公开(公告)号：US12125713B2

公开(公告)日：2024-10-22

申请号：US17655832

申请日：2022-03-22

Applicant: Ferric Inc.

Inventor： Michael Lekas ,  Salahuddin Raju ,  Noah Sturcken ,  Ryan Davies ,  Denis Shishkov

IPC: H01L21/3205 ,  H01F17/00 ,  H01F41/32 ,  H01L21/02 ,  H01L21/324 ,  H01L21/78 ,  H01L23/522 ,  H01L49/02

CPC classification number: H01L21/3205 ,  H01F41/32 ,  H01L21/02172 ,  H01L21/324 ,  H01L21/7806 ,  H01L23/5227 ,  H01F17/0033 ,  H01L28/10

Abstract: A method for manufacturing a ferromagnetic-dielectric composite material comprises: (a) placing patterned ferromagnetic layer regions, in a patterning substrate assembly that includes a patterning substrate and a first dielectric layer, in physical contact with a second dielectric layer, the second dielectric layer in a receiving substrate assembly that includes a receiving substrate, (b) forming a bond between the patterned ferromagnetic layer regions and the second dielectric layer; (c) releasing the patterning substrate from the patterning substrate assembly to transfer the patterned ferromagnetic layer regions and the first dielectric layer from the patterning substrate assembly to the receiving substrate assembly; and (d) releasing the receiving substrate from the receiving substrate assembly to form the ferromagnetic-dielectric composite material.

公开(公告)号：US11302469B2

公开(公告)日：2022-04-12

申请号：US16257392

申请日：2019-01-25

Applicant: Ferric Inc.

Inventor： Noah Sturcken ,  Ryan Davies ,  Michael Lekas

IPC: H01F41/04 ,  H01F27/24 ,  H01F17/00 ,  H01F1/147 ,  H01L49/02 ,  H01F41/14 ,  H01F41/06 ,  H01F13/00 ,  H01F27/38 ,  H01F27/255 ,  H01F17/06 ,  H01F27/28 ,  H01F17/04 ,  H01F41/26

Abstract: A method of fabricating an inductor includes (a) forming a ferromagnetic core on a semiconductor substrate, the ferromagnetic core lying in a core plane and (b) fabricating an inductor coil that winds around the ferromagnetic core, the inductor coil configured to generate an inductor magnetic field that passes through the ferromagnetic core in a first direction parallel to the core plane. While forming the ferromagnetic core, the method further includes (1) generating a bias magnetic field that passes through the ferromagnetic core in a second direction that is orthogonal to the first direction, and (2) inducing a magnetic anisotropy in the ferromagnetic core with the bias magnetic field.

公开(公告)号：US20210296048A1

公开(公告)日：2021-09-23

申请号：US17341643

申请日：2021-06-08

Applicant: Ferric Inc.

Inventor： Noah Sturcken ,  Ryan Davies ,  Michael Lekas

IPC: H01F41/02 ,  H01F41/04 ,  C23C14/34 ,  C23C14/58 ,  H01L49/02

Abstract: An inductor includes a planar laminated magnetic core and a conductive winding. The planar magnetic core includes an alternating sequence of a magnetic layer and a non-magnetic layer. The non-magnetic layer includes an insulating layer that is disposed between first and second interface layers. The conductive winding turns around in a generally spiral manner on the outside of the planar laminated magnetic core. The inductor can be integrated into a multilevel wiring network in a semiconductor integrated circuit to form a microelectronic device, such as a transformer, a power converter, or a microprocessor.

公开(公告)号：US10064277B2

公开(公告)日：2018-08-28

申请号：US15084046

申请日：2016-03-29

Applicant: Ferric Inc.

Inventor： Noah Sturcken ,  Ryan Davies ,  Hao Wu ,  Michael Lekas

IPC: H01L23/522 ,  H05K1/18 ,  H03H7/38 ,  H01L23/498

CPC classification number: H05K1/18 ,  H01F17/0013 ,  H01F2017/0066 ,  H01F2017/0086 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/5226 ,  H01L23/5227 ,  H03H1/00 ,  H03H7/38 ,  H05K1/165

Abstract: An integrated passive device and assemblies containing the same are disclosed. The integrated passive device can include a thin-film magnetic inductor. Various configurations of electrically connecting an integrated passive device to a processor and/or an interposer such as a chip-scale package are also disclosed.

