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公开(公告)号：US11728310B2
公开(公告)日：2023-08-15
申请号：US17838307
申请日：2022-06-13
Applicant: EPISTAR CORPORATION
Inventor： Min-Hsun Hsieh , Shih-An Liao , Ying-Yang Su , Hsin-Mao Liu , Tzu-Hsiang Wang , Chi-Chih Pu
IPC: H01L23/00 , H01L25/16 , H01L25/075 , H01L23/498 , B23K26/22 , B23K101/40
CPC classification number: H01L24/81 , B23K26/22 , H01L23/49866 , H01L24/83 , H01L25/0753 , H01L25/167 , B23K2101/40 , H01L2224/81005 , H01L2224/81224 , H01L2224/83005 , H01L2224/83224 , H01L2924/12041
Abstract: Disclosed is a die-bonding method which provides a target substrate having a circuit structure with multiple electrical contacts and multiple semiconductor elements each semiconductor element having a pair of electrodes, arranges the multiple semiconductor elements on the target substrate with the pair of electrodes of each semiconductor element aligned with two corresponding electrical contacts of the target substrate, and applies at least one energy beam to join and electrically connect the at least one pair of electrodes of every at least one of the multiple semiconductor elements and the corresponding electrical contacts aligned therewith in a heating cycle by heat carried by the at least one energy beam in the heating cycle. The die-bonding method delivers scattering heated dots over the target substrate to avoid warpage of PCB and ensures high bonding strength between the semiconductor elements and the circuit structure of the target substrate.
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公开(公告)号：US11362060B2
公开(公告)日：2022-06-14
申请号：US16551764
申请日：2019-08-27
Applicant: EPISTAR CORPORATION
Inventor： Min-Hsun Hsieh , Shih-An Liao , Ying-Yang Su , Hsin-Mao Liu , Tzu-Hsiang Wang , Chi-Chih Pu
IPC: H01L23/00 , H01L25/16 , H01L25/075 , H01L23/498 , B23K26/22 , B23K101/40
Abstract: Disclosed is a die-bonding method which provides a target substrate having a circuit structure with multiple electrical contacts and multiple semiconductor elements each semiconductor element having a pair of electrodes, arranges the multiple semiconductor elements on the target substrate with the pair of electrodes of each semiconductor element aligned with two corresponding electrical contacts of the target substrate, and applies at least one energy beam to join and electrically connect the at least one pair of electrodes of every at least one of the multiple semiconductor elements and the corresponding electrical contacts aligned therewith in a heating cycle by heat carried by the at least one energy beam in the heating cycle. The die-bonding method delivers scattering heated dots over the target substrate to avoid warpage of PCB and ensures high bonding strength between the semiconductor elements and the circuit structure of the target substrate.
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公开(公告)号：US10890553B2
公开(公告)日：2021-01-12
申请号：US15804455
申请日：2017-11-06
Applicant: EPISTAR CORPORATION
Inventor： Kunal Kashyap , Kun-Wei Kao , Yih-Hua Renn , Meng-Lun Tsai , Zong-Xi Chen , Hsin-Mao Liu , Jui-Hung Yeh , Hung-Chi Wang
IPC: G01N27/414 , H01L29/778 , H01L23/34 , G01N27/02 , H01L29/20 , H01L29/205 , H01L29/10 , H01L23/31
Abstract: A sensing device includes a first III-V compound stack and a second III-V compound stack. The first III-V compound stack has a first sensing area, and the second III-V compound stack has a second sensing area. A passivation layer fully covers the second sensing area. The first III-V compound stack is physically separated from the second III-V compound stack, and has material compositions and structures same as the second III-V compound stack.
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公开(公告)号：US10134804B2
公开(公告)日：2018-11-20
申请号：US15167131
申请日：2016-05-27
Applicant: EPISTAR CORPORATION
Inventor： Min Hsun Hsieh , Hsin-Mao Liu
IPC: H01L31/12 , H01L27/32 , H01L27/15 , G09G3/32 , H01L33/48 , H01L33/50 , H01L33/56 , H01L33/62 , H01L33/38 , H01L33/44
Abstract: A method of forming a light-emitting device. The light-emitting device includes a first optoelectronic unit, a second optoelectronic unit, a fence, and a cover. The first optoelectronic unit has a first side surface. The second optoelectronic unit is apart from the first optoelectronic unit and has a second side surface. The fence surrounds the first side surface and the second side surface. The cover is on the first optoelectronic unit and the fence.
