公开(公告)号：US10793745B2

公开(公告)日：2020-10-06

申请号：US16377003

申请日：2019-04-05

Applicant: Formlabs, Inc.

Inventor： Eric Arndt ,  Gayla Lyon ,  Zachary Zguris

IPC: C09D175/02 ,  C09D175/04 ,  B33Y70/00 ,  B33Y10/00 ,  B29C64/106 ,  B29C64/277 ,  C08G18/08 ,  C08G18/76 ,  C08G18/32 ,  C08G18/38 ,  C08G18/20 ,  C08G18/10 ,  C08G18/48 ,  C08G18/24

Abstract: The present disclosure relates generally to curable resins, in particular dual-cure resins, and related methods for use in an additive fabrication (e.g., 3-dimensional printing) device.

公开(公告)号：US20190233673A1

公开(公告)日：2019-08-01

申请号：US16377003

申请日：2019-04-05

Applicant: Formlabs, Inc.

Inventor： Eric Arndt ,  Gayla Lyon ,  Zachary Zguris

IPC: C09D175/02 ,  C08G18/08 ,  B33Y70/00 ,  C09D175/04 ,  B33Y10/00

CPC classification number: C09D175/02 ,  B33Y10/00 ,  B33Y70/00 ,  C08G18/089 ,  C08G18/10 ,  C08G18/2081 ,  C08G18/246 ,  C08G18/3206 ,  C08G18/3281 ,  C08G18/3838 ,  C08G18/4854 ,  C08G18/7671 ,  C09D175/04

Abstract: The present disclosure relates generally to curable resins, in particular dual-cure resins, and related methods for use in an additive fabrication (e.g., 3-dimensional printing) device.

公开(公告)号：US10316213B1

公开(公告)日：2019-06-11

申请号：US15583083

申请日：2017-05-01

Applicant: Formlabs, Inc.

Inventor： Eric Arndt ,  Gayla Lyon ,  Zachary Zguris

IPC: C09D175/02 ,  C09D175/04 ,  B33Y70/00 ,  B33Y10/00 ,  B29C64/106 ,  B29C64/277 ,  C08G18/08

Abstract: The present disclosure relates generally to curable resins, in particular dual-cure resins, and related methods for use in an additive fabrication (e.g., 3-dimensional printing) device.

公开(公告)号：US20220195236A1

公开(公告)日：2022-06-23

申请号：US17558850

申请日：2021-12-22

Applicant: Formlabs, Inc.

Inventor： Eric Arndt ,  Luke Kwisnek ,  Michael Morin

IPC: C09D163/10 ,  C08G59/24 ,  C08G59/17 ,  C08G59/40 ,  C08G59/68 ,  B33Y70/00 ,  B33Y40/20 ,  B29C64/30

Abstract: A multi-component composition for additive manufacturing, and related methods, are generally described.

公开(公告)号：US12084588B2

公开(公告)日：2024-09-10

申请号：US17558850

申请日：2021-12-22

Applicant: Formlabs, Inc.

Inventor： Eric Arndt ,  Luke Kwisnek ,  Michael Morin

IPC: C08F2/46 ,  B29C64/30 ,  B33Y40/20 ,  B33Y70/00 ,  C08F2/50 ,  C08G59/17 ,  C08G59/24 ,  C08G59/40 ,  C08G59/68 ,  C08G61/04 ,  C09D163/10 ,  B29K63/00

CPC classification number: C09D163/10 ,  B29C64/30 ,  B33Y40/20 ,  B33Y70/00 ,  C08G59/1466 ,  C08G59/245 ,  C08G59/4028 ,  C08G59/685 ,  B29K2063/00

Abstract: A multi-component composition for additive manufacturing, and related methods, are generally described.