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公开(公告)号：US20180374998A1
公开(公告)日：2018-12-27
申请号：US16102691
申请日：2018-08-13
Applicant: Genesis Photonics Inc.
Inventor： Shao-Ying Ting , Kuan-Chieh Huang , Jing-En Huang , Yu-Feng Lin , Yi-Ru Huang
Abstract: A light emitting device includes a light emitting unit, a light transmissive layer and an encapsulant. The light emitting unit includes a substrate, an epitaxial structure layer disposed on the substrate, and a first electrode and a second electrode disposed on the same side of the epitaxial structure layer, respectively. The light emitting unit is disposed on the light transmissive layer and at least a part of the first electrode and a part of the second electrode are exposed by the light transmissive layer. The encapsulant encapsulates the light emitting unit and at least exposes a part of the first electrode and a part of the second electrode. Each of the first electrode and the second electrode extends outward from the epitaxial structure layer, and covers at least a part of an upper surface of the encapsulant, respectively.
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公开(公告)号：US20180151545A1
公开(公告)日：2018-05-31
申请号：US15878592
申请日：2018-01-24
Applicant: Genesis Photonics Inc.
Inventor： Yi-Ru Huang , Shao-Ying Ting , Kuan-Chieh Huang , Jing-En Huang
IPC: H01L25/075
CPC classification number: H01L25/0753 , H01L33/0079 , H01L33/44 , H01L33/62 , H01L33/647 , H01L2224/16145 , H01L2224/4813 , H01L2224/48464 , H01L2224/73265
Abstract: A light-emitting device and a light-emitting module using the same are provided. The light-emitting device includes a substrate module and a light-emitting component. The substrate module includes a substrate, a first conductive layer, an insulation layer and a second conductive layer. The substrate has an upper surface. The insulation layer is formed on the upper surface of the substrate, separates the substrate and the first conductive layer and has an opening. The second conductive layer connects to the upper surface of the substrate and is separated from the first conductive layer. The light-emitting component is disposed on the substrate module and electrically connected to the first conductive layer and the second conductive layer.
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公开(公告)号：US20160013358A1
公开(公告)日：2016-01-14
申请号：US14474283
申请日：2014-09-01
Applicant: Genesis Photonics Inc.
Inventor： Shao-Ying Ting , Kuan-Chieh Huang , Jing-En Huang , Yi-Ru Huang , Sie-Jhan Wu , Long-Lin Ke
IPC: H01L33/00
CPC classification number: H01L33/0095 , H01L25/0753 , H01L27/15 , H01L33/005 , H01L33/08 , H01L33/486 , H01L33/50 , H01L33/502 , H01L33/507 , H01L33/52 , H01L33/62 , H01L33/64 , H01L2224/04105 , H01L2224/18 , H01L2224/19 , H01L2224/24137 , H01L2924/0002 , H01L2933/0016 , H01L2933/0041 , H01L2933/005 , H01L2933/0066 , H05B33/0803 , H05B33/0806 , H05B33/0827 , H01L2924/00
Abstract: A method for manufacturing a light emitting unit is provided. A semiconductor structure including a plurality of light emitting dice separated from each other is provided. A molding compound is formed to encapsulate the light emitting dice. Each of the light emitting dice includes a light emitting element, a first electrode and a second electrode. A patterned metal layer is formed on the first electrodes and the second electrodes of the light emitting dice. A substrate is provided, where the molding compound is located between the substrate and the light emitting elements of the light emitting dice. A cutting process is performed to cut the semiconductor structure, the patterned metal layer, the molding compound and the substrate so as to define a light emitting unit with a series connection loop, a parallel connection loop or a series-parallel connection loop.
Abstract translation: 提供一种制造发光单元的方法。 提供包括彼此分离的多个发光骰子的半导体结构。 形成模塑料以封装发光管芯。 每个发光管芯包括发光元件，第一电极和第二电极。 在第一电极和发光管芯的第二电极上形成图案化的金属层。 提供了一种基板，其中模塑料位于基板和发光芯片的发光元件之间。 执行切割处理以切割半导体结构，图案化金属层，模制化合物和基板，以便限定具有串联连接环路，并联连接环路或串联 - 并联连接环路的发光单元。
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公开(公告)号：US20160005922A1
公开(公告)日：2016-01-07
申请号：US14536676
申请日：2014-11-09
Applicant: Genesis Photonics Inc.
