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公开(公告)号：US10978615B2
公开(公告)日：2021-04-13
申请号：US16828462
申请日：2020-03-24
Applicant: EPISTAR CORPORATION
Inventor： Min-Hsun Hsieh , Tzer-Perng Chen , Jen-Chau Wu , Yuh-Ren Shieh , Chuan-Cheng Tu
Abstract: The present disclosure provides a light-emitting apparatus comprising a board having a plurality of first metal contacts and a plurality of second metal contacts on a top surface; a plurality of LEDs being bonded to the board, the each of the LEDs comprising a first cladding layer on the substrate, an active layer on the first cladding layer, a second cladding layer on the active layer, an upper surface on the second cladding layer, a first metal layer, and a second metal layer, wherein the first metal layer and the second metal layer are between the active layer and the board; an opaque layer between the adjacent LEDs and comprising a polymer mixed with a plurality of inorganic particles; and an encapsulating layer on the upper surfaces and opposite to the board, wherein the encapsulating layer does not cover a side wall of the active layer; and an underfill material between the board and the plurality of LEDs, wherein the underfill material surrounds each of the first metal layer and the second metal layer.
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公开(公告)号：US08816386B2
公开(公告)日：2014-08-26
申请号：US14157369
申请日：2014-01-16
Applicant: Epistar Corporation
Inventor： Tzer-Perng Chen , Jen-Chau Wu , Chuan-Cheng Tu , Yuh-Ren Shieh
CPC classification number: H01L33/385 , H01L25/0753 , H01L33/36 , H01L33/38 , H01L33/387 , H01L33/46 , H01L33/62 , H01L2924/0002 , H01L2933/0016 , H01L2924/00
Abstract: A flip-chip LED including a light emitting structure, a first dielectric layer, a first metal layer, a second metal layer, and a second dielectric layer is provided. The light emitting structure includes a first conductive layer, an active layer, and a second conductive layer. The active layer is disposed on the first conductive layer, and the second conductive layer is disposed on the active layer. The first metal layer is disposed on the light emitting structure and is contact with the first conductive layer, and part of the first metal layer is disposed on the first dielectric layer. The second metal layer is disposed on the light emitting structure and is in contact with the second conductive layer, and part of the second metal layer is disposed on the first dielectric layer. The second dielectric layer is disposed on the first dielectric layer. The first conductive layer includes a rough surface so as to improve a light extraction efficiency.
Abstract translation: 提供了包括发光结构，第一介电层，第一金属层，第二金属层和第二介电层的倒装LED。 发光结构包括第一导电层，有源层和第二导电层。 有源层设置在第一导电层上，第二导电层设置在有源层上。 第一金属层设置在发光结构上并与第一导电层接触，第一金属层的一部分设置在第一介电层上。 第二金属层设置在发光结构上并与第二导电层接触，第二金属层的一部分设置在第一介电层上。 第二电介质层设置在第一电介质层上。 第一导电层包括粗糙表面以提高光提取效率。
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公开(公告)号：US09018655B2
公开(公告)日：2015-04-28
申请号：US14082960
申请日：2013-11-18
Applicant: Epistar Corporation
Inventor： Chuan-Cheng Tu , Jen-Chau Wu , Yuh-Ren Shieh , Tzer-Perng Chen , Min-Hsun Hsieh
CPC classification number: H01L33/52 , H01L27/153 , H01L33/0079 , H01L33/0095 , H01L33/22 , H01L33/38 , H01L33/504 , H01L2224/13 , H01L2924/0002 , H01L2924/00
Abstract: The present disclosure provides a method for forming a light-emitting apparatus, comprising providing a first board having a plurality of first metal contacts, providing a substrate, forming a plurality of light-emitting stacks and trenches on the substrate, wherein the light-emitting stacks are apart from each other by the plurality of the trenches, bonding the light-emitting stacks to the first board, forming an encapsulating material commonly on the plurality of the light-emitting stacks, and cutting the first board and the encapsulating material to form a plurality of chip-scale LED units.
Abstract translation: 本公开提供了一种形成发光装置的方法，包括提供具有多个第一金属触点的第一板，提供基板，在所述基板上形成多个发光叠层和沟槽，其中所述发光 堆叠通过多个沟槽彼此分开，将发光叠层结合到第一板，在多个发光叠层上通常形成封装材料，并切割第一板和封装材料以形成 多个芯片级LED单元。
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