公开(公告)号：US10090255B2

公开(公告)日：2018-10-02

申请号：US15010868

申请日：2016-01-29

Applicant: GLOBALFOUNDRIES INC.

Inventor： Brittany L. Hedrick ,  Vijay Sukumaran ,  Christopher L. Tessler ,  Richard F. Indyk ,  Sarah H. Knickerbocker

IPC: H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H01L23/00 ,  H01L21/78 ,  H01L23/498 ,  H01L21/48 ,  H05K1/03 ,  H01L23/15

Abstract: The present disclosure relates to semiconductor structures and, more particularly, to dicing channels used in the singulatation process of interposers and methods of manufacture. The structure includes: one or more redistribution layers; a glass interposer connected to the one or more redistribution layers; a channel formed through the one or more redistribution layers and the glass interposer core, forming a dicing channel; and polymer material conformally filling the channel.

公开(公告)号：US20170221837A1

公开(公告)日：2017-08-03

申请号：US15010868

申请日：2016-01-29

Applicant: GLOBALFOUNDRIES INC.

Inventor： Brittany L. Hedrick ,  Vijay Sukumaran ,  Christopher L. Tessler ,  Richard F. Indyk ,  Sarah H. Knickerbocker

IPC: H01L23/00 ,  H01L23/29 ,  H01L23/498 ,  H05K3/00 ,  H01L21/56 ,  H05K1/03 ,  H05K1/11 ,  H05K1/02 ,  H01L21/78 ,  H01L21/48

CPC classification number: H01L23/562 ,  H01L21/486 ,  H01L21/78 ,  H01L23/15 ,  H01L23/49811 ,  H01L23/49827 ,  H01L2224/11 ,  H01L2224/73204 ,  H05K1/0306 ,  H05K3/0026 ,  H05K3/0052 ,  H05K3/0094 ,  H05K2201/0959 ,  H05K2201/10378

Abstract: The present disclosure relates to semiconductor structures and, more particularly, to dicing channels used in the singulatation process of interposers and methods of manufacture. The structure includes: one or more redistribution layers; a glass interposer connected to the one or more redistribution layers; a channel formed through the one or more redistribution layers and the glass interposer core, forming a dicing channel; and polymer material conformally filling the channel.