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公开(公告)号：US09893244B2
公开(公告)日：2018-02-13
申请号：US14858477
申请日：2015-09-18
Applicant: EPISTAR CORPORATION
Inventor： Cheng-Nan Han , Tsung-Xian Lee , Min-Hsun Hsieh , Hung-Hsuan Chen , Hsin-Mao Liu , Hsing-Chao Chen , Ching San Tao , Chih-Peng Ni , Tzer-Perng Chen , Jen-Chau Wu , Masafumi Sano , Chih-Ming Wang
CPC classification number: H01L33/502 , H01L21/568 , H01L33/38 , H01L33/387 , H01L33/44 , H01L33/46 , H01L33/50 , H01L33/54 , H01L33/58 , H01L33/62 , H01L33/647 , H01L2224/04105 , H01L2224/19 , H01L2224/32245 , H01L2224/48091 , H01L2224/73265 , H01L2224/73267 , H01L2224/9222 , H01L2933/005 , H01L2933/0066 , H01L2924/00014
Abstract: An optoelectronic element includes an optoelectronic unit, a first metal layer, a second metal layer, a conductive layer and a transparent structure. The optoelectronic unit has a central line in a top view, a top surface, and a bottom surface. The second metal layer is formed on the top surface, and has an extension portion crossing over the central line and extending to the first metal layer. The conductive layer covers the first metal layer and the extension portion. The transparent structure covers the bottom surface without covering the top surface.
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Patent Agency Ranking
公开(公告)号：US09406719B2
公开(公告)日：2016-08-02
申请号：US14924264
申请日：2015-10-27
Applicant: EPISTAR CORPORATION
Inventor： Chien-Fu Shen , Chao-Hsing Chen , Tsun-Kai Ko , Schang-Jing Hon , Sheng-Jie Hsu , De-Shan Kuo , Hsin-Ying Wang , Chiu-Lin Yao , Chien-Fu Huang , Hsin-Mao Liu , Chien-Kai Chung
IPC: H01L33/62 , H01L27/15 , H01L25/075 , H01L33/20 , H01L33/38
CPC classification number: H01L27/156 , H01L25/0753 , H01L27/153 , H01L33/20 , H01L33/382 , H01L33/385 , H01L33/44 , H01L33/62 , H01L2924/0002 , H01L2924/00
Abstract: A light-emitting structure, comprising a substrate; a first unit and a second unit, separately formed on the substrate; a trench between the first unit and the second unit, comprising a bottom portion exposing the substrate; an insulating layer arranged on the trench, conformably covering the bottom portion and sidewalls of the first unit and the second unit; and an electrical connection, conformably covering the insulating layer, electrically connecting the first unit and the second unit and comprising a bridging portion and a joining portion extending from the bridging portion, wherein the bridging portion is wider than the joining portion and the bridging portion covers the trench, and the joining portion covers the first unit and the second unit.
Abstract translation: 1.一种发光结构，包括基板; 分别形成在所述基板上的第一单元和第二单元; 第一单元和第二单元之间的沟槽，包括露出衬底的底部; 布置在所述沟槽上的绝缘层，其适配地覆盖所述第一单元和所述第二单元的底部和侧壁; 以及电连接，其顺应地覆盖绝缘层，电连接第一单元和第二单元，并且包括桥接部分和从桥接部分延伸的接合部分，其中桥接部分比接合部分宽，桥接部分覆盖 沟槽和接合部分覆盖第一单元和第二单元。
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公开(公告)号：US11791370B2
公开(公告)日：2023-10-17
申请号：US17659634
申请日：2022-04-18
Applicant: EPISTAR CORPORATION
Inventor： Min Hsun Hsieh , Hsin-Mao Liu
CPC classification number: H01L27/156 , G09G3/32 , H01L27/15 , H01L33/486 , H01L33/507 , H01L33/56 , H01L33/62 , H01L33/385 , H01L33/44 , H01L2224/24 , H01L2933/005 , H01L2933/0033 , H01L2933/0041 , H01L2933/0066
Abstract: This disclosure discloses a light-emitting display module display. The light-emitting display module comprises: a board; and a plurality of light-emitting diode modules arranged in an array configuration on the board; wherein one of the light-emitting diode modules comprises a plurality of encapsulated light-emitting units spaced apart from each other; and one of the encapsulated light-emitting units comprises a plurality of optoelectronic units, a first supporting, and a fence; and wherein the plurality of optoelectronic units are covered by the first supporting structure, and the fence surrounds the first supporting structure and the plurality of optoelectronic units.
