公开(公告)号：US20180006000A1

公开(公告)日：2018-01-04

申请号：US15688844

申请日：2017-08-28

Applicant: Genesis Photonics Inc.

Inventor： Cheng-Yen Chen ,  Yun-Li Li ,  Po-Jen Su

IPC: H01L25/075 ,  H01L23/00 ,  H01L33/62 ,  H01L27/15

CPC classification number: H01L25/0753 ,  H01L24/14 ,  H01L25/04 ,  H01L25/042 ,  H01L25/0655 ,  H01L25/072 ,  H01L25/0756 ,  H01L25/112 ,  H01L25/115 ,  H01L25/117 ,  H01L27/156 ,  H01L27/3209 ,  H01L33/62 ,  H01L2924/12041 ,  H01L2924/00

Abstract: A light source device including a substrate, a plurality of first light emitting diode (LED) chips, and at least one second LED chip is provided. The substrate has an upper surface. The plurality of first LED chips are disposed on the upper surface and electrically connected to the substrate. Each of the first LED chips includes a first chip substrate, a first semiconductor layer, and a plurality of first electrodes, and the first electrodes are disposed on the upper surface of the substrate. The second LED chip is disposed on the upper surface and electrically connected to the substrate. The second LED chip includes a second chip substrate, a second semiconductor layer, and a plurality of second electrodes. A thickness of the second chip substrate is different from than a thickness of the first chip substrate, and the second electrodes are disposed on the upper surface of the substrate.

公开(公告)号：US09153743B2

公开(公告)日：2015-10-06

申请号：US13835367

申请日：2013-03-15

Applicant: Genesis Photonics Inc.

Inventor： Cheng-Hung Lin ,  Yu-Yun Lo ,  Cheng-Yen Chen ,  Yu-Hung Lai

IPC: H01L33/36 ,  H01L33/00 ,  H01L27/15

CPC classification number: H01L33/36 ,  H01L27/15 ,  H01L33/005 ,  H01L33/0095 ,  H01L2933/0025

Abstract: A method of forming light emitting diode dies includes: forming an epitaxial layered structure that defines light emitting units on a front surface of a substrate wafer; forming a photoresist layer over a back surface of the substrate wafer; aligning the substrate wafer and patterning the photoresist layer so as to form openings in the photoresist layer, each of the openings having an area less than a projected area of the respective light emitting unit; forming a solder layer on the photoresist layer such that the solder layer fills the openings in the photoresist layer; removing the photoresist layer and a portion of the solder layer that covers the photoresist layer from the substrate wafer; and dicing the substrate wafer.

Abstract translation: 一种形成发光二极管管芯的方法包括：形成在衬底晶片的前表面上限定发光单元的外延层状结构; 在所述衬底晶片的背面上形成光致抗蚀剂层; 对准衬底晶片并图案化光致抗蚀剂层以在光致抗蚀剂层中形成开口，每个开口具有小于相应发光单元的投影面积的面积; 在光致抗蚀剂层上形成焊料层，使得焊料层填充光致抗蚀剂层中的开口; 从衬底晶片去除光致抗蚀剂层和覆盖光致抗蚀剂层的焊料层的一部分; 并切割衬底晶片。

公开(公告)号：US10224315B2

公开(公告)日：2019-03-05

申请号：US15688844

申请日：2017-08-28

Applicant: Genesis Photonics Inc.

Inventor： Cheng-Yen Chen ,  Yun-Li Li ,  Po-Jen Su

IPC: H01L25/07 ,  H01L25/04 ,  H01L25/11 ,  H01L33/62 ,  H01L27/32 ,  H01L25/075 ,  H01L23/00 ,  H01L27/15 ,  H01L25/065

Abstract: A light source device including a substrate, a plurality of first light emitting diode (LED) chips, and at least one second LED chip is provided. The substrate has an upper surface. The plurality of first LED chips are disposed on the upper surface and electrically connected to the substrate. Each of the first LED chips includes a first chip substrate, a first semiconductor layer, and a plurality of first electrodes, and the first electrodes are disposed on the upper surface of the substrate. The second LED chip is disposed on the upper surface and electrically connected to the substrate. The second LED chip includes a second chip substrate, a second semiconductor layer, and a plurality of second electrodes. A thickness of the second chip substrate is different from than a thickness of the first chip substrate, and the second electrodes are disposed on the upper surface of the substrate.

公开(公告)号：US20160043062A1

公开(公告)日：2016-02-11

申请号：US14886110

申请日：2015-10-19

Applicant: Genesis Photonics Inc.

Inventor： Cheng-Yen Chen ,  Yun-Li Li ,  Po-Jen Su

IPC: H01L25/075 ,  H01L33/62

CPC classification number: H01L25/0753 ,  H01L24/14 ,  H01L27/156 ,  H01L33/62 ,  H01L2924/12041 ,  H01L2924/00

Abstract: A light source device including a substrate, a plurality of first light emitting diode (LED) chips, and at least one second LED chip is provided. The substrate has an upper surface. The plurality of first LED chips are disposed on the upper surface and electrically connected to the substrate. Each of the first LED chips includes a first chip substrate, a first semiconductor layer, and a plurality of first electrodes, and the first electrodes are disposed on the upper surface of the substrate. The second LED chip is disposed on the upper surface and electrically connected to the substrate. The second LED chip includes a second chip substrate, a second semiconductor layer, and a plurality of second electrodes. A thickness of the second chip substrate is different from than a thickness of the first chip substrate, and the second electrodes are disposed on the upper surface of the substrate.

