Plane coding target and image splicing system and method applying the same

    公开(公告)号:US11689737B1

    公开(公告)日:2023-06-27

    申请号:US18065530

    申请日:2022-12-13

    CPC classification number: H04N19/513 H04N19/172

    Abstract: Disclosed are a plane coding target and an image splicing system and method applying the same. The plane coding target comprises a plurality of coding units distributed in an array, the coding unit comprises one central coding point, a plurality of normal coding points and at least one positioning point, and a positioning point distribution style of the positioning point is used for determining coordinates of the central coding point and the normal coding points in a coding unit coordinate system; and coding numerical value sequences of the coding units are different from each other and unique. The plane coding target can realize large-area coding and positioning functions, and the image splicing system applying the plane coding target can solve the problems of splicing error and error accumulation caused by an identification error of a splicing location, thus realizing large-range, high-precision and short-time two-dimensional image splicing.

    Tracking measurement method, apparatus and device for pose of tail end of manipulator

    公开(公告)号:US11919177B1

    公开(公告)日:2024-03-05

    申请号:US18482887

    申请日:2023-10-08

    CPC classification number: B25J9/1694 B25J9/1697

    Abstract: A tracking measurement method, apparatus and device for a pose of a tail end of a manipulator. The method comprises: shooting a first calibration board mounted at the tail end of the manipulator by a monocular measurement camera, acquiring multiple sets of first transformation matrices, and mounting the monocular measurement camera on a pitch axis of a pan-tilt; shooting a second calibration board by a global camera, and acquiring multiple sets of second transformation matrices; when a calibration center of the first calibration board is in a center of a field of view of the monocular measurement camera, calculating a measured pose of the tail end of the manipulator; and when the calibration center of the first calibration board deviates from the center of the field of view of the monocular measurement camera, calculating a direction deviation angle, and adjusting the pitch axis and a horizontal axis of the pan-tilt.

    Time optimal speed planning method and system based on constraint classification

    公开(公告)号:US11709467B2

    公开(公告)日:2023-07-25

    申请号:US17991936

    申请日:2022-11-22

    CPC classification number: G05B19/041 G06F17/16

    Abstract: A time optimal speed planning method and system based on constraint classification. The method comprises: reading path information and carrying out curve fitting to obtain a path curve; sampling the path curve, and considering static constraint to obtain a static upper bound value of a speed curve; considering dynamic constraint, and combining the static upper bound value of the speed curve to construct a time optimal speed model; carrying out convex transformation on the time optimal speed model to obtain a convex model; and solving the convex model based on a quadratic sequence planning method to obtain a final speed curve. The system comprises: a path curve module, a static constraint module, a dynamic constraint module, a model transformation module and a solving module.

    Cooperative bonding method for a bonding head of a wire bonding machine and a wire bonding machine

    公开(公告)号:US12237298B1

    公开(公告)日:2025-02-25

    申请号:US18914153

    申请日:2024-10-12

    Abstract: A cooperative bonding method for a bonding head of a wire bonding machine, including setting an initial height value of the vertical lifting mechanism to be a difference value; upon receiving a bonding instruction, controlling the bonding head to perform an positioning operation on the target processing chip, controlling the vertical lifting mechanism to descend a preset distance; during the positioning operation of the bonding head on the target processing chip, when the acceleration motion and the overshoot is completed, controlling the vertical lifting mechanism to rise back; and during the rise back process, the pad of the chip does not exceed a residual vibration curve of the bonding head. This achieves the technical effect of improving the bonding efficiency of the bonding head within a small searching area while avoiding impacts on the chip caused by the overshoot during high acceleration positioning of the bonding head.

    Three-dimensional measurement method and related apparatus

    公开(公告)号:US11823405B1

    公开(公告)日:2023-11-21

    申请号:US18154557

    申请日:2023-01-13

    CPC classification number: G06T7/521 G01C3/02 G06T2207/10028

    Abstract: A three-dimensional measurement method comprises: converting a total number of levels of sawtooth fringes into a Gray code and acquiring a sawtooth slope coefficient; fusing the coefficient into a sawtooth fringe image to generate a target sawtooth fringe pattern; projecting each target sawtooth fringe pattern to a surface of a to-be-measured object through a projector, and collecting a deformed target sawtooth fringe pattern on the surface through a camera; solving a Gray code of each sawtooth fringe collection pattern at each pixel point according to a differential property of adjacent pixels in each sawtooth fringe collection pattern and solving a fringe level and a wrapped phase at each pixel point; calculating an absolute phase at each pixel point according to the fringe level and the wrapped phase at each pixel point, and reconstructing a three-dimensional point cloud through triangulation ranging to obtain a three-dimensional model of the to-be-measured object.

Patent Agency Ranking