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公开(公告)号：US20150243865A1
公开(公告)日：2015-08-27
申请号：US14422673
申请日：2013-07-22
Applicant: EPCOS AG
Inventor： Thomas Feichtinger , Sebastian Brunner , Oliver Dernovsek , Klaus-Dieter Aichholzer , Georg Krenn , Axel Pecina , Christian Faistauer
IPC: H01L33/64
CPC classification number: H01L33/644 , H01L33/642 , H01L33/647
Abstract: A light-emitting diode device has a first carrier and at least one light-emitting diode chip, which is arranged on the first carrier. The first carrier has at least one first and one second carrier part, wherein the light-emitting diode chip rests only on the first carrier part. Furthermore, the first and second carrier parts each have a thermal conductivity. The thermal conductivity of the first carrier part is at least 1.5 times the thermal conductivity of the second carrier part. The first carrier part is surrounded laterally by the second carrier part.
Abstract translation: 发光二极管装置具有第一载体和布置在第一载体上的至少一个发光二极管芯片。 第一载体具有至少一个第一和第二载体部分，其中发光二极管芯片仅在第一载体部分上。 此外，第一和第二载体部分各自具有导热性。 第一载体部分的热导率为第二载体部分的热导率的至少1.5倍。 第一载体部分被第二载体部分横向包围。
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公开(公告)号：US09337408B2
公开(公告)日：2016-05-10
申请号：US14422673
申请日：2013-07-22
Applicant: EPCOS AG
Inventor： Thomas Feichtinger , Sebastian Brunner , Oliver Dernovsek , Klaus-Dieter Aichholzer , Georg Krenn , Axel Pecina , Christian Faistauer
IPC: H01L33/64
CPC classification number: H01L33/644 , H01L33/642 , H01L33/647
Abstract: A light-emitting diode device has a first carrier and at least one light-emitting diode chip, which is arranged on the first carrier. The first carrier has at least one first and one second carrier part, wherein the light-emitting diode chip rests only on the first carrier part. Furthermore, the first and second carrier parts each have a thermal conductivity. The thermal conductivity of the first carrier part is at least 1.5 times the thermal conductivity of the second carrier part. The first carrier part is surrounded laterally by the second carrier part.
Abstract translation: 发光二极管装置具有第一载体和布置在第一载体上的至少一个发光二极管芯片。 第一载体具有至少一个第一和第二载体部分，其中发光二极管芯片仅在第一载体部分上。 此外，第一和第二载体部分各自具有导热性。 第一载体部分的热导率为第二载体部分的热导率的至少1.5倍。 第一载体部分被第二载体部分横向包围。
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公开(公告)号：US20150144983A1
公开(公告)日：2015-05-28
申请号：US14403143
申请日：2013-04-17
Applicant: EPCOS AG
Inventor： Thomas Feichtinger , Oliver Dernovsek , Klaus-Dieter Aichholzer , Sebastian Brunner
CPC classification number: H01L27/0248 , H01L25/167 , H01L33/48 , H01L33/486 , H01L33/62 , H01L33/642 , H01L33/647 , H01L2924/0002 , H01L2924/00
Abstract: A light-emitting diode device includes a carrier having at least one cavity, a light-emitting diode chip is arranged in a manner at least partly recessed in the at least one cavity, and an ESD protection element, which is formed by a partial region of the carrier. Furthermore, a light-emitting diode device includes a carrier having at least one cavity, a light-emitting diode chip, arranged on the carrier, and an electrical component arranged at least partly recessed in the at least one cavity. Furthermore, the light-emitting diode device includes an ESD protection element, which is formed by a partial region of the carrier.
Abstract translation: 一种发光二极管器件包括具有至少一个空腔的载体，发光二极管芯片以至少部分地凹入至少一个空腔中的方式布置，并且ESD保护元件由部分区域 的承运人。 此外，发光二极管器件包括具有至少一个空腔的载体，布置在载体上的发光二极管芯片，以及至少部分地凹入至少一个空腔中的电气部件。 此外，发光二极管装置包括由载体的部分区域形成的ESD保护元件。
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公开(公告)号：US20190013120A1
公开(公告)日：2019-01-10
申请号：US16061801
申请日：2016-10-18
Applicant: EPCOS AG
Inventor： Christian Faistauer , Klaus-Dieter Aichholzer , Sebastian Brunner , Edmund Payr , Günter Pudmich
Abstract: A mechanically stable main body having a cutout, into which an ESD protection element is at least partly embedded and mechanically fixed by means of a connection means. Electrical terminals of the protection element are connected to terminal pads on the top side of the main body by way of a structured metallic layer bearing on main body and protection element.
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公开(公告)号：US09865381B2
公开(公告)日：2018-01-09
申请号：US15113397
申请日：2015-01-02
Applicant: EPCOS AG
Inventor： Yasuharu Miyauchi , Pavol Dudesek , Christian Faistauer , Gerhard Fuchs , Stefan Obermair , Klaus-Dieter Aichholzer , Christian Block , Sebastian Brunner
CPC classification number: H01C7/12 , C03C3/089 , H01C7/1006 , H01C7/112 , H01C7/18 , H01C17/285 , H01L25/167 , H01L2924/0002 , H01L2924/00
Abstract: A chip and a method for manufacturing a chip are disclosed. In an embodiment, the chip includes a varistor layer composed of zinc oxide, a multilayered electrode structure which realizes a varistor function in the varistor layer and at least two solderable or bondable external contacts on a first main surface of the varistor layer. The chip further includes a glass layer disposed on the first main surface leaving only the external contacts uncovered, wherein the glass layer includes, as main constituents, oxides of Si and/or Ge, B and K, which in total have at least 70% by weight of the constituents of the glass layer, and wherein the glass layer is substantially free of Al, Ga, Cr and Ti.
