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公开(公告)号:US11011681B2
公开(公告)日:2021-05-18
申请号:US14541680
申请日:2014-11-14
Applicant: EPISTAR CORPORATION
Inventor: Chien-Liang Liu , Ming-Chi Hsu , Shih-An Liao , Jen-Chieh Yu , Min-Hsun Hsieh , Jia-Tay Kuo , Yu-His Sung , Po-Chang Chen
Abstract: The present application discloses a light-emitting device comprises a semiconductor light-emitting element, a transparent element covering the semiconductor light-emitting element, an insulating layer which connects to the transparent element, an intermediate layer which connects to the insulating layer; and a conductive adhesive material connecting to the intermediate layer.
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公开(公告)号:US11011680B2
公开(公告)日:2021-05-18
申请号:US16566585
申请日:2019-09-10
Applicant: EPISTAR CORPORATION
Inventor: Yi-Hung Lin , Chao-Hsing Chen , Jia-Kuen Wang , Tzu-Yao Tseng , Jen-Chieh Yu , Guan-Wu Chen
IPC: H01L33/40 , H01L33/22 , H01L33/46 , H01L33/42 , H01L33/62 , H01L33/00 , H01L33/32 , H01L33/06 , H01L33/12 , F21K9/23 , F21K9/232 , F21Y115/10 , F21K9/69
Abstract: A light-emitting device includes a semiconductor structure including a first semiconductor layer, a second semiconductor layer, and an active layer formed between the first semiconductor layer and the second semiconductor layer; a via penetrating the second semiconductor layer and the active layer to expose a surface of the first semiconductor layer; a first electrode formed in the via and on the second semiconductor layer; a second electrode formed on the second semiconductor layer; and an insulating structure covering the first electrode, the second electrode and the semiconductor structure and including a first opening to expose the first electrode and a second opening to expose the second electrode, wherein the first electrode and the second electrode respectively include a metal layer contacting the insulating layer, the metal layer includes a material including a surface tension value larger than 1500 dyne/cm and a standard reduction potential larger than 0.3 V.
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公开(公告)号:USD993199S1
公开(公告)日:2023-07-25
申请号:US29763121
申请日:2020-12-21
Applicant: Epistar Corporation , Yenrich Technology Corporation
Designer: Min-Hsun Hsieh , Jen-Chieh Yu , Chun-Wei Chen , Chun-Hung Liu
Abstract: FIG. 1 is a first perspective view of a light-emitting device showing our new design;
FIG. 2 is a second perspective view thereof;
FIG. 3 is a front elevational view thereof;
FIG. 4 is a rear elevational view thereof;
FIG. 5 is a left side view thereof;
FIG. 6 is a right side view thereof;
FIG. 7 is a top plan view thereof; and,
FIG. 8 is a bottom plan view thereof.-
公开(公告)号:US10177290B2
公开(公告)日:2019-01-08
申请号:US15482422
申请日:2017-04-07
Applicant: EPISTAR CORPORATION
Inventor: Min-Hsun Hsieh , Jen-Chieh Yu , Wei-Fan Ke
IPC: H01L33/60 , H01L23/00 , H01L33/00 , H01L33/38 , H01L33/50 , H01L33/62 , H01L33/30 , H01L33/40 , H01L33/46
Abstract: This disclosure discloses a light-emitting device includes a semiconductor stack, an electrode, an electrode post, a reflective insulating layer, an extending electrode, and a supporting structure. The electrode is disposed on a lower surface of the semiconductor stack, and electrically connected to the semiconductor stack. The electrode post is disposed on the electrode. The reflective insulating layer surrounds the electrode post, and has a bottom surface which is coplanar with the electrode post. The extending electrode is disposed on an upper surface of the semiconductor stack. The supporting structure is located on the extending electrode.
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公开(公告)号:US20200020829A1
公开(公告)日:2020-01-16
申请号:US16566585
申请日:2019-09-10
Applicant: EPISTAR CORPORATION
Inventor: Yi-Hung Lin , Chao-Hsing Chen , Jia-Kuen Wang , Tzu-Yao Tseng , Jen-Chieh Yu , Guan-Wu Chen
Abstract: A light-emitting device includes a semiconductor structure including a first semiconductor layer, a second semiconductor layer, and an active layer formed between the first semiconductor layer and the second semiconductor layer; a via penetrating the second semiconductor layer and the active layer to expose a surface of the first semiconductor layer; a first electrode formed in the via and on the second semiconductor layer; a second electrode formed on the second semiconductor layer; and an insulating structure covering the first electrode, the second electrode and the semiconductor structure and including a first opening to expose the first electrode and a second opening to expose the second electrode, wherein the first electrode and the second electrode respectively include a metal layer contacting the insulating layer, the metal layer includes a material including a surface tension value larger than 1500 dyne/cm and a standard reduction potential larger than 0.3 V.
