Methods and apparatus for semiconductor sample workflow

    公开(公告)号:US10707137B2

    公开(公告)日:2020-07-07

    申请号:US16405506

    申请日:2019-05-07

    Applicant: FEI Company

    Abstract: Apparatus and methods are described for the automated transfer and storage of transmission electron microscope (TEM) and scanning/transmission electron microscope (STEM) lamella samples throughout a semiconductor manufacturing facility using existing automation infrastructure such as a Front Opening Unified Pod (FOUP). Also provided are wafer facsimiles corresponding to outer dimensions of semiconductor, data storage or solar cell wafers, wherein the facsimiles adapted to store, carry and/or provide a testing platform for testing of samples taken from semiconductor, data storage or solar cell wafers.

    INCREASING INFORMATION RESULTING FROM APODIZATION

    公开(公告)号:US20250155847A1

    公开(公告)日:2025-05-15

    申请号:US18510047

    申请日:2023-11-15

    Applicant: FEI Company

    Abstract: Embodiments herein relate to apodization of a hologram. A system can comprise a memory that stores, and a processor that executes, computer executable components. The computer executable components can comprise an obtaining component that obtains a signal of an energy-based initial hologram, an expansion component that expands the initial hologram at a boundary of the initial hologram, resulting in an expanded hologram having an expanded portion at the boundary, and a filter application component that, based on the expanded hologram, applies an apodization filter to overlap the expanded portion of the expanded hologram.

    Methods and apparatus for semiconductor sample workflow

    公开(公告)号:US10312162B2

    公开(公告)日:2019-06-04

    申请号:US15615494

    申请日:2017-06-06

    Applicant: FEI Company

    Abstract: Apparatus and methods are described for the automated transfer and storage of transmission electron microscope (TEM) and scanning/transmission electron microscope (STEM) lamella samples throughout a semiconductor manufacturing facility using existing automation infrastructure such as a Front Opening Unified Pod (FOUP). Also provided are wafer facsimiles corresponding to outer dimensions of semiconductor, data storage or solar cell wafers, wherein the facsimiles adapted to store, carry and/or provide a testing platform for testing of samples taken from semiconductor, data storage or solar cell wafers.

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