Abstract translation: 提供了包括基板，多个第一发光二极管（LED）芯片和至少一个第二LED芯片的光源装置。 基板具有上表面。 多个第一LED芯片设置在上表面上并电连接到基板。 每个第一LED芯片包括第一芯片基板，第一半导体层和多个第一电极，并且第一电极设置在基板的上表面上。 第二LED芯片设置在上表面上并电连接到基板。 第二LED芯片包括第二芯片基板，第二半导体层和多个第二电极。 第二芯片基板的厚度与第一芯片基板的厚度不同，第二电极设置在基板的上表面。

公开(公告)号：US20150263257A1

公开(公告)日：2015-09-17

申请号：US14715581

申请日：2015-05-18

Applicant: Genesis Photonics Inc.

Inventor： Cheng-Yen Chen ,  Yi-Fan Li ,  Han-Min Wu ,  Kuan-Chieh Huang ,  Tung-Lin Chuang ,  Sheng-Yuan Sun

IPC: H01L33/64 ,  H01L33/50 ,  H01L33/48 ,  H01L33/60

CPC classification number: H01L33/642 ,  F21K9/64 ,  F21V29/74 ,  F21Y2115/10 ,  H01L33/486 ,  H01L33/505 ,  H01L33/60 ,  H01L33/641

Abstract: A light-emitting device of the invention includes a base, at least one light-emitting element, a wavelength transferring cover and a heat-conducting structure. The light-emitting element is disposed on the base and electrically connected to the base. The wavelength transferring cover is disposed on the base and covers the light-emitting element. The heat-conducting structure is disposed on the base and directly contacts the wavelength transferring cover.

Abstract translation: 本发明的发光装置包括基底，至少一个发光元件，波长转移盖和导热结构。 发光元件设置在基座上并电连接到基座。 波长转移盖设置在基座上并覆盖发光元件。 导热结构设置在基座上并直接接触波长传输罩。

公开(公告)号：US20140185270A1

公开(公告)日：2014-07-03

申请号：US14138519

申请日：2013-12-23

Applicant: GENESIS PHOTONICS INC.

Inventor： Cheng-Yen Chen ,  Sheng-Yuan Sun ,  Kuan-Wen Chen ,  Jeng-Jie Huang ,  Chih-Ming Chen

IPC: F21K99/00

CPC classification number: F21V3/062 ,  F21K9/232 ,  F21K9/60 ,  F21V3/02 ,  F21V29/89 ,  F21W2121/00 ,  F21Y2115/10

Abstract: A lighting structure includes a substrate, a light emitting diode, a cover unit, and a hollow column. The substrate has a top surface and a rear surface opposite to the top surface. The light emitting diode is disposed on the top surface and is electrically connected to the substrate. The cover unit is disposed on and cooperates with the substrate to define a receiving space in which the light emitting diode is disposed. The hollow column is connected to the rear surface of the substrate and extends in a vertical direction away from the rear surface. The cover unit and the hollow column respectively have a height in the vertical direction, and the height of the hollow column is 2 times to 10 times the height of the cover unit.

Abstract translation: 照明结构包括基板，发光二极管，盖单元和空心柱。 基板具有与顶表面相对的顶表面和后表面。 发光二极管设置在顶表面上并与基板电连接。 盖单元设置在基板上并与基板配合，以限定其中布置有发光二极管的接收空间。 中空柱连接到基板的后表面并且在垂直方向上远离后表面延伸。 盖单元和中空柱分别具有垂直方向的高度，空心柱的高度是盖单元的高度的2倍至10倍。

公开(公告)号：US09748209B2

公开(公告)日：2017-08-29

申请号：US14886110

申请日：2015-10-19

Applicant: Genesis Photonics Inc.

Inventor： Cheng-Yen Chen ,  Yun-Li Li ,  Po-Jen Su

IPC: H01L25/07 ,  H01L33/62 ,  H01L25/075 ,  H01L23/00 ,  H01L27/15

CPC classification number: H01L25/0753 ,  H01L24/14 ,  H01L27/156 ,  H01L33/62 ,  H01L2924/12041 ,  H01L2924/00

Abstract: A light source device including a substrate, a plurality of first light emitting diode (LED) chips, and at least one second LED chip is provided. The substrate has an upper surface. The plurality of first LED chips are disposed on the upper surface and electrically connected to the substrate. Each of the first LED chips includes a first chip substrate, a first semiconductor layer, and a plurality of first electrodes, and the first electrodes are disposed on the upper surface of the substrate. The second LED chip is disposed on the upper surface and electrically connected to the substrate. The second LED chip includes a second chip substrate, a second semiconductor layer, and a plurality of second electrodes. A thickness of the second chip substrate is different from than a thickness of the first chip substrate, and the second electrodes are disposed on the upper surface of the substrate.

