greater than or equal to −40° C. and less than or equal to 150° C.

公开(公告)号：US09909946B2

公开(公告)日：2018-03-06

申请号：US15379018

申请日：2016-12-14

Applicant: EPCOS AG

Inventor： Jan Ihle ,  Andreas Peschka ,  Bert Hundertmark ,  Benjamin Bohl ,  Bernhard Ostrick

IPC: G01L19/14 ,  G01L19/06 ,  G01L19/00 ,  G01L19/04 ,  C04B35/185 ,  C04B35/626

CPC classification number: G01L19/141 ,  C04B35/185 ,  C04B35/626 ,  C04B35/64 ,  C04B2235/3463 ,  C04B2235/6022 ,  C04B2235/656 ,  G01L19/0038 ,  G01L19/0084 ,  G01L19/04 ,  G01L19/0627 ,  G01L19/0681 ,  G01L19/143 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A pressure sensor system having a pressure sensor chip is specified. The pressure sensor chip is mounted on a mounting receptacle of a ceramic housing body having a pressure feed guided to the pressure sensor chip. The housing body is three-dimensionally shaped and monolithically formed and is formed by a ceramic material having a coefficient of thermal expansion which deviates by less than 30% from the coefficient of thermal expansion of the pressure sensor chip in a temperature range of greater than or equal to −40° C. and less than or equal to 150° C.