公开(公告)号：US20170290156A1

公开(公告)日：2017-10-05

申请号：US15084046

申请日：2016-03-29

Applicant: Ferric Inc.

Inventor： Noah Sturcken ,  Ryan Davies ,  Hao Wu ,  Michael Lekas

IPC: H05K1/18 ,  H01L23/498 ,  H03H7/38 ,  H01L23/522

CPC classification number: H05K1/18 ,  H01F17/0013 ,  H01F2017/0066 ,  H01F2017/0086 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/5226 ,  H01L23/5227 ,  H03H1/00 ,  H03H7/38 ,  H05K1/165

Abstract: An integrated passive device and assemblies containing the same are disclosed. The integrated passive device can include a thin-film magnetic inductor. Various configurations of electrically connecting an integrated passive device to a processor and/or an interposer such as a chip-scale package are also disclosed.

公开(公告)号：US20170250134A1

公开(公告)日：2017-08-31

申请号：US15409697

申请日：2017-01-19

Applicant: Ferric Inc.

Inventor： Noah Sturcken ,  Ryan Davies

IPC: H01L23/522 ,  H01L23/00 ,  H01F41/04 ,  H01L49/02 ,  H01L21/321 ,  H01F41/02 ,  H01L21/56 ,  H01L23/528

CPC classification number: H01L23/5227 ,  C08K3/08 ,  C08K3/22 ,  C08K2003/0843 ,  C08K2003/0856 ,  C08K2003/0862 ,  C08K2003/2265 ,  C08K2003/2289 ,  C08K2003/2293 ,  H01F1/26 ,  H01F1/37 ,  H01F17/0013 ,  H01F41/0206 ,  H01F41/04 ,  H01F41/046 ,  H01F2003/106 ,  H01L21/321 ,  H01L21/563 ,  H01L23/295 ,  H01L23/3142 ,  H01L23/5226 ,  H01L23/528 ,  H01L24/17 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L28/10 ,  H01L2224/13022 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16265 ,  H01L2224/2929 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/2936 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/831 ,  H01L2224/8312 ,  H01L2224/83855 ,  H01L2224/83909 ,  H01L2224/92125 ,  H01L2924/0665 ,  H01L2924/13067 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1425 ,  H01L2924/19011 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19102 ,  H01L2924/2064 ,  H01L2924/2075 ,  H01L2924/3025 ,  H01L2924/00

Abstract: A magnetic polymer for use in microelectronic fabrication includes a polymer matrix and a plurality of ferromagnetic particles disposed in the polymer matrix. The magnetic polymer can be part of an insulation layer in an inductor formed in one or more backend wiring layers of an integrated device. The magnetic polymer can also be in the form of a magnetic epoxy layer for mounting contacts of the integrated device to a package substrate.

公开(公告)号：US20160211317A1

公开(公告)日：2016-07-21

申请号：US15082260

申请日：2016-03-28

Applicant: Ferric Inc.

Inventor： Noah Andrew Sturcken ,  Ryan Davies

IPC: H01L49/02 ,  H01L21/3205

CPC classification number: H01L28/10 ,  H01L21/32051 ,  H01L23/5223 ,  H01L23/5227 ,  H01L23/645 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Integrated multi-layer magnetic films for use in passive devices in microelectronic applications and methods of manufacture thereof. Soft ferromagnetic materials exhibiting high permeability and low coercivity are laminated together with insulating layers interposed. Electrical conductors coupled to interconnects are magnetically coupled to magnetic film layers to engender an inductor (self and mutual). Soft ferromagnetic materials are provided in an alternating array of parallel plate capacitors. Each alternating magnetic film is electrically coupled to either a primary or secondary electrical conductor interconnects and separated by an electrically insulating dielectric material. Alternatively, each alternating magnetic layer comprises an induced anisotropy material, which can also be combined with coiled conductor giving rise to a hybrid inductive/capacitive device. Also, soft ferromagnetic material are also selected and tuned to provide for FMR notch filtering.