Inventor： Kuan-Chieh Huang , Shao-Ying Ting , Tung-Lin Chuang , Jing-En Huang , Yi-Ru Huang
Abstract: A light emitting component includes a light emitting unit, a phosphor layer and a distributed Bragg reflector layer. The phosphor layer is disposed on the light emitting unit and the distributed Bragg reflector layer is disposed above the phosphor layer. The distributed Bragg reflector layer is formed by at least two materials with different refractive indices.
Abstract translation: 发光部件包括发光单元，荧光体层和分布布拉格反射器层。 荧光体层设置在发光单元上，分布式布拉格反射层设置在荧光体层的上方。 分布式布拉格反射层由具有不同折射率的至少两种材料形成。
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公开(公告)号：US09184360B2
公开(公告)日：2015-11-10
申请号：US14715581
申请日：2015-05-18
Applicant: Genesis Photonics Inc.
Inventor： Cheng-Yen Chen , Yi-Fan Li , Han-Min Wu , Kuan-Chieh Huang , Tung-Lin Chuang , Sheng-Yuan Sun
CPC classification number: H01L33/642 , F21K9/64 , F21V29/74 , F21Y2115/10 , H01L33/486 , H01L33/505 , H01L33/60 , H01L33/641
Abstract: A light-emitting device of the invention includes a base, at least one light-emitting element, a wavelength transferring cover and a heat-conducting structure. The light-emitting element is disposed on the base and electrically connected to the base. The wavelength transferring cover is disposed on the base and covers the light-emitting element. The heat-conducting structure is disposed on the base and directly contacts the wavelength transferring cover.
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Patent Agency Ranking
公开(公告)号：US20150287893A1
公开(公告)日：2015-10-08
申请号：US14676821
申请日：2015-04-02
Applicant: Genesis Photonics Inc.
Inventor： Kuan-Chieh Huang , Chun-Ming Tseng , Wen-Jie Lu , Tsung-Tse Wu , Wei-Ling Su , Kuan-Yung Liao , Gwo-Jiun Sheu
CPC classification number: H01L33/507 , H01L33/54 , H01L2933/0091
Abstract: A package material for packaging a photoelectric device includes a first molding portion and a second molding portion. The first molding portion is disposed on the photoelectric device. The first molding portion includes a first molding compound and a plurality of nano-scale metal oxide particles, wherein the nano-scale metal oxide particles are doped in the first molding compound. The second molding portion is disposed on the first molding portion and away from the photoelectric device. The second molding portion includes a second molding compound and a plurality of submicron-scale metal oxide particles, wherein the submicron-scale metal oxide particles are doped in the second molding compound. A whole refractive index of the first molding portion is larger than a whole refractive index of the second molding portion.
Abstract translation: 用于封装光电装置的封装材料包括第一模制部分和第二模塑部分。 第一模制部分设置在光电装置上。 第一成型部分包括第一模塑料和多种纳米级金属氧化物颗粒，其中纳米级金属氧化物颗粒掺杂在第一模塑料中。 第二模制部分设置在第一模制部分上并远离光电装置。 第二成型部分包括第二模塑料和多个亚微米级金属氧化物颗粒，其中亚微米级金属氧化物颗粒掺杂在第二模塑料中。 第一成型部分的整体折射率大于第二成型部分的整体折射率。
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公开(公告)号：US10396255B2
公开(公告)日：2019-08-27
申请号：US15823480
申请日：2017-11-27
Applicant: Genesis Photonics Inc.
Inventor： Kuan-Chieh Huang , Shao-Ying Ting , Jing-En Huang , Yi-Ru Huang
Abstract: A light emitting component includes a light emitting unit, a molding compound and a wavelength converting layer. The light emitting unit has a forward light emitting surface. The molding compound covers the light emitting unit. The wavelength converting layer is disposed above the molding compound. The wavelength converting layer has a first surface and a second surface opposite to the first surface, wherein the first surface is located between the forward light emitting surface and the second surface, and at least one of the first and second surfaces is non-planar.
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公开(公告)号：US20180337310A1
公开(公告)日：2018-11-22
申请号：US16049771
申请日：2018-07-30
Applicant: Genesis Photonics Inc.
