公开(公告)号：US10608161B2

公开(公告)日：2020-03-31

申请号：US15549427

申请日：2016-02-11

Applicant: EPCOS AG

Inventor： Marion Ottlinger ,  Ivan Jagust

IPC: H01L41/22 ,  H01L41/083 ,  H01L41/053 ,  H01L41/273 ,  H01L41/332 ,  H01L41/338 ,  H01L41/293 ,  H01L41/23

Abstract: A method for manufacturing multilayer components, and a multilayer component are disclosed. The method includes manufacturing a body comprising electrically conductive layers and dielectric layers which are stacked one above the other, wherein the body comprises at least one cavity and at least partially filling the cavity with an insulation material using capillary forces. The method further includes after partially filling the cavity, singulating the body into at least two base bodies and applying a passivation layer to surfaces of the singulated base bodies, wherein the passivation layer comprises a material which is different from the insulation material.

公开(公告)号：US20180026174A1

公开(公告)日：2018-01-25

申请号：US15549427

申请日：2016-02-11

Applicant: EPCOS AG

Inventor： Marion Ottlinger ,  Ivan Jagust

IPC: H01L41/053 ,  H01L41/273 ,  H01L41/338 ,  H01L41/083

CPC classification number: H01L41/0533 ,  H01L41/083 ,  H01L41/23 ,  H01L41/273 ,  H01L41/293 ,  H01L41/332 ,  H01L41/338

Abstract: A method for manufacturing multilayer components, and a multilayer component are disclosed. The method includes manufacturing a body comprising electrically conductive layers and dielectric layers which are stacked one above the other, wherein the body comprises at least one cavity and at least partially filling the cavity with an insulation material using capillary forces. The method further includes after partially filling the cavity, singulating the body into at least two base bodies and applying a passivation layer to surfaces of the singulated base bodies, wherein the passivation layer comprises a material which is different from the insulation material.

公开(公告)号：US10381543B2

公开(公告)日：2019-08-13

申请号：US14898470

申请日：2014-06-13

Applicant: EPCOS AG

Inventor： Martin Galler ,  Harald Kastl ,  Siegfried Fellner ,  Axel Pecina ,  Marion Ottlinger ,  Peter Gerletz ,  Robert Krumphals ,  Wolfgang Athenstaedt ,  Ivan Jagust ,  Zdravko Mijocevic ,  Zeljko Maric

IPC: H01L41/083 ,  H01L41/047

Abstract: A multi-layer component (1) is specified, comprising a main body (2) with an external contact (3) arranged thereon, a further contact (5) for electrically contacting the multi-layer component (1), and a connecting element (4) for connecting the external contact (3) and the further contact (5), wherein the connecting element (4) is embodied in such a way that a decoupling of mechanical stresses that occur in the further contact (5) from the external contact (3) is brought about.