公开(公告)号：US20170127508A1

公开(公告)日：2017-05-04

申请号：US15407273

申请日：2017-01-17

Applicant: GE Embedded Electronics Oy

Inventor： Antti Iihola ,  Tuomas Waris

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/18

CPC classification number: H05K1/028 ,  H01L21/568 ,  H01L24/18 ,  H01L24/19 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/18 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/83005 ,  H01L2224/83192 ,  H01L2224/92144 ,  H01L2924/01002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01061 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2924/181 ,  H05K1/115 ,  H05K1/182 ,  H05K1/188 ,  H05K1/189 ,  H05K3/4691 ,  H05K2201/0187 ,  H05K2201/0355 ,  H05K2201/09127 ,  H05K2203/308 ,  H01L2924/0665 ,  H01L2924/00

Abstract: Rigid-flex-type circuit-board structure and manufacturing method, in which a flexible membrane and a sacrificial-material piece are attached to an insulator membrane in the location of the flexible zone. An insulator layer, which encloses within itself a sacrificial-material piece is manufactured on the surface of the conductor membrane. The flexible zone is formed in such a way that an opening is made in the insulator layer, through which the sacrificial-material piece is removed. The flexible zone comprises at least part of the flexible membrane as well as conductors, which are manufactured by patterning the insulator membrane at a suitable stage in the method.

公开(公告)号：US09674948B2

公开(公告)日：2017-06-06

申请号：US15211051

申请日：2016-07-15

Applicant: GE Embedded Electronics Oy

Inventor： Antti Iihola ,  Tuomas Waris

IPC: H05K1/18 ,  H05K1/02 ,  H01L23/00 ,  H05K3/46 ,  H05K1/11

CPC classification number: H05K1/028 ,  H01L21/568 ,  H01L24/18 ,  H01L24/19 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/18 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/83005 ,  H01L2224/83192 ,  H01L2224/92144 ,  H01L2924/01002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01061 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2924/181 ,  H05K1/115 ,  H05K1/182 ,  H05K1/188 ,  H05K1/189 ,  H05K3/4691 ,  H05K2201/0187 ,  H05K2201/0355 ,  H05K2201/09127 ,  H05K2203/308 ,  H01L2924/0665 ,  H01L2924/00

Abstract: Rigid-flex-type circuit-board structure and manufacturing method, in which a flexible membrane and a sacrificial-material piece are attached to an insulator membrane in the location of the flexible zone. An insulator layer, which encloses within itself a sacrificial-material piece is manufactured on the surface of the conductor membrane. The flexible zone is formed in such a way that an opening is made in the insulator layer, through which the sacrificial-material piece is removed. The flexible zone comprises at least part of the flexible membrane as well as conductors, which are manufactured by patterning the insulator membrane at a suitable stage in the method.

公开(公告)号：US10231335B2

公开(公告)日：2019-03-12

申请号：US14285710

申请日：2014-05-23

Applicant: GE Embedded Electronics Oy

Inventor： Petteri Palm ,  Tuomas Waris ,  Antti Iihola

IPC: H05K1/11 ,  H05K1/18 ,  H01L23/498 ,  H01L23/538 ,  H01L23/00 ,  H05K1/14 ,  H05K3/20

Abstract: The present invention generally provides a novel method for manufacturing an electronic module with crossed conducting lines and a novel electronic module with crossed conducting lines. In particular, an aspect of the present invention is to provide a thin, single layer electronic module. It is also an object of the present invention to provide an electronic module with an embedded jumper element having reliable high quality connections and contacts. To achieve at least some of the aspects of the present invention, an embedded pre-fabricated jumper module is placed inside a printed circuit board which allows the crossing of conducting lines within the module without manufacturing additional layers over the whole PCB board. The resultant PCB will have improved contacts and will not have surface deformation.

公开(公告)号：US09820375B2

公开(公告)日：2017-11-14

申请号：US15407273

申请日：2017-01-17

Applicant: GE Embedded Electronics Oy

Inventor： Antti Iihola ,  Tuomas Waris

IPC: H05K1/00 ,  H05K1/02 ,  H05K1/18 ,  H05K1/11

CPC classification number: H05K1/028 ,  H01L21/568 ,  H01L24/18 ,  H01L24/19 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/18 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/83005 ,  H01L2224/83192 ,  H01L2224/92144 ,  H01L2924/01002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01061 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2924/181 ,  H05K1/115 ,  H05K1/182 ,  H05K1/188 ,  H05K1/189 ,  H05K3/4691 ,  H05K2201/0187 ,  H05K2201/0355 ,  H05K2201/09127 ,  H05K2203/308 ,  H01L2924/0665 ,  H01L2924/00

Abstract: Rigid-flex-type circuit-board structure and manufacturing method, in which a flexible membrane and a sacrificial-material piece are attached to an insulator membrane in the location of the flexible zone. An insulator layer, which encloses within itself a sacrificial-material piece is manufactured on the surface of the conductor membrane. The flexible zone is formed in such a way that an opening is made in the insulator layer, through which the sacrificial-material piece is removed. The flexible zone comprises at least part of the flexible membrane as well as conductors, which are manufactured by patterning the insulator membrane at a suitable stage in the method.