公开(公告)号：US10793745B2

公开(公告)日：2020-10-06

申请号：US16377003

申请日：2019-04-05

Applicant: Formlabs, Inc.

Inventor： Eric Arndt ,  Gayla Lyon ,  Zachary Zguris

IPC: C09D175/02 ,  C09D175/04 ,  B33Y70/00 ,  B33Y10/00 ,  B29C64/106 ,  B29C64/277 ,  C08G18/08 ,  C08G18/76 ,  C08G18/32 ,  C08G18/38 ,  C08G18/20 ,  C08G18/10 ,  C08G18/48 ,  C08G18/24

Abstract: The present disclosure relates generally to curable resins, in particular dual-cure resins, and related methods for use in an additive fabrication (e.g., 3-dimensional printing) device.

公开(公告)号：US20190233673A1

公开(公告)日：2019-08-01

申请号：US16377003

申请日：2019-04-05

Applicant: Formlabs, Inc.

Inventor： Eric Arndt ,  Gayla Lyon ,  Zachary Zguris

IPC: C09D175/02 ,  C08G18/08 ,  B33Y70/00 ,  C09D175/04 ,  B33Y10/00

CPC classification number: C09D175/02 ,  B33Y10/00 ,  B33Y70/00 ,  C08G18/089 ,  C08G18/10 ,  C08G18/2081 ,  C08G18/246 ,  C08G18/3206 ,  C08G18/3281 ,  C08G18/3838 ,  C08G18/4854 ,  C08G18/7671 ,  C09D175/04

Abstract: The present disclosure relates generally to curable resins, in particular dual-cure resins, and related methods for use in an additive fabrication (e.g., 3-dimensional printing) device.

公开(公告)号：US10316213B1

公开(公告)日：2019-06-11

申请号：US15583083

申请日：2017-05-01

Applicant: Formlabs, Inc.

Inventor： Eric Arndt ,  Gayla Lyon ,  Zachary Zguris

IPC: C09D175/02 ,  C09D175/04 ,  B33Y70/00 ,  B33Y10/00 ,  B29C64/106 ,  B29C64/277 ,  C08G18/08

Abstract: The present disclosure relates generally to curable resins, in particular dual-cure resins, and related methods for use in an additive fabrication (e.g., 3-dimensional printing) device.