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公开(公告)号：US20190157503A1
公开(公告)日：2019-05-23
申请号：US16180027
申请日：2018-11-05
Applicant: Genesis Photonics Inc.
Inventor： Cheng-Wei Hung , Chin-Hua Hung , Xun-Xain Zhan , Chuan-Yu Liu , Yun-Chu Chen , Yu-Feng Lin
Abstract: A light emitting device including a light emitting unit and a phosphor resin layer is provided. The light emitting unit has a top surface and a bottom surface opposite to each other. Each of the light emitting units includes two electrodes. The two electrodes are disposed on the bottom surface. The phosphor resin layer is disposed on the top surface of the light emitting unit. One side of the phosphor resin layer has a mark. One of the two electrodes is closer to the mark with respect to the other one of the two electrodes.
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公开(公告)号：US20180138378A1
公开(公告)日：2018-05-17
申请号：US15787811
申请日：2017-10-19
Applicant: Genesis Photonics Inc.
Inventor： Chin-Hua Hung , Cheng-Wei Hung , Yu-Feng Lin , Cheng-Chuan Chen
CPC classification number: H01L33/56 , H01L25/0753 , H01L33/0075 , H01L33/26 , H01L33/387 , H01L33/507 , H01L33/62 , H01L33/642
Abstract: A light-emitting device includes a substrate, a light-emitting component, a translucent layer, an adhesive layer, a reflective layer and translucent encapsulant. The light-emitting component is disposed on the substrate. The adhesive layer is formed between the light-emitting component and the translucent layer. The reflective layer is formed above the substrate and covering a lateral surface of the light-emitting component, a lateral surface of the adhesive layer and a lateral surface of the translucent layer. The translucent encapsulant is formed on the substrate and encapsulating the light-emitting component, the translucent layer and the reflective layer.
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公开(公告)号：US20150325762A1
公开(公告)日：2015-11-12
申请号：US14695003
申请日：2015-04-23
Applicant: Genesis Photonics Inc.
Inventor： Shou-Wen Hsu , Yu-Feng Lin , Cheng-Bin Liu , Tai-Cheng Tsai , Chin-Hua Hung
IPC: H01L33/62 , H01L29/866 , H01L27/15
CPC classification number: H01L23/00 , H01L24/13 , H01L24/16 , H01L24/81 , H01L25/167 , H01L27/15 , H01L29/866 , H01L33/52 , H01L33/62 , H01L2224/05611 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/1329 , H01L2224/13439 , H01L2224/16227 , H01L2224/81099 , H01L2224/81191 , H01L2224/81805 , H01L2224/81855 , H01L2924/12035 , H01L2924/12041 , H01L2933/0066 , H01L2924/0105 , H01L2924/00014 , H01L2924/0665
Abstract: A package structure and a manufacturing method thereof are disclosed. The package structure includes: a substrate; at least one light emitting diode disposed on the substrate by eutectic bonding; and at least one Zener diode disposed on the substrate by at least one silver glue. The method of manufacturing the package structure includes: providing a substrate; performing a eutectic bonding process to dispose at least one light emitting diode on the substrate; and performing a silver glue bonding process at room temperature to dispose at least one Zener diode on the substrate.
Abstract translation: 公开了一种封装结构及其制造方法。 封装结构包括：衬底; 至少一个发光二极管通过共晶接合设置在基板上; 以及至少一个齐纳二极管，其通过至少一个银胶布置在所述基板上。 制造封装结构的方法包括：提供衬底; 执行共晶接合工艺以在衬底上设置至少一个发光二极管; 并在室温下进行银胶接合处理，以在衬底上设置至少一个齐纳二极管。
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公开(公告)号：US10910523B2
公开(公告)日：2021-02-02
申请号：US16004445
申请日：2018-06-11
Applicant: Genesis Photonics Inc.
Inventor： Cheng-Wei Hung , Chin-Hua Hung , Long-Chi Du , Jui-Fu Chang , Po-Tsun Kuo , Hao-Chung Lee , Yu-Feng Lin
IPC: H01L33/50 , H01L33/46 , H01L33/56 , H01L33/38 , H01L21/56 , H01L23/00 , H01L21/683 , H01L25/075
Abstract: A light emitting device includes a wavelength conversion layer, at least one light emitting unit and a reflective protecting element. The wavelength conversion layer has an upper surface and a lower surface opposite to each other. The light emitting unit has two electrode pads located on the same side of the light emitting unit. The light emitting unit is disposed on the upper surface of the wavelength conversion layer and exposes the two electrode pads. The reflective protecting element encapsulates at least a portion of the light emitting unit and a portion of the wavelength conversion layer, and exposes the two electrode pads of the light emitting unit.