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公开(公告)号:US20180212126A1
公开(公告)日:2018-07-26
申请号:US15880908
申请日:2018-01-26
Applicant: EPISTAR CORPORATION
Inventor: Yi-Hung Lin , Chao-Hsing Chen , Jia-Kuen Wang , Tzu-Yao Tseng , Jen-Chieh Yu , Guan-Wu Chen
CPC classification number: H01L33/405 , F21K9/23 , F21K9/232 , F21K9/69 , F21Y2115/10 , H01L33/0075 , H01L33/06 , H01L33/12 , H01L33/22 , H01L33/32 , H01L33/42 , H01L33/46 , H01L33/62 , H01L2933/0016 , H01L2933/0025
Abstract: A light-emitting device includes a semiconductor structure including a first semiconductor layer, a second semiconductor layer, and an active layer formed between the first semiconductor layer and the second semiconductor layer; a via penetrating the second semiconductor layer and the active layer to expose a surface of the first semiconductor layer; a first electrode formed in the via and on the second semiconductor layer; a second electrode formed on the second semiconductor layer; and an insulating structure covering the first electrode, the second electrode and the semiconductor structure and including a first opening to expose the first electrode and a second opening to expose the second electrode, wherein the first electrode and the second electrode respectively include a metal layer contacting the insulating layer, the metal layer includes a material including a surface tension value larger than 1500 dyne/cm and a standard reduction potential larger than 0.3 V.
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公开(公告)号:US11996493B2
公开(公告)日:2024-05-28
申请号:US17395641
申请日:2021-08-06
Applicant: EPISTAR CORPORATION
Inventor: Min-Hsun Hsieh , Jen-Chieh Yu , Chun-Wei Chen
IPC: H01L31/147 , G09G3/32 , H05B45/12
CPC classification number: H01L31/147 , G09G3/32 , H05B45/12 , G09G2320/0626
Abstract: The present disclosure provides a light-emitting module and a display apparatus thereof. The light-emitting module includes a circuit substrate which includes a first surface and a second surface opposite to the first surface. The first surface includes a plurality of conductive channels, and the second surface includes a plurality of conductive pads. A plurality of light-emitting groups is arranged in a matrix on the first surface. Each of the light-emitting groups includes a red light-emitting diode chip, a green light-emitting diode chip, and a blue light-emitting diode chip. An electric component is disposed on the first surface and located in the light-emitting groups matrix. A translucent encapsulating component covers the plurality of light-emitting groups and the electric component. Wherein, the light-emitting groups matrix comprises m columns and n rows.
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公开(公告)号:US10770635B2
公开(公告)日:2020-09-08
申请号:US16419570
申请日:2019-05-22
Applicant: EPISTAR CORPORATION
Inventor: Chien-Liang Liu , Ming-Chi Hsu , Jen-Chieh Yu
Abstract: This disclosure discloses a light-emitting device. The light-emitting device includes a light-emitting stack with a first (top) surface, a bottom surface and at least one side surface connected to the first surface and the bottom surface, a light-reflective enclosure with a second (top) surface, a contact electrode formed on the bottom surface of the light-emitting layer, and a wavelength converting layer. Moreover, the light-reflective enclosure surrounds the side surface of the light-emitting stack and exposes to the first surface. The wavelength converting layer covers the first surface and the second surface. In addition, the second surface has a plurality of fine concave structures distributed on the second surface.
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公开(公告)号:US10446721B2
公开(公告)日:2019-10-15
申请号:US15880908
申请日:2018-01-26
Applicant: EPISTAR CORPORATION
Inventor: Yi-Hung Lin , Chao-Hsing Chen , Jia-Kuen Wang , Tzu-Yao Tseng , Jen-Chieh Yu , Guan-Wu Chen
IPC: H01L33/40 , H01L33/22 , H01L33/46 , H01L33/42 , H01L33/62 , H01L33/00 , H01L33/32 , F21K9/23 , H01L33/06 , H01L33/12 , F21K9/232 , F21Y115/10 , F21K9/69
Abstract: A light-emitting device includes a semiconductor structure including a first semiconductor layer, a second semiconductor layer, and an active layer formed between the first semiconductor layer and the second semiconductor layer; a via penetrating the second semiconductor layer and the active layer to expose a surface of the first semiconductor layer; a first electrode formed in the via and on the second semiconductor layer; a second electrode formed on the second semiconductor layer; and an insulating structure covering the first electrode, the second electrode and the semiconductor structure and including a first opening to expose the first electrode and a second opening to expose the second electrode, wherein the first electrode and the second electrode respectively include a metal layer contacting the insulating layer, the metal layer includes a material including a surface tension value larger than 1500 dyne/cm and a standard reduction potential larger than 0.3 V.
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公开(公告)号:US12272774B2
公开(公告)日:2025-04-08
申请号:US17322459
申请日:2021-05-17
Applicant: EPISTAR CORPORATION
Inventor: Chien-Liang Liu , Ming-Chi Hsu , Shih-An Liao , Jen-Chieh Yu , Min-Hsun Hsieh , Jia-Tay Kuo , Yu-Hsi Sung , Po-Chang Chen
IPC: H01L33/54 , H01L25/075 , H01L33/00 , H01L33/10 , H01L33/24 , H01L33/32 , H01L33/36 , H01L33/38 , H01L33/44 , H01L33/46 , H01L33/50 , H01L33/52
Abstract: The present application discloses a light-emitting device comprises a semiconductor light-emitting element, a transparent element covering the semiconductor light-emitting element, an insulating layer which connects to the transparent element, an intermediate layer which connects to the insulating layer; and a conductive adhesive material connecting to the intermediate layer.
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