公开(公告)号：US09586291B2

公开(公告)日：2017-03-07

申请号：US14226953

申请日：2014-03-27

Applicant: GLOBALFOUNDRIES INC.

Inventor： Bing Dang ,  John U. Knickerbocker ,  Eric Peter Lewandowski ,  Cornelia Kang-I Tsang

IPC: H01L21/302 ,  B23K26/36 ,  G01R31/26 ,  H01L21/683

CPC classification number: B23K26/36 ,  G01R31/2607 ,  H01L21/302 ,  H01L21/6835 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  Y10T156/1158 ,  Y10T156/1917 ,  Y10T428/265 ,  Y10T428/30 ,  Y10T428/31678

Abstract: Methods are provided to form adhesive materials that are used to temporarily bond handler wafers to device wafers, and which enable mid-wavelength infrared laser ablation release techniques to release handler wafers from device wafers.

Abstract translation: 提供了用于形成用于将处理器晶片暂时地接合到器件晶片的粘合剂材料的方法，并且使得能够使中波长红外激光烧蚀释放技术从器件晶片释放处理器晶片。

公开(公告)号：US09269561B2

公开(公告)日：2016-02-23

申请号：US13746359

申请日：2013-01-22

Applicant: GLOBALFOUNDRIES INC.

Inventor： Bing Dang ,  John U. Knickerbocker ,  Cornelia Kang-I Tsang

IPC: H01L21/20 ,  H01L21/683 ,  H01L21/02 ,  H01L21/67 ,  B82Y30/00

CPC classification number: H01L21/02002 ,  B82Y30/00 ,  H01L21/67092 ,  H01L21/6835 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  Y10S977/902 ,  Y10T156/1158 ,  Y10T156/1917 ,  Y10T428/24355 ,  Y10T428/265 ,  Y10T428/31678

Abstract: Methods are provided for handling a device wafer. For example, a method includes providing a stack structure having a device wafer, a handler wafer, and a bonding structure disposed between the device wafer and handler wafer, and irradiating the bonding structure with long-wavelength infrared energy to ablate the bonding structure.

Abstract translation: 提供了处理器件晶片的方法。 例如，一种方法包括提供具有器件晶片，处理器晶片和布置在器件晶片和处理器晶片之间的接合结构的堆叠结构，并且用长波长红外能量照射接合结构以消融接合结构。

公开(公告)号：US10147694B2

公开(公告)日：2018-12-04

申请号：US14986925

申请日：2016-01-04

Applicant: GLOBALFOUNDRIES INC.

Inventor： Bing Dang ,  Michael A. Gaynes ,  Paul A. Lauro ,  Jae-Woong Nah

IPC: H01L21/02 ,  H01L23/00 ,  C25D5/02 ,  C25D7/12 ,  H05K3/34

Abstract: Solder bumps are provided on round wafers through the use of injection molded solder. Copper pillars or ball limiting metallurgy are formed over I/O pads within the channels of a patterned mask layer. Solder is injected over the pillars or BLM, filling the channels. Molten solder can be injected in cavities formed in round wafers without leakage using a carrier assembly that accommodates wafers that have been previously subjected to mask layer deposition and patterning. One such carrier assembly includes an elastomeric body portion having a round recess, the walls of the recess forming a tight seal with the round wafer. Other carrier assemblies employ adhesives applied around the peripheral edges of the wafers to ensure sealing between the carrier assemblies and wafers.

公开(公告)号：US20160118358A1

公开(公告)日：2016-04-28

申请号：US14986925

申请日：2016-01-04

Applicant: GLOBALFOUNDRIES INC.

Inventor： Bing Dang ,  Michael A. Gaynes ,  Paul A. Lauro ,  Jae-Woong Nah

IPC: H01L23/00

CPC classification number: H01L24/11 ,  C25D5/022 ,  C25D7/123 ,  H01L21/02107 ,  H01L24/13 ,  H01L24/16 ,  H01L24/742 ,  H01L24/81 ,  H01L2224/11001 ,  H01L2224/11002 ,  H01L2224/11312 ,  H01L2224/1141 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/1162 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16225 ,  H01L2224/81801 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12042 ,  H05K3/3436 ,  H05K2201/10734 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01026 ,  H01L2924/00

Abstract: Solder bumps are provided on round wafers through the use of injection molded solder. Copper pillars or ball limiting metallurgy are formed over I/O pads within the channels of a patterned mask layer. Solder is injected over the pillars or BLM, filling the channels. Molten solder can be injected in cavities formed in round wafers without leakage using a carrier assembly that accommodates wafers that have been previously subjected to mask layer deposition and patterning. One such carrier assembly includes an elastomeric body portion having a round recess, the walls of the recess forming a tight seal with the round wafer. Other carrier assemblies employ adhesives applied around the peripheral edges of the wafers to ensure sealing between the carrier assemblies and wafers.

Abstract translation: 通过使用注射成型焊料在圆形晶片上提供焊料凸块。 在图案化掩模层的通道内的I / O焊盘上形成铜柱或极限极限冶金。 焊料注入柱子或BLM，填充通道。 可以使用容纳预先经过掩模层沉积和图案化的晶片的载体组件将熔融的焊料注入到圆形晶片形成的空腔中而不发生泄漏。 一个这样的载体组件包括具有圆形凹部的弹性体主体部分，凹部的壁与圆形晶片形成紧密密封。 其他载体组件使用施加在晶片的周边边缘周围的粘合剂，以确保载体组件和晶片之间的密封。