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    Integrated circuit with laminated magnetic core inductor and magnetic flux closure layer
    3.
    发明授权
    Integrated circuit with laminated magnetic core inductor and magnetic flux closure layer 有权

    公开(公告)号：US11058001B2

    公开(公告)日：2021-07-06

    申请号：US16007631

    申请日：2018-06-13

    Applicant: Ferric Inc.

    Inventor： Noah Sturcken ,  Ryan Davies ,  Michael Lekas

    IPC: H01F27/28 ,  H05K1/18 ,  H01F41/04 ,  H01F41/02 ,  H01F27/24 ,  H05K1/02 ,  H05K1/11 ,  H01F17/00 ,  H01F41/32 ,  H05K1/16 ,  H05K1/03

    Abstract: A structure comprises a semiconductor integrated circuit, an inductor, and a magnetic flux closure layer. The inductor is integrated into a multilevel wiring network in the semiconductor integrated circuit. The inductor includes a planar laminated magnetic core and a conductive winding that turns around in a generally spiral manner on the outside of the planar laminated magnetic core. The planar laminated magnetic core includes an alternating sequence of a magnetic layer and a non-magnetic layer. The magnetic flux closure layer is disposed within about 100 μm of a face of the planar laminated magnetic core, the face of the planar magnetic core parallel to a principal plane of the planar laminated magnetic core. A second magnetic flux closure layer can be disposed within about 100 μm of an opposing face of the planar laminated magnetic core.

    Compact Transceiver on a Multi-Level Integrated Circuit
    4.
    发明申请
    Compact Transceiver on a Multi-Level Integrated Circuit 审中-公开

    公开(公告)号：US20200168394A1

    公开(公告)日：2020-05-28

    申请号：US16778154

    申请日：2020-01-31

    Applicant: Ferric Inc.

    Inventor： Michael Lekas ,  Noah Sturcken

    IPC: H01F38/14 ,  H04B5/00 ,  H01F27/24 ,  H01L23/64 ,  H02J50/12

    Abstract: Power and/or data are transmitted through variable magnetic fields between a first transceiver coil on a transceiver apparatus and a second transceiver coil in an inductor integrated into a multilevel wiring structure on a semiconductor integrated circuit chip. The first transceiver apparatus generates magnetic fields and can transmit data by varying a characteristic of the magnetic fields. The second transceiver coil receives the power from and/or detects data in the magnetic fields from the first transceiver apparatus. The inductor can include a ferromagnetic core that concentrates magnetic flux to improve data or power transmission efficiency to miniaturize the second transceiver coil while maintaining adequate inductive coupling between the coils. The second transceiver coil can transmit data by varying the impedance of the inductor and/or the integrated circuit. The semiconductor integrated circuit chip can be coupled to an object and the second transceiver coil can transmit data relating to the object.

    Processor module with integrated packaged power converter
    5.
    发明授权
    Processor module with integrated packaged power converter 有权

    公开(公告)号：US10658331B2

    公开(公告)日：2020-05-19

    申请号：US16129305

    申请日：2018-09-12

    Applicant: Ferric Inc.

    Inventor： Noah Sturcken ,  Ehsan Kalami ,  Joseph Meyer ,  Michael Lekas

    IPC: H01L25/065 ,  H02M3/158 ,  H01L49/02 ,  H01L23/48 ,  H01L23/64

    Abstract: A power management module comprises one or more power converter chips that are mounted on a power management package substrate. First and second electrical contacts are disposed on opposing first and second sides of the power management package substrate. The power management module can be mounted on a processor module to supply power to one or more processor chips in the processor module. In one example, the processor chip(s) are mounted on a first side of a processor package substrate and the power management module is mounted on an opposing second side of the processor package substrate. The power management module and the processor module can be centered and aligned with respect to each other or they can be offset laterally from each other. In another embodiment, the processor chip(s) are embedded in the processor package substrate.

    Electromagnetically-Driven Ferromagnetic Actuator Device
    6.
    发明申请
    Electromagnetically-Driven Ferromagnetic Actuator Device 审中-公开

    公开(公告)号：US20200152364A1

    公开(公告)日：2020-05-14

    申请号：US16184024

    申请日：2018-11-08

    Applicant: Ferric Inc.

    Inventor： Noah Sturcken ,  Ryan Davies ,  Michael Lekas

    IPC: H01F7/06 ,  H01L23/522 ,  H01L27/092 ,  H01F7/14 ,  H01F7/08 ,  H01F7/126 ,  B64C33/02

    Abstract: A ferromagnetic actuator is disposed between first and second semiconductor devices that include first and second inductors. Each inductor is disposed on top of a multilevel wiring structure. Current flows through the first inductor to generate a first magnetic field that attracts the ferromagnetic actuator towards the first inductor causing the ferromagnetic actuator to transition from a first state to a second state. In the second state, a portion of the ferromagnetic actuator is disposed closer to the first inductor than it is in the first state. Current flows through the second inductor to generate a second magnetic field that attracts the ferromagnetic actuator towards the second inductor causing the ferromagnetic actuator to transition from the first or second state to a third state. In the third state, a portion of the ferromagnetic actuator is disposed closer to the first inductor than it is in the first state.

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