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公开(公告)号：US20180211942A1
公开(公告)日：2018-07-26
申请号：US15924461
申请日：2018-03-19
Applicant: Genesis Photonics Inc.
Inventor： Cheng-Wei Hung , Jui-Fu Chang , Chin-Hua Hung , Yu-Feng Lin
IPC: H01L25/075 , H01L33/60 , H01L33/50
CPC classification number: H01L25/0753 , H01L33/486 , H01L33/502 , H01L33/505 , H01L33/508 , H01L33/54 , H01L33/56 , H01L33/60 , H01L33/62 , H01L2224/16225 , H01L2933/0033 , H01L2933/0041 , H01L2933/005 , H01L2933/0058
Abstract: A light-emitting device includes a substrate, a light-emitting component, a wavelength conversion component, an adhesive and a reflective layer. The light-emitting component is disposed on the substrate. The wavelength conversion component includes a high-density phosphor layer and a lower-density phosphor layer. The adhesive is formed between the light-emitting device and the high-density phosphor layer. The reflective layer is formed above the substrate and covers a lateral surface of the light-emitting component, a lateral surface of the adhesive and a lateral surface of the wavelength conversion component.
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Patent Agency Ranking
公开(公告)号：US09997676B2
公开(公告)日：2018-06-12
申请号：US15268654
申请日：2016-09-19
Applicant: Genesis Photonics Inc.
Inventor： Cheng-Wei Hung , Chin-Hua Hung , Long-Chi Du , Jui-Fu Chang , Po-Tsun Kuo , Hao-Chung Lee , Yu-Feng Lin
CPC classification number: H01L33/502 , H01L21/568 , H01L25/0753 , H01L33/38 , H01L33/46 , H01L33/50 , H01L33/504 , H01L33/508 , H01L33/56 , H01L2224/04105 , H01L2224/18 , H01L2224/19 , H01L2224/32225 , H01L2224/73267 , H01L2224/9222 , H01L2224/96 , H01L2224/97 , H01L2924/12041 , H01L2924/18162 , H01L2933/0016 , H01L2933/0025 , H01L2933/0041 , H01L2933/005 , H01L2224/83
Abstract: A light emitting device includes a wavelength conversion layer, at least one light emitting unit and a reflective protecting element. The wavelength conversion layer has an upper surface and a lower surface opposite to each other. The light emitting unit has two electrode pads located on the same side of the light emitting unit. The light emitting unit is disposed on the upper surface of the wavelength conversion layer and exposes the two electrode pads. The reflective protecting element encapsulates at least a portion of the light emitting unit and a portion of the wavelength conversion layer, and exposes the two electrode pads of the light emitting unit.
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公开(公告)号：US09685596B2
公开(公告)日：2017-06-20
申请号：US14690480
申请日：2015-04-20
Applicant: Genesis Photonics Inc.
Inventor： Chin-Hua Hung , Hao-Chung Lee , Yu-Feng Lin
CPC classification number: H01L33/508 , H01L33/504 , H01L33/52 , H01L2933/0041 , H01L2933/005
Abstract: A package method includes steps of providing a light emitting module, a mold and a molding compound, wherein the light emitting module includes a substrate and at least one light emitting unit disposed on the substrate, the mold has at least one recess, and a side wall of the recess is parallel to a side surface of the light emitting unit; filling the recess with the molding compound; placing the substrate on the mold reversely, so that the light emitting unit is immersed into the recess and the molding compound directly encapsulates the light emitting unit; and heating and pressing the substrate and the mold, so as to solidify the molding compound.
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公开(公告)号：US20170005238A1
公开(公告)日：2017-01-05
申请号：US15268654
申请日：2016-09-19
Applicant: Genesis Photonics Inc.
