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公开(公告)号：US11553591B2
公开(公告)日：2023-01-10
申请号：US17230452
申请日：2021-04-14
Applicant: GIO Optoelectronics Corp
Inventor： Chin-Tang Li
Abstract: An electronic device includes a circuit board, a driving member, and a working member. The circuit board has a board body, conductive lines, and conductive pads. The board body has a working surface. The driving member includes a substrate, a thin film circuit, a thin film element, and connection pads. The thin film circuit corresponds to thin film element and is electrically connected to the connection pads, and the connection pads are connected to partial conductive pads. The substrate has a first top surface. The working member has at least one electrode electrically connected to one of the conductive pads. The working member has a second top surface. A first height is defined between the first top surface and the working surface, and a second height is defined between the second top surface and the working surface. The second height is greater than or equal to the first height.
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公开(公告)号：US10971529B2
公开(公告)日：2021-04-06
申请号：US16449929
申请日：2019-06-24
Applicant: GIO Optoelectronics Corp.
Inventor： Chin-Tang Li
IPC: H01L25/16 , H01L27/12 , H01L27/32 , H05K1/14 , H05K1/11 , H05K3/12 , H05K3/28 , H01L21/77 , H01L41/047
Abstract: An electronic device and manufacturing method of the electronic device are disclosed. The manufacturing method includes: providing a substrate; forming a thin film circuit on the substrate, wherein the thin film circuit comprises at least one thin film transistor and at least one conductive trace; forming at least one first connection pad on the substrate, wherein the first connection pad is electrically connected with the thin film transistor through the conductive trace; disposing the substrate on a driving circuit board, wherein the driving circuit board comprises at least one second connection pad adjacent to and corresponding to the first connection pad; and forming a conductive member covering at least a part of the second connection pad and the first connection pad, wherein the second connection pad is electrically connected with the first connection pad through the conductive member.
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公开(公告)号：US10937992B2
公开(公告)日：2021-03-02
申请号：US16169528
申请日：2018-10-24
Applicant: GIO Optoelectronics Corp.
Inventor： Chin-Tang Li
Abstract: A light emitting device, a manufacturing method thereof and a display device are disclosed. The light emitting device includes a light-emitting unit, a structured light guide layer, a light guide unit and a patterned reflective layer. The light-emitting unit has a circuit substrate and multiple light emitting elements, and the light emitting elements are separately disposed on a surface of the circuit substrate. The structured light guide layer is disposed opposite the light-emitting unit, and has multiple accommodating slots and multiple light guide structures disposed between the two accommodating slots. Each accommodating slot is disposed in correspondence with each light emitting element, and the light guide structures are disposed on the bottom surface of the structured light guide layer. The light guide unit is disposed on the top surface of the structured light guide layer. The patterned reflective layer has multiple reflective patterns disposed on the light emitting surface of the light guide unit, and each reflective pattern is disposed in correspondence with each light emitting element.
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公开(公告)号：US20220231198A1
公开(公告)日：2022-07-21
申请号：US17555727
申请日：2021-12-20
Applicant: GIO Optoelectronics Corp
Inventor： Chin-Tang Li
IPC: H01L33/48 , H01L25/075 , H01L33/62
Abstract: An electronic device and a substrate structure thereof. The substrate structure includes a carrier board and a laminated structure. The carrier board has a board body, through holes and conductive portions. The board body has a first surface and a second surface. The through holes communicate the first and second surfaces. Each through hole has a first opening and a second opening. The conductive portions are arranged on the first surface, and the first opening is sealed by a corresponding conductive portion. The laminated structure includes a viscid layer and conductive elements. One surface of the viscid layer is in surface contact with the second surface. Each conductive element passes through and accommodates in the viscid layer, and corresponds to one through hole in a projection direction of the carrier board. One end of each conductive element is electrically connected to one conductive portion through the corresponding through hole.
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公开(公告)号：US20210408348A1
公开(公告)日：2021-12-30
申请号：US17349150
申请日：2021-06-16
Applicant: GIO Optoelectronics Corp.
Inventor： Chin-Tang Li
Abstract: A light-emitting device comprises a transparent substrate, a reflection structure and a light-emitting unit. The transparent substrate is defined with a first surface and a second surface opposite to each other. The reflection structure is disposed on and contacts the second surface of the transparent substrate. The reflection structure includes a reflection layer and a circuit layer. The reflection structure is configured to define a light-transmitting window. The light-emitting unit is disposed corresponding to the light-transmitting window. The light-emitting unit is electrically connected to the circuit layer of the reflection structure, and one optical path of the light-emitting unit passes through the light-transmitting window.
