公开(公告)号：US10670548B2

公开(公告)日：2020-06-02

申请号：US14786492

申请日：2014-04-09

Applicant: EPCOS AG

Inventor： Bernhard Ostrick ,  Peter Balzer

IPC: G01N27/22 ,  G01N33/00 ,  G01D11/24

Abstract: A sensor module has a first sensor element and a second sensor element. The first sensor element and the second sensor element are accommodated in a common housing of the sensor module. The sensor module includes a conductor structure that comprises an electrode structure and a separate connection structure. The connection structure is connected in an electrically conductive manner to the first sensor element and the electrode structure is allocated to the second sensor element.

公开(公告)号：US20160069831A1

公开(公告)日：2016-03-10

申请号：US14786492

申请日：2014-04-09

Applicant: EPCOS AG

Inventor： Bernhard Ostrick ,  Peter Balzer

IPC: G01N27/22 ,  G01N33/00

CPC classification number: G01N27/225 ,  G01D11/245 ,  G01N33/0032

Abstract: A sensor module has a first sensor element and a second sensor element. The first sensor element and the second sensor element are accommodated in a common housing of the sensor module. The sensor module includes a conductor structure that comprises an electrode structure and a separate connection structure. The connection structure is connected in an electrically conductive manner to the first sensor element and the electrode structure is allocated to the second sensor element.

Abstract translation: 传感器模块具有第一传感器元件和第二传感器元件。 第一传感器元件和第二传感器元件容纳在传感器模块的公共壳体中。 传感器模块包括导体结构，其包括电极结构和单独的连接结构。 连接结构以导电方式连接到第一传感器元件，并且电极结构被分配给第二传感器元件。