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    Method for manufacturing light emitting unit
    1.
    发明授权
    Method for manufacturing light emitting unit 有权

    公开(公告)号：US10573779B2

    公开(公告)日：2020-02-25

    申请号：US16231914

    申请日：2018-12-24

    Applicant: Genesis Photonics Inc.

    Inventor： Shao-Ying Ting ,  Kuan-Chieh Huang ,  Jing-En Huang ,  Yi-Ru Huang ,  Sie-Jhan Wu ,  Long-Lin Ke

    IPC: H01L33/00 ,  H01L33/62 ,  H01L33/08 ,  H01L33/50 ,  H01L33/52 ,  H01L25/075 ,  H05B33/08 ,  H01L33/48 ,  H01L33/64 ,  H01L27/15

    Abstract: A method for manufacturing a light emitting unit is provided. A semiconductor structure including a plurality of light emitting dice separated from each other is provided. A molding compound is formed to encapsulate the light emitting dice. Each of the light emitting dice includes a light emitting element, a first electrode and a second electrode. A patterned metal layer is formed on the first electrodes and the second electrodes of the light emitting dice. A substrate is provided, where the molding compound is located between the substrate and the light emitting elements of the light emitting dice. A cutting process is performed to cut the semiconductor structure, the patterned metal layer, the molding compound and the substrate so as to define a light emitting unit with a series connection loop, a parallel connection loop or a series-parallel connection loop.

    THIN-FILM FLIP-CHIP LIGHT EMITTING DIODE HAVING ROUGHENING SURFACE AND METHOD FOR MANUFACTURING THE SAME
    2.
    发明申请
    THIN-FILM FLIP-CHIP LIGHT EMITTING DIODE HAVING ROUGHENING SURFACE AND METHOD FOR MANUFACTURING THE SAME 有权
    具有粗糙表面的薄膜片状发光二极管及其制造方法

    公开(公告)号：US20160104815A1

    公开(公告)日：2016-04-14

    申请号：US14877948

    申请日：2015-10-08

    Applicant: Genesis Photonics Inc.

    Inventor： Yi-Fan Li ,  Jing-En Huang ,  Sie-Jhan Wu

    IPC: H01L33/22 ,  H01L33/48 ,  H01L33/38 ,  H01L33/06 ,  H01L33/00

    CPC classification number: H01L33/22 ,  H01L33/005 ,  H01L33/0095 ,  H01L33/06 ,  H01L33/486 ,  H01L2933/0016 ,  H01L2933/0033 ,  H01L2933/0091

    Abstract: A thin-film flip-chip light emitting diode (LED) having a roughened surface and a method for manufacturing the same are provided. First, a substrate having a patterned structure on a surface of the substrate is provided, and the surface is roughened. A first semiconductor layer is then formed on the surface; a light emitting structure layer is then formed on the first semiconductor layer; a second semiconductor layer is then formed on the light emitting structure layer. The first and second semiconductor layers possess opposite electrical characteristics. A first contact electrode and a second contact electrode are then formed on the first semiconductor layer and the second semiconductor layer, respectively. Finally, a sub-mount is formed on the first and second contact electrodes, and the substrate is removed to form the thin-film flip-chip LED having the roughened surface. Here, the light emitting efficiency of the thin-film flip-chip LED is improved.

    Abstract translation: 提供了具有粗糙表面的薄膜倒装芯片发光二极管（LED）及其制造方法。 首先，提供在基板的表面上具有图案化结构的基板，并使表面粗糙化。 然后在表面上形成第一半导体层; 然后在第一半导体层上形成发光结构层; 然后在发光结构层上形成第二半导体层。 第一和第二半导体层具有相反的电特性。 然后分别在第一半导体层和第二半导体层上形成第一接触电极和第二接触电极。 最后，在第一接触电极和第二接触电极上形成子座，并且移除衬底以形成具有粗糙表面的薄膜倒装芯片LED。 这里，提高了薄膜倒装芯片LED的发光效率。

    Thin-film flip-chip light emitting diode having roughening surface and method for manufacturing the same
    7.
    发明授权
    Thin-film flip-chip light emitting diode having roughening surface and method for manufacturing the same 有权
    具有粗糙面的薄膜倒装芯片发光二极管及其制造方法

    公开(公告)号：US09564554B2

    公开(公告)日：2017-02-07

    申请号：US14877948

    申请日：2015-10-08

    Applicant: Genesis Photonics Inc.

