公开(公告)号：US11346726B2

公开(公告)日：2022-05-31

申请号：US15329219

申请日：2015-07-14

Applicant: EPCOS AG

Inventor： Heinz Strallhofer ,  Gerald Kloiber ,  Thomas Stendel ,  Jan Ihle

IPC: G01K7/22 ,  G01K1/12

Abstract: A sensor element, a sensor arrangement, and a method for manufacturing a sensor element and a sensor arrangement are disclosed. In an embodiment, a sensor element includes a ceramic main body having at least one electrode arranged at the main body and having at least one contact piece for the electrical contacting of the electrode, wherein the contact piece is fastened to the electrode by welding or bonding.

公开(公告)号：US10861624B2

公开(公告)日：2020-12-08

申请号：US15327995

申请日：2015-07-14

Applicant: EPCOS AG

Inventor： Heinz Strallhofer ,  Lutz Kirsten ,  Gerald Kloiber ,  Danilo Neuber ,  Jan Ihle

IPC: H01C1/14 ,  G01K7/22 ,  G01K1/08 ,  H01C7/00

Abstract: A sensor element, a sensor arrangement, and a method for manufacturing a Sensor element are disclosed. In an embodiment, a sensor element includes a ceramic main body and at least one electrode arranged at the main body, wherein the electrode has at least one layer comprising nickel.

公开(公告)号：US10024725B2

公开(公告)日：2018-07-17

申请号：US14442357

申请日：2013-09-27

Applicant: EPCOS AG

Inventor： Jan Ihle ,  Oliver Bard ,  Gerald Kloiber

IPC: G01K1/08 ,  G01K7/22

Abstract: The invention relates to a temperature sensor system comprising a first ceramic housing part comprising a sleeve-shaped lower part with a first lower end having a first opening, and a second upper end having a second opening, and an upper part connected to the second upper end. The temperature sensor system further comprises a temperature probe element which is at least partially arranged in the lower part and which has a ceramic sensor element housing, a sensor element arranged in the sensor element housing, and electrical supply lines. The sensor element housing is at least partially arranged in the first opening. The ceramic sensor element housing has a higher thermal conductivity than the first ceramic housing part. Also disclosed is a method for producing a temperature sensor system.

公开(公告)号：US20180306647A1

公开(公告)日：2018-10-25

申请号：US15770160

申请日：2016-10-18

Applicant: EPCOS AG

Inventor： Jan Ihle ,  Anke Weidenfelder ,  Christl Lisa Mead

IPC: G01K7/22 ,  H01C17/28 ,  H01C7/04 ,  B28B3/02 ,  B28B11/24

CPC classification number: G01K7/22 ,  B28B3/02 ,  B28B11/243 ,  G01K7/16 ,  H01C7/043 ,  H01C17/281

Abstract: A sensor element and a method for producing a sensor element are disclosed. In an embodiment the sensor element is configured to be secured on a printed circuit board by pressure sintering, wherein a structural form of the sensor element is designed such that an exposure to pressure of the sensor element during the pressure sintering is compensated.

公开(公告)号：US10788377B2

公开(公告)日：2020-09-29

申请号：US15772790

申请日：2016-10-18

Applicant: EPCOS AG

Inventor： Jan Ihle ,  Anke Weidenfelder ,  Christl Lisa Mead ,  Gerald Kloiber

IPC: G01K7/22 ,  G01K7/16 ,  B28B3/02 ,  B28B11/24 ,  H01C7/04 ,  H01C17/28 ,  G01K7/18 ,  H01C7/00 ,  H01C17/08 ,  H01C17/12 ,  H01C17/075

Abstract: A sensor element and a method for producing a sensor element are disclosed. In an embodiment a sensor element for temperature measurement includes a ceramic carrier and at least one NTC layer printed on the carrier, wherein the NTC layer covers at least part of a surface of the carrier, and wherein the sensor element is designed for wireless contacting.

公开(公告)号：US20190204162A1

公开(公告)日：2019-07-04

申请号：US15772790

申请日：2016-10-18

Applicant: EPCOS AG

Inventor： Jan Ihle ,  Anke Weidenfelder ,  Christl Lisa Mead ,  Gerald Kloiber

IPC: G01K7/22 ,  B28B11/24 ,  H01C17/28 ,  H01C7/00 ,  H01C7/04 ,  G01K7/18 ,  H01C17/08 ,  H01C17/12

Abstract: A sensor element and a method for producing a sensor element are disclosed. In an embodiment a sensor element for temperature measurement includes a ceramic carrier and at least one NTC layer printed on the carrier, wherein the NTC layer covers at least part of a surface of the carrier, and wherein the sensor element is designed for wireless contacting.