公开(公告)号：US09123872B2

公开(公告)日：2015-09-01

申请号：US14510758

申请日：2014-10-09

Applicant: GENESIS PHOTONICS INC.

Inventor： Cheng-Yen Chen ,  Chun-Chieh Chin ,  Yun-Li Li

IPC: H01L33/52 ,  H01L33/50 ,  H01L33/00 ,  H01L33/48 ,  H01L33/54 ,  H01L33/56 ,  H01L31/0203 ,  H01L51/52 ,  F21K99/00

CPC classification number: H01L33/52 ,  F21K9/90 ,  H01L31/0203 ,  H01L33/005 ,  H01L33/0095 ,  H01L33/48 ,  H01L33/483 ,  H01L33/50 ,  H01L33/501 ,  H01L33/505 ,  H01L33/54 ,  H01L33/56 ,  H01L51/5237 ,  H01L51/524 ,  H01L51/5253 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0058

Abstract: A method of manufacturing package component for light emitting diode (LED) is disclosed. At least one LED is disposed on a substrate inside a photocuring resin, wherein the LED is covered completely by the substrate and the photocuring resin. Power is provided to the LED to make the LED emit plural light beams such that a portion of the photocuring resin is cured by the light beams to obtain a male mold. A separation process is performed to separate the male mold and the other portion of the photocuring resin, the LED and the substrate. A rollover process is performed to manufacture the female mold by the male mold, wherein the female mold has at least one accommodation space with a shape identical to that of the male mold. A forming process is performed to form a package component with a shape identical to that of the male mold.

Abstract translation: 公开了一种制造发光二极管（LED）封装元件的方法。 至少一个LED设置在光固化树脂内的基板上，其中LED被基板和光固化树脂完全覆盖。 LED被提供给LED以使LED发射多个光束，使得光固化树脂的一部分被光束固化以获得阳模。 执行分离处理以分离阳模和光固化树脂，LED和基底的另一部分。 执行翻转过程以通过阳模制造阴模，其中阴模具有至少一个具有与阳模相同形状的容纳空间。 进行成形工序以形成具有与阳模相同形状的包装部件。

公开(公告)号：US09373768B2

公开(公告)日：2016-06-21

申请号：US14280190

申请日：2014-05-16

Applicant: Genesis Photonics Inc.

Inventor： Cheng-Yen Chen ,  Sie-Jhan Wu ,  Po-Jen Su

IPC: H01L33/00 ,  H01L33/62 ,  H01L25/075 ,  H01L33/38 ,  F21K99/00 ,  H01L33/36

CPC classification number: H01L33/62 ,  F21K9/00 ,  H01L25/0753 ,  H01L33/36 ,  H01L33/38 ,  H01L2924/0002 ,  H01L2933/0016 ,  H01L2924/00

Abstract: A flip-chip light-emitting diode (LED) unit includes a substrate, an electrode pad set disposed on the substrate, and three flip-chip LEDs disposed on the electrode pad set in a flip-chip manner and including one first LED and two second LEDs that are spaced apart from the first LED and that are electrically coupled to the first LED in a series configuration.

Abstract translation: 倒装芯片发光二极管（LED）单元包括衬底，设置在衬底上的电极焊盘组和以倒装芯片方式设置在电极焊盘上的三个倒装芯片LED，并且包括一个第一LED和两个 第二LED与第一LED间隔开并且以串联配置电耦合到第一LED。

公开(公告)号：US20140306246A1

公开(公告)日：2014-10-16

申请号：US14248343

申请日：2014-04-09

Applicant: Genesis Photonics Inc.

Inventor： Cheng-Yen Chen ,  Yun-Li Li ,  Po-Jen Su

IPC: H01L27/15

CPC classification number: H01L25/0753 ,  H01L24/14 ,  H01L27/156 ,  H01L33/62 ,  H01L2924/12041 ,  H01L2924/00

Abstract: A light source module including a substrate, a plurality of first light emitting diode (LED) chips, and at least one second LED chip is provided. The substrate has an upper surface. The plurality of first LED chips are disposed on the upper surface and electrically connected to the substrate. The second LED chip is disposed on the upper surface and electrically connected to the substrate. A first distance is between a top surface of each of the first LED chips away from the upper surface of the substrate and the upper surface, a second distance is between a top surface of the second LED chip away from the upper surface of the substrate and the upper surface, and the second distance is greater than each of the first distances.

Abstract translation: 提供了包括基板，多个第一发光二极管（LED）芯片和至少一个第二LED芯片的光源模块。 基板具有上表面。 多个第一LED芯片设置在上表面上并电连接到基板。 第二LED芯片设置在上表面上并电连接到基板。 第一距离在离开基板的上表面的每个第一LED芯片的顶表面和上表面之间，第二距离在距离基板的上表面的第二LED芯片的顶表面之间;第二距离在第二LED芯片的顶表面之间， 上表面和第二距离大于每个第一距离。