    Inventor： Yi-Fan Li ,  Jing-En Huang ,  Sie-Jhan Wu

    IPC: H01L33/00 ,  H01L33/22 ,  H01L33/48 ,  H01L33/06

    CPC classification number: H01L33/22 ,  H01L33/005 ,  H01L33/0095 ,  H01L33/06 ,  H01L33/486 ,  H01L2933/0016 ,  H01L2933/0033 ,  H01L2933/0091

    Abstract: A thin-film flip-chip light emitting diode (LED) having a roughened surface and a method for manufacturing the same are provided. First, a substrate having a patterned structure on a surface of the substrate is provided, and the surface is roughened. A first semiconductor layer is then formed on the surface; a light emitting structure layer is then formed on the first semiconductor layer; a second semiconductor layer is then formed on the light emitting structure layer. The first and second semiconductor layers possess opposite electrical characteristics. A first contact electrode and a second contact electrode are then formed on the first semiconductor layer and the second semiconductor layer, respectively. Finally, a sub-mount is formed on the first and second contact electrodes, and the substrate is removed to form the thin-film flip-chip LED having the roughened surface. Here, the light emitting efficiency of the thin-film flip-chip LED is improved.

    Abstract translation: 提供了具有粗糙表面的薄膜倒装芯片发光二极管（LED）及其制造方法。 首先，提供在基板的表面上具有图案化结构的基板，并使表面粗糙化。 然后在表面上形成第一半导体层; 然后在第一半导体层上形成发光结构层; 然后在发光结构层上形成第二半导体层。 第一和第二半导体层具有相反的电特性。 然后分别在第一半导体层和第二半导体层上形成第一接触电极和第二接触电极。 最后，在第一接触电极和第二接触电极上形成子座，并且移除衬底以形成具有粗糙表面的薄膜倒装芯片LED。 这里，提高了薄膜倒装芯片LED的发光效率。

    LIGHT EMITTING UNIT AND LIGHT EMITTING MODULE
    8.
    发明申请
    LIGHT EMITTING UNIT AND LIGHT EMITTING MODULE 审中-公开
    发光单元和发光模块

    公开(公告)号：US20160013384A1

    公开(公告)日：2016-01-14

    申请号：US14474277

    申请日：2014-09-01

    Applicant: Genesis Photonics Inc.

    Inventor： Shao-Ying Ting ,  Kuan-Chieh Huang ,  Jing-En Huang ,  Yi-Ru Huang ,  Sie-Jhan Wu ,  Long-Lin Ke

    IPC: H01L33/62 ,  H01L33/54 ,  H01L33/50 ,  H01L25/075

    CPC classification number: H01L25/0753 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/24137

    Abstract: A light emitting unit includes multiple light emitting dice, a molding compound, a substrate and a patterned metal layer. Each of the light emitting dice includes a light emitting component, a first electrode and a second electrode. The molding compound encapsulates the light emitting dice and exposes a first surface of the first electrode and a second surface of the second electrode of each of the light emitting dice. The molding compound is located between the substrate and the light emitting dice. The patterned metal layer is disposed on the first surface of the first electrode and the second surface of the second electrode of each of the light emitting dice. The light emitting dice are electrically connected to each other in a series connection, a parallel connection or a series-parallel connection by the patterned metal layer.

    Abstract translation: 发光单元包括多个发光骰子，模制化合物，基底和图案化的金属层。 每个发光管芯包括发光部件，第一电极和第二电极。 模制化合物封装发光管芯并暴露第一电极的第一表面和每个发光管芯的第二电极的第二表面。 模塑料位于基板和发光管之间。 图案化的金属层设置在第一电极的第一表面和每个发光管的第二电极的第二表面上。 发光管芯通过图案化的金属层串联连接，并联连接或串联并联连接。

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