公开(公告)号：US20150371756A1

公开(公告)日：2015-12-24

申请号：US14746994

申请日：2015-06-23

Applicant: Ferric Inc.

Inventor： Noah Sturcken ,  Ryan Davies ,  Hao Wu

IPC: H01F27/28 ,  H01F27/29 ,  H01F1/14 ,  H01F1/147 ,  H01F27/24 ,  H01F27/32

CPC classification number: H01F27/24 ,  H01F1/14708 ,  H01F13/003 ,  H01F17/0013 ,  H01F17/04 ,  H01F17/062 ,  H01F27/255 ,  H01F27/2823 ,  H01F27/2895 ,  H01F27/38 ,  H01F41/06 ,  H01F41/14 ,  H01F2017/0066 ,  H01L28/10

Abstract: Inductive elements comprising anisotropic media and biasing coils for magnetically biasing thereof and methods of manufacture and operation for use in applications such as microelectronics. Application of an electrical current through the bias coils generates a magnetic field that biases the magnetic material such that a desirable orientation of anisotropy is achieved throughout the magnetic core and enables modulation of the inductive response of the device. Electrical conductors coupled to interconnects are magnetically coupled to magnetic core layers to produce self and/or mutual inductors.

Abstract translation: 包括用于磁偏置的各向异性介质和偏置线圈的感应元件以及用于微电子学等应用的制造和操作方法。 施加通过偏置线圈的电流产生偏置磁性材料的磁场，使得在整个磁芯上实现各向异性的理想取向，并且能够调制器件的感应响应。 耦合到互连件的电导体磁耦合到磁芯层以产生自身和/或互感器。

公开(公告)号：US11735349B2

公开(公告)日：2023-08-22

申请号：US16557476

申请日：2019-08-30

Applicant: Ferric Inc.

Inventor： Noah Sturcken ,  Denis Shishkov ,  Matthew Cavallaro ,  Michael Lekas ,  Ryan Davies

IPC: H01F41/02 ,  H01F27/24 ,  H01F27/25 ,  H01F41/18

CPC classification number: H01F27/24 ,  H01F27/25 ,  H01F41/0213 ,  H01F41/18

Abstract: A method for manufacturing a vertically-laminated ferromagnetic core includes (a) depositing a conductive seed layer on or over a first side of a substrate; (b) depositing a masking layer on or over a second side of the substrate, the first and second sides on opposite sides of the substrate; (c) forming a pattern in the masking layer; (d) dry etching the substrate, based on the pattern in the masking layer, from the second side to the first side to expose portions of the conductive seed layer; and (e) depositing a ferromagnetic material onto the exposed portions of the conductive seed layer to form vertically-oriented ferromagnetic layers.

公开(公告)号：US11197374B2

公开(公告)日：2021-12-07

申请号：US16279574

申请日：2019-02-19

Applicant: Ferric Inc.

Inventor： Noah Sturcken ,  Joseph Meyer ,  Michael Lekas ,  Ryan Davies ,  David Jew ,  William Lee

IPC: H02M3/158 ,  H05K1/18 ,  H05K1/11 ,  H05K1/02 ,  H01F27/24 ,  H01F27/28 ,  H01F41/02 ,  H01F41/04 ,  H05K1/16 ,  H02M3/00 ,  H01F17/00 ,  H05K1/03 ,  H02M1/00

Abstract: A switched inductor DC-DC power converter chiplet includes a CMOS power switch, an LC filter, regulation circuitry, feedback control circuitry, and interface control circuitry integrated on a common substrate. The inductor for the LC filter can be formed on the same surface or on opposing surfaces of the substrate as the electrical terminations for the substrate. Another embodiment includes a switched inductor DC-DC power converter chiplet having a first powertrain phase and multiple second powertrain phases. When the load current is less than or equal to a threshold load current, the power conversion efficiency can be improved by only operating the first powertrain phase. When the load current is greater than the threshold load current, the power conversion efficiency can be improved by operating one or more second powertrain phases.