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Patent Agency Ranking
公开(公告)号：US20170311455A1
公开(公告)日：2017-10-26
申请号：US15315359
申请日：2015-08-12
Applicant: EPCOS AG
Inventor： Sebastian Brunner , Gerhard Fuchs , Annette Fischer
CPC classification number: H05K3/429 , H05K1/0306 , H05K1/09 , H05K1/115 , H05K3/248 , H05K3/4061 , H05K3/4605 , H05K2201/0195
Abstract: A method for producing a multilayer substrate (1) is specified, wherein a main body (26) comprising a plurality of ceramic layers (2) is provided, wherein at least one layer (2) comprises a hole (27). In order to form a plated-through hole (4, 18, 20, 21), the hole (27) is filled with a metal by depositing the metal from a solution. Furthermore, a multilayer substrate is specified wherein a plated-through hole (4, 18, 20, 21) in the interior of the main body (26) is connected to a further contact (11), wherein the plated-through hole (4, 18, 20, 21) comprises a different material than the further contact (11) and/or is produced by a different method.macros hash =multilayer substrate star =plated-throuch hole pie =connection contact alpha =photoresist mask beta =further contact gamma =HTCC technology delta =main body matt =ceramic layer
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公开(公告)号：US09418980B2
公开(公告)日：2016-08-16
申请号：US14403143
申请日：2013-04-17
Applicant: EPCOS AG
Inventor： Thomas Feichtinger , Oliver Dernovsek , Klaus-Dieter Aichholzer , Sebastian Brunner
Abstract: A light-emitting diode device includes a carrier having at least one cavity, a light-emitting diode chip is arranged in a manner at least partly recessed in the at least one cavity, and an ESD protection element, which is formed by a partial region of the carrier. Furthermore, a light-emitting diode device includes a carrier having at least one cavity, a light-emitting diode chip arranged on the carrier, and an electrical component arranged at least partly recessed in the at least one cavity. Furthermore, the light-emitting diode device includes an ESD protection element, which is formed by a partial region of the carrier.
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公开(公告)号：US20150245481A1
公开(公告)日：2015-08-27
申请号：US14422676
申请日：2013-08-02
Applicant: EPCOS AG
Inventor： Sebastian Brunner , Thomas Feichtinger
CPC classification number: H05K1/11 , H01C1/01 , H01C1/084 , H01C7/008 , H01C7/02 , H01C7/04 , H01C7/102 , H05K1/0206 , H05K1/0306 , H05K1/0313 , H05K1/116 , H05K1/181 , H05K2201/10106
Abstract: A component assembly and a method for manufacturing a component assembly are disclosed. In some embodiments a component assembly includes a carrier, a metallic structure arranged on the carrier, wherein the metallic structure comprises at least one cavity and an electrical component arranged at least in part in the cavity.
Abstract translation: 公开了一种组件组件和用于制造组件组件的方法。 在一些实施例中，部件组件包括载体，布置在载体上的金属结构，其中金属结构包括至少一个空腔和至少部分地布置在空腔中的电气部件。
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9.发明申请公开(公告)号：US20150022055A1
公开(公告)日：2015-01-22
申请号：US14380670
申请日：2013-02-19
Applicant: EPCOS AG
Inventor： Dieter Somitsch , Franz Rinner , Martin Galler , Johann Ramler , Reinhard Gabl , Sebastian Brunner
IPC: H01L41/047 , H01L41/293
CPC classification number: H01L41/0472 , H01G4/232 , H01G4/252 , H01G4/30 , H01G4/306 , H01G4/308 , H01G4/33 , H01G13/006 , H01L24/27 , H01L41/083 , H01L41/273 , H01L41/293 , Y10T29/42 , Y10T29/43 , Y10T29/435
Abstract: A method for producing an electric contact-connection of a multilayer component is specified. A main body has internal electrode layers, a insulating material, an electrically conductive material and a photosensitive material are provided. The insulating material and the electrically conductive material are arranged in a structured manner on an outer side of the multilayer component for the alternate contact-connection of the internal electrode layers. The structured arrangement is produced by the photosensitive material. A multilayer component comprising such a contact-connection is furthermore specified.
Abstract translation: 规定了多层部件的电接触连接的制造方法。 主体具有内部电极层，绝缘材料，导电材料和感光材料。 绝缘材料和导电材料以结构化方式布置在用于内部电极层的交替接触连接的多层部件的外侧上。 结构化布置由感光材料制成。 还规定了包括这种接触连接的多层部件。
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公开(公告)号：US11239010B2
公开(公告)日：2022-02-01
申请号：US16061801
申请日：2016-10-18
Applicant: EPCOS AG
Inventor： Christian Faistauer , Klaus-Dieter Aichholzer , Sebastian Brunner , Edmund Payr , Günter Pudmich
Abstract: A mechanically stable main body having a cutout, into which an ESD protection element is at least partly embedded and mechanically fixed by means of a connection means. Electrical terminals of the protection element are connected to terminal pads on the top side of the main body by way of a structured metallic layer bearing on main body and protection element.
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