Inventor： Yi-Ru Huang , Tung-Lin Chuang , Yan-Ting Lan , Sheng-Tsung Hsu , Chih-Ming Shen , Jing-En Huang , Teng-Hsien Lai , Hung-Chuan Mai , Kuan-Chieh Huang , Shao-Ying Ting
Abstract: A light emitting diode including a first-type semiconductor layer, an emitting layer, a second-type semiconductor layer, a first electrode, a second electrode, and a Bragg reflector structure. The emitting layer is configured to emit a light beam and is located between the first-type semiconductor layer and the second-type semiconductor layer. The light beam has a peak wavelength in a light emitting wavelength range. The first-type semiconductor layer, the emitting layer, and the second-type semiconductor layer are located on a same side of the Bragg reflector structure. A reflectance of the Bragg reflector structure is greater than or equal to 95% in a reflective wavelength range at least covering 0.8X nm to 1.8X nm, and X is the peak wavelength of the light emitting wavelength range.
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公开(公告)号：US20160329461A1
公开(公告)日：2016-11-10
申请号：US15135573
申请日：2016-04-22
Applicant: Genesis Photonics Inc.
Inventor： Yi-Ru Huang , Tung-Lin Chuang , Yan-Ting Lan , Sheng-Tsung Hsu , Chih-Ming Shen , Jing-En Huang , Teng-Hsien Lai , Hung-Chuan Mai , Kuan-Chieh Huang , Shao-Ying Ting , Cheng-Pin Chen , Wei-Chen Chien , Chih-Chin Cheng , Chih-Hung Tseng
CPC classification number: H01L33/38 , H01L33/36 , H01L33/382 , H01L33/385 , H01L33/387 , H01L33/405 , H01L33/46 , H01L33/465 , H01L33/60
Abstract: The invention provides an LED including a first-type semiconductor layer, an emitting layer, a second-type semiconductor layer, a first electrode, a second electrode, a Bragg reflector structure, a conductive layer and insulation patterns. The first electrode and the second electrode are located on the same side of the Bragg reflector structure. The conductive layer is disposed between the Bragg reflector structure and the second-type semiconductor layer. The insulation patterns are disposed between the conductive layer and the second-type semiconductor layer. Each insulating layer has a first surface facing toward the second-type semiconductor layer, a second surface facing away from the second-type semiconductor layer, and an inclined surface. The inclined surface connects the first surface and the second surface and is inclined with respect to the first surface and the second surface.
Abstract translation: 本发明提供一种包括第一类型半导体层，发光层，第二类型半导体层，第一电极，第二电极，布拉格反射器结构，导电层和绝缘图案的LED。 第一电极和第二电极位于布拉格反射器结构的同一侧。 导电层设置在布拉格反射器结构和第二类型半导体层之间。 绝缘图案设置在导电层和第二类型半导体层之间。 每个绝缘层具有面向第二类型半导体层的第一表面，背离第二类型半导体层的第二表面和倾斜表面。 倾斜表面连接第一表面和第二表面，并且相对于第一表面和第二表面倾斜。
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公开(公告)号：US20160307880A1
公开(公告)日：2016-10-20
申请号：US15131143
申请日：2016-04-18
Applicant: Genesis Photonics Inc.
Inventor： Yi-Ru Huang , Shao-Ying Ting , Kuan-Chieh Huang , Jing-En Huang
IPC: H01L25/075 , H01L33/48 , H01L33/38 , H01L33/62 , H01L33/54
CPC classification number: H01L25/0753 , H01L33/0079 , H01L33/44 , H01L33/62 , H01L33/647 , H01L2224/16145 , H01L2224/4813 , H01L2224/48464 , H01L2224/73265
Abstract: A light-emitting device and a light-emitting module using the same are provided. The light-emitting device includes a substrate module and a light-emitting component. The substrate module includes a substrate, a first conductive layer, an insulation layer and a second conductive layer. The substrate has an upper surface. The insulation layer is formed on the upper surface of the substrate, separates the substrate and the first conductive layer and has an opening. The second conductive layer connects to the upper surface of the substrate and is separated from the first conductive layer. The light-emitting component is disposed on the substrate module and electrically connected to the first conductive layer and the second conductive layer.
Abstract translation: 提供了一种发光装置和使用其的发光模块。 发光装置包括基板模块和发光部件。 衬底模块包括衬底，第一导电层，绝缘层和第二导电层。 基板具有上表面。 绝缘层形成在基板的上表面上，分离基板和第一导电层并具有开口。 第二导电层连接到衬底的上表面并与第一导电层分离。 发光部件设置在基板模块上并电连接到第一导电层和第二导电层。
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