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公开(公告)号：US11588084B2
公开(公告)日：2023-02-21
申请号：US16748860
申请日：2020-01-22
Applicant: EPISTAR CORPORATION
Inventor： Min-Hsun Hsieh , Shih-An Liao , Ying-Yang Su , Hsin-Mao Liu , Tzu-Hsiang Wang , Chi-Chih Pu
IPC: H01L33/62 , H01L33/60 , H01L25/075 , H05K3/34 , G02F1/1368 , H01L27/32
Abstract: Disclosed is a die-bonding method which provides a target substrate having a circuit structure with multiple electrical contacts and multiple semiconductor elements each semiconductor element having a pair of electrodes, arranges the multiple semiconductor elements on the target substrate with the pair of electrodes of each semiconductor element aligned with two corresponding electrical contacts of the target substrate, and applies at least one energy beam to join and electrically connect the at least one pair of electrodes of every at least one of the multiple semiconductor elements and the corresponding electrical contacts aligned therewith in a heating cycle by heat carried by the at least one energy beam in the heating cycle. The die-bonding method delivers scattering heated dots over the target substrate to avoid warpage of PCB and ensures high bonding strength between the semiconductor elements and the circuit structure of the target substrate.
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公开(公告)号：US10062730B2
公开(公告)日：2018-08-28
申请号：US15196717
申请日：2016-06-29
Applicant: EPISTAR CORPORATION
Inventor： Chien-Fu Shen , Chao-Hsing Chen , Tsun-Kai Ko , Schang-Jing Hon , Sheng-Jie Hsu , De-Shan Kuo , Hsin-Ying Wang , Chiu-Lin Yao , Chien-Fu Huang , Hsin-Mao Liu , Chien-Kai Chung
CPC classification number: H01L27/156 , H01L25/0753 , H01L27/153 , H01L33/20 , H01L33/382 , H01L33/385 , H01L33/44 , H01L33/62 , H01L2924/0002 , H01L2924/00
Abstract: Disclosed herein is a light-emitting device. The light-emitting device includes a substrate; a first light-emitting unit and a second light-emitting unit, separately formed on the substrate; a trench between the first and the second light-emitting units, including a bottom portion exposing the substrate; an insulating layer, comprising a first part formed on the first light-emitting unit or the second light-emitting unit, and a second part conformably formed on the trench covering the bottom portion and sidewalls of the first light-emitting unit and the second light-emitting unit; and an electrical connection, electrically connecting the first light-emitting unit and the second light-emitting unit, comprising a bridging portion formed on the second part of the insulating layer, and only covering a portion of the trench; and a joining portion, extending from the bridging portion and formed on the first part of the insulating layer; wherein the bridging portion is wider than the joining portion in a top view.
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公开(公告)号：US09997687B2
公开(公告)日：2018-06-12
申请号：US15401710
申请日：2017-01-09
Applicant: EPISTAR CORPORATION
Inventor： Shih-I Chen , Chia-Liang Hsu , Tzu-Chieh Hsu , Han-Min Wu , Ye-Ming Hsu , Chien-Fu Huang , Chao-Hsing Chen , Chiu-Lin Yao , Hsin-Mao Liu , Chien-Kai Chung
IPC: H01L33/38 , H01L33/46 , H01L33/60 , H01L33/62 , H01L27/15 , H01L33/42 , H01L33/08 , H01L33/10 , H01L33/14 , H01L33/44 , H01L33/48 , H01L25/075 , H01L33/32 , H01L33/40
CPC classification number: H01L33/62 , H01L25/0753 , H01L27/15 , H01L33/08 , H01L33/10 , H01L33/145 , H01L33/32 , H01L33/382 , H01L33/385 , H01L33/40 , H01L33/42 , H01L33/44 , H01L33/46 , H01L33/483 , H01L33/60 , H01L2924/0002 , H01L2924/00
Abstract: A light-emitting device comprising: a supportive substrate; a transparent layer formed on the supportive substrate, and the transparent layer comprising conductive metal oxide material; a light-emitting stacked layer comprising an active layer formed on the transparent layer; and an etching-stop layer formed between the light-emitting stacked layer and the supportive substrate and contacting the transparent layer, wherein a thickness of the etching-stop layer is thicker than that of the transparent layer.
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