公开(公告)号：US09958335B2

公开(公告)日：2018-05-01

申请号：US14442346

申请日：2013-09-27

Applicant: EPCOS AG

Inventor： Jan Ihle ,  Gerald Kloiber

IPC: G01K1/08 ,  G01K7/22

CPC classification number: G01K1/08 ,  G01K7/22

Abstract: The invention relates to a temperature probe comprising two first ceramic plates, a second ceramic plate arranged between the first ceramic plates, and two third ceramic plates. Each of the two first ceramic plates comprises an opening in each in which an NTC sensor element is arranged. An electrode is arranged between the second ceramic plate and each of the first ceramic plates. The first and the second ceramic plates are arranged between the two third ceramic plates. An electrode is arranged between each third ceramic plate and a first ceramic plate. Each electrode electrically contacts an NTC sensor element. Each NTC sensor element is enclosed by ceramic plates. The first, the second and the third ceramic plates and the NTC sensor elements are sintered to form a ceramic body. The invention further relates to a method for producing a temperature probe.

公开(公告)号：US20160258818A1

公开(公告)日：2016-09-08

申请号：US14442333

申请日：2013-09-27

Applicant: EPCOS AG

Inventor： Jan Ihle ,  Oliver Bard ,  Steffen Mehlig ,  Wolfgang Grundmann

IPC: G01K1/08 ,  G01K7/22

CPC classification number: G01K1/08 ,  G01K7/22

Abstract: The invention relates to a temperature sensor system comprising a temperature probe element and a first ceramic housing part. The temperature probe element comprises a sensor element and electrical feed lines. The first ceramic housing part comprises a sleeve-shaped lower part with a closed lower end and an open upper end, and an upper part connected to the open upper end. The sensor element is arranged in the sleeve-shaped lower part. The upper part has recesses in which the electrical feed lines are partially arranged and guided. The lower part and the upper part form one piece. Also disclosed is a method for producing a temperature sensor system.

Abstract translation: 本发明涉及一种包括温度探针元件和第一陶瓷壳体部分的温度传感器系统。 温度探针元件包括传感器元件和馈电线。 第一陶瓷壳体部分包括具有封闭的下端和敞开的上端的套筒形下部，以及连接到敞开的上端的上部。 传感器元件布置在套筒形下部。 上部具有凹部，其中馈电线部分地布置和引导。 下部和上部形成一体。 还公开了一种用于生产温度传感器系统的方法。

公开(公告)号：US09958336B2

公开(公告)日：2018-05-01

申请号：US14442365

申请日：2013-09-27

Applicant: EPCOS AG

Inventor： Jan Ihle ,  Gerald Kloiber

IPC: G01K1/08 ,  G01K7/22 ,  B28B1/24 ,  C04B35/10 ,  C04B35/64

CPC classification number: G01K1/08 ,  B28B1/24 ,  C04B35/10 ,  C04B35/64 ,  G01K7/22 ,  G01K7/223

Abstract: The invention relates to a temperature probe which comprises a functional ceramic probe element and a ceramic housing. The probe element is mounted in the ceramic housing so that at a face of the probe element has direct and form-fitting contact with the ceramic housing. The invention further relates to a method for producing a temperature probe.

公开(公告)号：US09909946B2

公开(公告)日：2018-03-06

申请号：US15379018

申请日：2016-12-14

Applicant: EPCOS AG

Inventor： Jan Ihle ,  Andreas Peschka ,  Bert Hundertmark ,  Benjamin Bohl ,  Bernhard Ostrick

IPC: G01L19/14 ,  G01L19/06 ,  G01L19/00 ,  G01L19/04 ,  C04B35/185 ,  C04B35/626

CPC classification number: G01L19/141 ,  C04B35/185 ,  C04B35/626 ,  C04B35/64 ,  C04B2235/3463 ,  C04B2235/6022 ,  C04B2235/656 ,  G01L19/0038 ,  G01L19/0084 ,  G01L19/04 ,  G01L19/0627 ,  G01L19/0681 ,  G01L19/143 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A pressure sensor system having a pressure sensor chip is specified. The pressure sensor chip is mounted on a mounting receptacle of a ceramic housing body having a pressure feed guided to the pressure sensor chip. The housing body is three-dimensionally shaped and monolithically formed and is formed by a ceramic material having a coefficient of thermal expansion which deviates by less than 30% from the coefficient of thermal expansion of the pressure sensor chip in a temperature range of greater than or equal to −40° C. and less than or equal to 150° C.