Multilayer structure and method of forming the same

    公开(公告)号:US11462746B2

    公开(公告)日:2022-10-04

    申请号:US15941165

    申请日:2018-03-30

    Applicant: FLOSFIA INC.

    Abstract: In a first aspect of a present inventive subject matter, a multilayer structure includes a base with a surface and an electrically-conductive metal oxide film that is positioned directly or via another layer on the base. At least a part of the surface of the base contains as a major component at least one selected from the group of copper, copper alloy, aluminum, aluminum alloy, magnesium, magnesium alloy, and stainless steel. The electrically-conductive metal oxide film is 30 nm or more in thickness. The multilayer structure is electrically-conductive and has a contact resistance that is 100 mΩcm2 or less.

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