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    Method for manufacturing light emitting unit
    1.
    发明授权
    Method for manufacturing light emitting unit 有权

    公开(公告)号：US10573779B2

    公开(公告)日：2020-02-25

    申请号：US16231914

    申请日：2018-12-24

    Applicant: Genesis Photonics Inc.

    Inventor： Shao-Ying Ting ,  Kuan-Chieh Huang ,  Jing-En Huang ,  Yi-Ru Huang ,  Sie-Jhan Wu ,  Long-Lin Ke

    IPC: H01L33/00 ,  H01L33/62 ,  H01L33/08 ,  H01L33/50 ,  H01L33/52 ,  H01L25/075 ,  H05B33/08 ,  H01L33/48 ,  H01L33/64 ,  H01L27/15

    Abstract: A method for manufacturing a light emitting unit is provided. A semiconductor structure including a plurality of light emitting dice separated from each other is provided. A molding compound is formed to encapsulate the light emitting dice. Each of the light emitting dice includes a light emitting element, a first electrode and a second electrode. A patterned metal layer is formed on the first electrodes and the second electrodes of the light emitting dice. A substrate is provided, where the molding compound is located between the substrate and the light emitting elements of the light emitting dice. A cutting process is performed to cut the semiconductor structure, the patterned metal layer, the molding compound and the substrate so as to define a light emitting unit with a series connection loop, a parallel connection loop or a series-parallel connection loop.

    LIGHT EMITTING UNIT AND LIGHT EMITTING MODULE
    6.
    发明申请
    LIGHT EMITTING UNIT AND LIGHT EMITTING MODULE 审中-公开
    发光单元和发光模块

    公开(公告)号：US20160013384A1

    公开(公告)日：2016-01-14

    申请号：US14474277

    申请日：2014-09-01

    Applicant: Genesis Photonics Inc.

    Inventor： Shao-Ying Ting ,  Kuan-Chieh Huang ,  Jing-En Huang ,  Yi-Ru Huang ,  Sie-Jhan Wu ,  Long-Lin Ke

    IPC: H01L33/62 ,  H01L33/54 ,  H01L33/50 ,  H01L25/075

    CPC classification number: H01L25/0753 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/24137

    Abstract: A light emitting unit includes multiple light emitting dice, a molding compound, a substrate and a patterned metal layer. Each of the light emitting dice includes a light emitting component, a first electrode and a second electrode. The molding compound encapsulates the light emitting dice and exposes a first surface of the first electrode and a second surface of the second electrode of each of the light emitting dice. The molding compound is located between the substrate and the light emitting dice. The patterned metal layer is disposed on the first surface of the first electrode and the second surface of the second electrode of each of the light emitting dice. The light emitting dice are electrically connected to each other in a series connection, a parallel connection or a series-parallel connection by the patterned metal layer.

    Abstract translation: 发光单元包括多个发光骰子，模制化合物，基底和图案化的金属层。 每个发光管芯包括发光部件，第一电极和第二电极。 模制化合物封装发光管芯并暴露第一电极的第一表面和每个发光管芯的第二电极的第二表面。 模塑料位于基板和发光管之间。 图案化的金属层设置在第一电极的第一表面和每个发光管的第二电极的第二表面上。 发光管芯通过图案化的金属层串联连接，并联连接或串联并联连接。

    Method for manufacturing light emitting unit
    7.
    发明授权
    Method for manufacturing light emitting unit 有权

    公开(公告)号：US10164145B2

    公开(公告)日：2018-12-25

    申请号：US15859714

    申请日：2018-01-01

    Applicant: Genesis Photonics Inc.

    Inventor： Shao-Ying Ting ,  Kuan-Chieh Huang ,  Jing-En Huang ,  Yi-Ru Huang ,  Sie-Jhan Wu ,  Long-Lin Ke

    IPC: H01L33/00 ,  H01L33/62 ,  H01L33/08 ,  H01L33/50 ,  H01L33/52 ,  H01L25/075 ,  H05B33/08 ,  H01L33/48 ,  H01L33/64 ,  H01L27/15

    Abstract: A method for manufacturing a light emitting unit is provided. A semiconductor structure including a plurality of light emitting dice separated from each other is provided. A molding compound is formed to encapsulate the light emitting dice. Each of the light emitting dice includes a light emitting element, a first electrode and a second electrode. A patterned metal layer is formed on the first electrodes and the second electrodes of the light emitting dice. A substrate is provided, where the molding compound is located between the substrate and the light emitting elements of the light emitting dice. A cutting process is performed to cut the semiconductor structure, the patterned metal layer, the molding compound and the substrate so as to define a light emitting unit with a series connection loop, a parallel connection loop or a series-parallel connection loop.

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