Inventor： Cheng-Wei Hung , Chin-Hua Hung , Long-Chi Du , Jui-Fu Chang , Po-Tsun Kuo , Hao-Chung Lee , Yu-Feng Lin
CPC classification number: H01L33/502 , H01L21/568 , H01L25/0753 , H01L33/38 , H01L33/46 , H01L33/50 , H01L33/504 , H01L33/508 , H01L33/56 , H01L2224/04105 , H01L2224/18 , H01L2224/19 , H01L2224/32225 , H01L2224/73267 , H01L2224/9222 , H01L2224/96 , H01L2224/97 , H01L2924/12041 , H01L2924/18162 , H01L2933/0016 , H01L2933/0025 , H01L2933/0041 , H01L2933/005 , H01L2224/83
Abstract: A light emitting device includes a wavelength conversion layer, at least one light emitting unit and a reflective protecting element. The wavelength conversion layer has an upper surface and a lower surface opposite to each other. The light emitting unit has two electrode pads located on the same side of the light emitting unit. The light emitting unit is disposed on the upper surface of the wavelength conversion layer and exposes the two electrode pads. The reflective protecting element encapsulates at least a portion of the light emitting unit and a portion of the wavelength conversion layer, and exposes the two electrode pads of the light emitting unit.
Abstract translation: 发光器件包括波长转换层，至少一个发光单元和反射保护元件。 波长转换层具有彼此相对的上表面和下表面。 发光单元具有位于发光单元的同一侧的两个电极焊盘。 发光单元设置在波长转换层的上表面上，并露出两个电极焊盘。 反射保护元件封装发光单元的至少一部分和波长转换层的一部分，并且曝光发光单元的两个电极焊盘。
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9.发明申请公开(公告)号：US20160276543A1
公开(公告)日：2016-09-22
申请号：US15073710
申请日：2016-03-18
Applicant: Genesis Photonics Inc.
Inventor： Chin-Hua Hung , Yu-Feng Lin
IPC: H01L33/48 , H01L23/60 , H01L29/866 , H01L33/60 , H01L33/62
CPC classification number: H01L25/0655 , H01L23/562 , H01L23/60 , H01L25/0657 , H01L25/0753 , H01L25/0756 , H01L27/0248 , H01L27/15 , H01L29/866 , H01L33/08 , H01L33/10 , H01L33/48 , H01L33/486 , H01L33/50 , H01L33/502 , H01L33/508 , H01L33/52 , H01L33/56 , H01L33/60 , H01L33/642 , H01L33/647 , H01L2224/16225 , H01L2224/48091 , H01L2224/49107 , H01L2924/18161 , H01L2933/0025 , H01L2933/0033 , H01L2933/0041 , H01L2933/0058 , H01L2924/00014
Abstract: A light emitting diode package structure and a manufacturing method thereof are disclosed. The light emitting diode package structure includes a carrier substrate, a electrostatic protection component, and a light-emitting diode (LED). The carrier substrate has a first conductive pad and a second conductive pad. The electrostatic protection component is disposed on the carrier substrate and has a first electrode and a second electrode, wherein the first electrode and the second electrode are electrically connected to the first conductive pad and the second conductive pad respectively. The LED is disposed on the electrostatic protection component and has a third electrode and a fourth electrode, wherein the third electrode and the fourth electrode are electrically connected to the first conductive pad and the second conductive pad respectively.
Abstract translation: 公开了一种发光二极管封装结构及其制造方法。 发光二极管封装结构包括载体衬底，静电保护组件和发光二极管（LED）。 载体衬底具有第一导电焊盘和第二导电焊盘。 静电保护部件设置在载体基板上，并且具有第一电极和第二电极，其中第一电极和第二电极分别电连接到第一导电焊盘和第二导电焊盘。 LED设置在静电保护部件上，并且具有第三电极和第四电极，其中第三电极和第四电极分别电连接到第一导电焊盘和第二导电焊盘。
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公开(公告)号：US10090445B2
公开(公告)日：2018-10-02
申请号：US15627430
申请日：2017-06-19
Applicant: GENESIS PHOTONICS INC.
Inventor： Chin-Hua Hung , Hao-Chung Lee , Yu-Feng Lin
Abstract: A package method includes steps of providing a light emitting module, a mold and a molding compound, wherein the light emitting module includes a substrate and at least one light emitting unit disposed on the substrate, the mold has at least one recess, and a side wall of the recess is parallel to a side surface of the light emitting unit; filling the recess with the molding compound; placing the substrate on the mold reversely, so that the light emitting unit is immersed into the recess and the molding compound directly encapsulates the light emitting unit; and heating and pressing the substrate and the mold, so as to solidify the molding compound.
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