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Patent Agency Ranking
公开(公告)号：US20210329782A1
公开(公告)日：2021-10-21
申请号：US17230452
申请日：2021-04-14
Applicant: GIO Optoelectronics Corp
Inventor： Chin-Tang Li
Abstract: An electronic device includes a circuit board, a driving member, and a working member. The circuit board has a board body, conductive lines, and conductive pads. The board body has a working surface. The driving member includes a substrate, a thin film circuit, a thin film element, and connection pads. The thin film circuit corresponds to thin film element and is electrically connected to the connection pads, and the connection pads are connected to partial conductive pads. The substrate has a first top surface. The working member has at least one electrode electrically connected to one of the conductive pads. The working member has a second top surface. A first height is defined between the first top surface and the working surface, and a second height is defined between the second top surface and the working surface. The second height is greater than or equal to the first height.
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公开(公告)号：US10653012B2
公开(公告)日：2020-05-12
申请号：US16135492
申请日：2018-09-19
Applicant: GIO Optoelectronics Corp
Inventor： Chin-Tang Li
Abstract: An electronic device and manufacturing method thereof are disclosed. The manufacturing method of the electronic device comprises following steps: forming at least a thin-film conductive line on the substrate by a thin-film process; forming at least an electrical connection pad on the substrate by a printing process, wherein the electrical connection pad is electrically connected with the thin-film conductive line; and disposing at least an electronic element on the substrate, wherein the electronic element is electrically connected with the thin-film conductive line through the electrical connection pad. The electronic device has a lower manufacturing cost and a higher component configuration density, and the production yield and reliability of the electronic device are improved by the configuration of the electrical connection pad.
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公开(公告)号：US11075330B2
公开(公告)日：2021-07-27
申请号：US16806296
申请日：2020-03-02
Applicant: GIO Optoelectronics Corp.
Inventor： Chin-Tang Li
Abstract: A package structure and an electronic device including the package structure are disclosed. The package structure includes a substrate, a wire layer disposed on the substrate, a visual unit disposed on the substrate, and an encapsulation element disposed on the substrate. The wire layer includes a plurality of patterned circuits. The visual unit includes a first area and a second area defined along a periphery of the first area. The first area is configured with a photoelectric element, and the photoelectric element is electrically connected to and disposed corresponding to at least one of the patterned circuits. The encapsulation element completely covers the first area of the visual unit and overlaps the corresponding patterned circuit, such that an average reflectance inside the encapsulation element is greater than an average reflectance outside the encapsulation element.
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公开(公告)号：US10573597B1
公开(公告)日：2020-02-25
申请号：US16545393
申请日：2019-08-20
Applicant: GIO Optoelectronics Corp
Inventor： Chin-Tang Li
IPC: H01L23/538 , H01L27/12 , H01L25/00 , H01L23/498 , H01L25/18
Abstract: An electronic device and manufacturing method thereof are disclosed. The manufacturing method includes steps of: providing a component board, wherein the component board comprises a substrate and a first conductive wire; providing a connecting board, wherein the connecting board comprises a second conductive wire; disposing an attaching member on the connecting board or a lateral face of the substrate; aligning the second conductive wire of the connecting board toward the lateral face, and attaching the connecting board to the lateral face by the attaching member, wherein the lateral face, the attaching member and the connecting board form a recess; and disposing a conductive member in the recess, wherein the conductive member contacts the first conductive wire and the second conductive wire, and the first conductive wire is electrically connected with the second conductive wire through the conductive member.
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公开(公告)号：US20220149081A1
公开(公告)日：2022-05-12
申请号：US17522156
申请日：2021-11-09
Applicant: GIO Optoelectronics Corp.
Inventor： Chin-Tang Li
IPC: H01L27/12 , G09G3/20 , H01L23/528 , H05K1/11
Abstract: An electronic device includes a sustaining layer, multiple substrates, multiple photoelectric units, multiple signal layers, multiple driving structures, and a constraining structure. The substrates are arranged on a contact surface of the sustaining layer. A first end edge of at least one substrate approaches a first end edge of the sustaining layer, and a first side edge of one substrate is adjacent to a second side edge of another substrate. The photoelectric units are arranged on the first or/and second surfaces of the substrates. The signal layers are arranged on the substrates and electrically connected to the photoelectric units. The driving structures are electrically connected to the substrates and disposed close to the first or second end edge of the sustaining layer. The constraining structure constrains the first or second end edge of the sustaining layer, and at least one driving structure is accommodated in the constraining structure.
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