-
公开(公告)号:US11331689B1
公开(公告)日:2022-05-17
申请号:US17560464
申请日:2021-12-23
Applicant: GUANGDONG UNIVERSITY OF TECHNOLOGY
Inventor: Yun Chen , Yuanhui Guo , Yixuan Bu , Shuquan Ding , Shengyu Hou , Junyu Long , Xun Chen , Xin Chen , Jian Gao
Abstract: This application relates to an apparatus for producing a graphene film with a thermal manipulation function. The apparatus includes a filter cup, a filter flask, a vacuum pump, a fixing clamp, and a laser. The fixing clamp is configured to clamp a first filter membrane and a second filter membrane. The laser is configured to irradiate the first filter membrane. The first filter membrane and the second filter membrane are arranged stackedly. The filter cup and the filter flask are in snap fit up and down. The first filter membrane and the second filter membrane are arranged between the filter cup and the filter flask. The vacuum pump is in communication with the filter flask. This application also provides a method for producing the graphene film with a thermal manipulation function.
-
2.
公开(公告)号:US11211357B2
公开(公告)日:2021-12-28
申请号:US17037909
申请日:2020-09-30
Applicant: GUANGDONG UNIVERSITY OF TECHNOLOGY
Inventor: Yun Chen , Shuquan Ding , Yunbo He , Maoxiang Hou , Xin Chen , Jian Gao , Ni Zhao , Lanyu Zhang , Zhengping Wang
IPC: H01L23/00 , B23K20/00 , B23K26/34 , B23K37/047 , B23K101/32 , B23K103/00 , B23K103/08 , B23K101/38
Abstract: A method for processing an ultra-high density interconnect wire under light source guidance, comprising preparing a photo-thermal response conductive paste, and putting it into an air pressure injector; driving the air pressure injector; the air pressure injector extrudes the photo-thermal response conductive paste, so that the photo-thermal response conductive paste is connected with the first chip to form an interconnection wire; stopping extruding the photo-thermal response conductive paste, and driving the air pressure injector to pull off the interconnection wire; a linear light source emits light and irradiates on the interconnection wire to bend to an upper side of a second chip bonding pad; an extrusion mechanism presses a free end of the interconnection wire on the second chip bonding pad; the first chip and the second chip are subjected to glue dripping encapsulation.
-
公开(公告)号:US11339316B1
公开(公告)日:2022-05-24
申请号:US17559112
申请日:2021-12-22
Applicant: GUANGDONG UNIVERSITY OF TECHNOLOGY
Inventor: Yun Chen , Xiangyuan Luo , Shuquan Ding , Canguang Lin , Zengguang Gao , Xin Chen , Xun Chen , Jian Gao
Abstract: A method and device for preparing a graphene-based polyethylene glycol phase change material. The method includes: (S1) dispersing carbon black in deionized water to form a carbon black dispersion; immersing polyurethane sponge in the carbon black dispersion; and taking out polyurethane sponge followed by drying to obtain a polyurethane sponge-carbon black combination; (S2) subjecting the polyurethane sponge-carbon black combination to a first electrical discharge machining to obtain a first intermediate; (S3) ultrasonically mixing the first intermediate, polyethylene glycol, and MgO to obtain a second intermediate; (S4) subjecting the second intermediate to a second electrical discharge machining to obtain a third intermediate; (S5) subjecting the third intermediate to acid washing to obtain a fourth intermediate, and drying the fourth intermediate; (S6) injecting polyethylene glycol into the fourth intermediate followed by stirring in a mold and drying to prepare the graphene-based polyethylene glycol phase change material.
-
-